Semiconductor device

Information

  • Patent Grant
  • D448739
  • Patent Number
    D448,739
  • Date Filed
    Thursday, March 8, 2001
    23 years ago
  • Date Issued
    Tuesday, October 2, 2001
    23 years ago
Abstract
Description




FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;




FIG. 2 is a front elevational view thereof;




FIG. 3 is a rear elevational view thereof;




FIG. 4 is a top plan view thereof;




FIG. 5 is a bottom plan view thereof;




FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;




FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7—7 of FIG. 2, with the internal system omitted; and,




FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8—8 of FIG. 2, with the internal system omitted.



Claims
  • The ornamental design for a semiconductor device, as shown and described.
Priority Claims (1)
Number Date Country Kind
12-025466 Sep 2000 JP
US Referenced Citations (5)
Number Name Date Kind
D. 401912 Majumdar et al. Dec 1998
D. 421969 Kawafuji et al. Mar 2000
D. 428859 Kawafuji et al. Aug 2000
5089929 Hilland Feb 1992
5221859 Kobayashi et al. Jun 1993
Non-Patent Literature Citations (1)
Entry
Catalogue of Toshiba Corp., Toshiba APRES series, “Intelligent power module”, 1999.