BRIEF DESCRIPTION OF THE DRAWINGS
Referring now to the attached drawings which form a part of this original disclosure.
FIG. 1 is a layout of a semiconductor device of the present invention.
FIG. 2 is a cross-sectional view in a cross section II-II of the semiconductor device shown in FIG. 1.
FIG. 3 is a cross-sectional view in a cross section III-III of the semiconductor device shown in FIG. 1.
FIGS. 4A to 4C are cross-sectional views showing a method configured to manufacture the semiconductor device.
FIGS. 5A to 5D are cross-sectional views showing the method configured to manufacture the semiconductor device.
FIG. 6 is a layout of a semiconductor device in accordance with a first embodiment of the present invention.
FIG. 7 is a cross-sectional view in a cross section VII-VII of the semiconductor device in accordance with the first embodiment shown in FIG. 6.
FIG. 8 is a cross-sectional view in a cross section VIII-VIII of the semiconductor device in accordance with the first embodiment shown in FIG. 6.
FIGS. 9A to 9D are cross-sectional views showing a method configured to manufacture the semiconductor device in accordance with the first embodiment.
FIGS. 10A to 10C are cross-sectional views showing the method configured to manufacture the semiconductor device in accordance with the first embodiment.
FIG. 11 is a layout of a semiconductor device in accordance with a second embodiment of the present invention.
FIG. 12 is a cross-sectional view in a cross section XII-XII of the semiconductor device in accordance with the second embodiment shown in FIG. 11.
FIG. 13 is a cross-sectional view in a cross section XIII-XIII of the semiconductor device in accordance with the second embodiment shown in FIG. 11.
FIG. 14 is a cross-sectional view in a cross section XIV-XIV of the semiconductor device in accordance with the second embodiment shown in FIG. 11.
FIG. 15 is a cross-sectional perspective view showing the method configured to manufacture the semiconductor device in accordance with the second embodiment.
FIGS. 16A and 16B are cross-sectional views showing the method configured to manufacture the semiconductor device in accordance with the second embodiment.
FIGS. 17A to 17C are cross-sectional views showing the method configured to manufacture the semiconductor device in accordance with the second embodiment.