FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is an enlarged cross-sectional view thereof and, taken along line 8—8 of FIG. 2, with the internal system omitted.