FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a top plan view thereof; the opposite side being a mirror image thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof; the opposite side being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.