Patent Application
20140287605
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2013-061740, filed on Mar. 25, 2013, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate to a semiconductor device.
There is a semiconductor device that is a connector product composed of a case connected to a USB connector and a detachable cap to protect the USB connector.
According to one embodiment, a semiconductor device includes a case, a connector, and a cap. The case includes a first main surface, a second main surface opposite to the first main surface, a first concave portion provided with at least one of the first main surface and the second main surface, and a semiconductor memory housed inside. The connector is connected to the case. The cap includes a third main surface, a fourth main surface opposite to the third main surface, a locking portion provided with at least one of the third main surface and the fourth main surface which is locked with the first concave portion, and a side surface provided with an opening portion opening between the third main surface and the fourth main surface.
Hereinafter, a plurality of further embodiments will be described with reference to the drawings. In the drawings, the same symbols indicate the same or similar portions.
A semiconductor device according to a first embodiment will be described with reference to
As shown in
The case 2 has the first main surface 2a, the second main surface 2b, a first side surface 2c and a second side surface 2d. The second main surface 2b is a surface opposite to the first main surface 2a. The second side surface 2d is a surface opposite to the first side surface 2c. The case 2 has a strap hole 8 at the other end side of the memory housing portion 61. A strap or a key holder is attached in the strap hole 8, and thereby the semiconductor device 1 can improve the designability.
The cap connecting portion 62 retreats from the memory housing portion 61 at the first side surface 2c by a distance D11. The USB connector 3 retreats from the cap connecting portion 62 at the first side surface 2c by a distance D12, and retreats from the cap connecting portion 62 at the second side surface 2d by a distance D13. Here, in the cap connecting portion 62, the first side surface 2c retreats from the memory housing portion 61 by the distance D11, but the second side surface 2d may retreat from the memory housing portion 61 by the distance D11.
At the one end side of the cap connecting portion 62, a first concave portion 5 which contacts the one end of the memory housing portion 61 is provided. The first concave portions 5 are provided at the first main surface 2a and the second main surface 2b of the case 2 in the width direction (in the longitudinal direction in
Next, the cap 4 will be described. The cap 4 is detachable from the case 2, and functions to protect the USB connector 3 from the external mechanical stress and electrical contact. When the cap 4 is mounted on the case 2, a third main surface 4a and a fourth main surface 4b of the cap 4 are respectively on the same plane as the first main surface 2a and the second main surface 2b of the case 2.
As shown in
As shown in
When the cap 4 is mounted on the case 2, it is desirable that the length of the whole cap 4 in the inserting/extracting direction of the USB connector 3 is short in accordance with the length from the first concave portions 5 to the tip portion of the USB connector 3. By this means, the third main surface 4a and the fourth main surface 4b of the cap 4 become difficult to bow. That is, since the width of the opening portion 30 is difficult to widen, the cap 4 is difficult to come off from the case 2.
In
In addition, though the side surface 4d side of the cap 4 opens, without being limited to the third side surface 4c, the third main surface 4a side may open. The both sides of the third side surface 4c side and the fourth side surface 4d side may open. It is only necessary that the opening portion 30 at the third side surface 4c side of the cap 4 has a width enough to insert the USB connector 3, and the opening 30 may not be completely opened.
The effect of the embodiment is described as below. The locking portions 6 are provided in the cap 4 of the semiconductor device 1 of the embodiment. The attaching and detaching of the cap 4 is performed by sliding the locking portions 6 along on the first concave portions 5. The semiconductor device 1 can reduce the abrasion of the locking portions 6 by friction which is caused by repeatedly performing the attaching and detaching of the cap 4, and thereby it is able to keep the holding power between the cap 4 and case 2 for a long time.
When usually a strap is attached into the strap hole 8, the strap works as a weight, at the time of carrying the semiconductor device 1, and thereby the cap 4 might be pulled out in the inserting/extracting direction of the USB connector 3. On the other hand, since the cap 4 of the embodiment has the structure that the cap 4 does not come off in the inserting/extracting direction of the USB connector 3, it is able to prevent that the cap 4 comes off from the case 2 by the power applied in the inserting/extracting direction of the USB connector 3. Since the locking portions 6 and the first concave portions 5 are provided, the case 2 contacts the cap 4 on a wide surface, and can firmly hold the cap 4. For this reason, in the semiconductor device 1 of the embodiment, it is able to prevent loss of the cap 4, and to protect the USB connector 3 stably for a long time.
A semiconductor device of a first modification will be described with reference of
In the cap 41, the locking portions 6 are provided by the number corresponding to the number of the first concave portions 5 of the case 21. In the first modification, the first concave portions 5 are increased on the same plane, and the positions into which the locking portions 6 are respectively fitted are increased, and thereby the cap 41 becomes difficult to come off from the case 21. For this reason, the effect to prevent loss of the cap 4 can further be improved.
