Semiconductor device

Information

  • Patent Grant
  • D937232
  • Patent Number
    D937,232
  • Date Filed
    Friday, July 30, 2021
    3 years ago
  • Date Issued
    Tuesday, November 30, 2021
    3 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D21 391
    • CPC
    • H01L21/00
    • H01L21/02
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L2224/42
    • H01L2224/43
    • H01L2224/01
    • H01L2224/08055
    • H01L2224/08054
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L23/00
    • H01L23/48
    • H01L23/4926
    • H01L23/495
    • H01L23/49517
    • H01L23/498
    • H01L23/49805
    • H01L23/49811
    • H01L23/49861
    • H01L23/49866
    • H01L23/49872
    • H01L23/49575
    • H01L23/49579
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a semiconductor device showing our new design;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a top plan view thereof; and,



FIG. 7 is a bottom plan view thereof.


Claims
  • The ornamental design for a semiconductor device, as shown and described.
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Foreign Referenced Citations (8)
Number Date Country
D1581768 Jul 2017 JP
D1588125 Oct 2017 JP
D1588481 Oct 2017 JP
D1632160 May 2019 JP
D1632597 May 2019 JP
D1640664 Sep 2019 JP
D1641048 Sep 2019 JP
D1641049 Sep 2019 JP
Divisions (1)
Number Date Country
Parent 29710616 Oct 2019 US
Child 29801764 US