The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
Number | Date | Country | Kind |
---|---|---|---|
D2013-001263 | Jan 2013 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
D357672 | Terasawa et al. | Apr 1995 | S |
D364383 | Yamada et al. | Nov 1995 | S |
D364384 | Shimizu et al. | Nov 1995 | S |
D432096 | Jeon et al. | Oct 2000 | S |
D441726 | Sofue et al. | May 2001 | S |
D470825 | Iwasaki et al. | Feb 2003 | S |
6521983 | Yoshimatsu et al. | Feb 2003 | B1 |
D476959 | Yamada et al. | Jul 2003 | S |
D539761 | Takahashi et al. | Apr 2007 | S |
D548202 | Takahashi | Aug 2007 | S |
D548203 | Takahashi | Aug 2007 | S |
D587662 | Soutome et al. | Mar 2009 | S |
D589012 | Soyano et al. | Mar 2009 | S |
D648290 | Mori | Nov 2011 | S |
D653633 | Soyano | Feb 2012 | S |
D653634 | Soyano | Feb 2012 | S |
D673922 | Moriai et al. | Jan 2013 | S |
D686174 | Soyano | Jul 2013 | S |
D689446 | Soyano | Sep 2013 | S |
20010038143 | Sonobe et al. | Nov 2001 | A1 |
20110044012 | Matsumoto | Feb 2011 | A1 |
Entry |
---|
U.S. Appl. No. 29/458,663, filed Jun. 21, 2013. |
U.S. Appl. No. 29/458,665, filed Jun. 21, 2013. |
U.S. Appl. No. 29/458,667, filed Jun. 21, 2013. |
U.S. Appl. No. 29/458,669, filed Jun. 21, 2013. |