Semiconductor device

Information

  • Patent Grant
  • D864135
  • Patent Number
    D864,135
  • Date Filed
    Tuesday, March 26, 2019
    5 years ago
  • Date Issued
    Tuesday, October 22, 2019
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • CPC
    • H01L21/00
    • H01L21/02433
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/42
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
    • H05K1/0228
    • H05K1/0245
    • H05K1/0236
    • H05K1/0263
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;



FIG. 2 is a rear, top and left side perspective view thereof;



FIG. 3 is a front view thereof;



FIG. 4 is a rear view thereof;



FIG. 5 is a top view thereof;



FIG. 6 is a bottom view thereof;



FIG. 7 is a left side view thereof; and,



FIG. 8 is a right side view thereof.


The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.


Claims
  • The ornamental design for a semiconductor device, as shown and described.
Priority Claims (2)
Number Date Country Kind
2017-023790 Oct 2017 JP national
2017-023791 Oct 2017 JP national
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Divisions (1)
Number Date Country
Parent 29643229 Apr 2018 US
Child 29685061 US