A semiconductor device of a second modification will be described with reference of
In the cap 42, the locking portion 6 corresponding to the third concave portion 9 is provided higher compared with the region of the first concave portion 5. When the cap 42 is mounted on the case 22, the cap 42 becomes difficult to come off from the case 22. For this reason, the effect to prevent loss of the cap 42 can be improved. In addition, the third concave portion 9 may be provided only at any one of the first main surface 2a and the second main surface 2b of the case 22.
A semiconductor device according to a second embodiment will be described with reference of
As shown in
In the cap connecting portion 65 of the case 23, the second concave portions 7 adjacent to the respective first concave portions 5 are provided. The depth of the second concave portion 7 is the same or not less than the depth of the first concave portion 5. The second concave portion 7 is provided at the center of the first concave portion 5, for example. The width of the second concave portion 7 in the inserting/extracting direction of the cap 43 is the same or larger than the width of the locking portion 6 of the cap 43.
When the cap 43 is detached, it is necessary to fit the locking portions 6 into the first concave portions 5 before sliding the locking portions 6 of the cap 43 along the first concave portions 5, respectively. Compared with the case of the first embodiment, when the cap 43 of the semiconductor device 13 of the second embodiment is attached and detached, the second embodiment needs one more process, that is the process to fit the locking portions 6 which are located at the second concave portions 7 into the first concave portions 5, respectively. For this reason, the semiconductor device 13 of the embodiment can improve the effect to prevent loss of the cap 43.
A semiconductor device of a third modification will be described with reference to
The second concave portion 7 is located at the USB connector 3 side with the first concave portion 5 as the boundary, but may be provided at the case 24 side. In the third modification, at the time of attaching and detaching, compared with the case in which the second concave portion 7 is located at the center of the first concave portion 5, since the locking portion 6 of the cap 44 is located at the remotest position from the insertion port of the first concave portion 5, at the time of detaching the cap 44, the distance that the locking portion 6 moves on the first concave portion 5 becomes long. For this reason, since the cap 44 become more difficult to come off, the effect to prevent loss of the cap 44 can be improved.
A semiconductor device of a fourth modification will be described with reference to
At the time of detaching the cap 45 from the case 25, the locking portions 6 of the first main surface 2a and the second main surface 2b are fitted into the corresponding first concave portions 5, and the locking portions 6 are slid along the first concave portions 5, to thereby perform the detachment.
Without being limited to that the locking portions 6 of the third main surface 4a and the fourth main surface 4b of the cap 45 are provided at two positions, respectively, the locking portions 6 may be provided at three or more positions, respectively.
In the fourth modification, when the cap 45 is detached, the positions where the locking portions 6 are fitted from the second concave portions 7 to the first concave portions 5 are provided at two positions at the third main surface 4a and the fourth main surface 4b, respectively. Compared with the case in which the locking portion 6 and the second concave portion 7 are provided at one position, the more the number of positions where the locking portion 6 is fitted into the first concave portion 5, the more difficult the cap 45 becomes to come off from the case 25. For this reason, the effect to prevent loss of the cap 45 can be improved.
A semiconductor device of a fifth modification will be described with reference to
When the cap 46 is detached from the case 26, it is necessary to fit the whole locking portions 6 into the first concave portions 5, and thereby the effect to make the cap 46 difficult to come off from the case 26 can be improved.
A semiconductor device according to a third embodiment will be described with reference to
The second concave portions 7 of the case 27 are provided at two positions, for example, and the direction of arrangement of the second concave portions 7 and the opening direction of the first concave portion 5 are not in parallel with each other. The first concave portion 5 and the second concave portions 7 are provided at the first main surface 2a and the second main surface 2b opposite to the first main surface 2a, respectively. In the semiconductor device 17, the second concave portions 7 are provided at the USB connector 3 side near the second side surface 2d, and the strap hole 8 side near the first side surface 2c that is the opposite side, with the first concave portion 5 as the border, respectively.
When the cap 47 is detached from the case 27, the cap 47 is rotated in an N direction, to thereby fit the locking portion 6 into the first concave portion 5. After that, the cap 47 is slid along the concave portions 5, to thereby attach to or detach from the case 27.
In addition, without being limited to that the locking portions 6 are provided at two positions on the same plane, the locking portions 6 may be provided at three of more positions, the locking portion 6 may be provided at a position.
In the semiconductor device 17 of the embodiment, the second concave portions 7 are provided at the USB connector 3 side, and the semiconductor memory 60 side with the first concave portion 5 as the border, respectively, and thereby, at the time of detaching the cap 47 from the case 27, the process to fit the locking portions 6 into the first concave portion 5 by rotating the cap 47 becomes necessary. For this reason, the effect to prevent loss of the cap 47 can be improved.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intend to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of the other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-061740 | Mar 2013 | JP | national |
