"Effects of Al Films on Ion--Implanted Si", Lee et al.--Appl. Phys. Letts., vol. 20. No. 2, Jan. 15, 1972, pp. 73-75. |
"Enhanced Migration of Implanted Sb and In in Si Covered with Evaporated Al"--Lee et al.--Appl. Phys. Lett., vol. 20, No. 2, Jan. 15, 1972, pp. 76-77. |
"Prevention of Corrosion of Copper by Ion Implantation"--Crowder--IBM Tech Disclosure Bulletin, vol. 14, No. 1, 6-1971, p. 198. |
"Eliminating Formation of Hillocks During Annealing of Aluminum-Copper Films"--d'Heurle et al.--IBM Tech. Disclosure Bulletin, vol. 14, No. 6, Nov. 1971, p. 1923. |
"Boron Doped Aluminum Conductive Stripes for Semiconductor Devices"--Jun. 1971, IBM Technical Disclosure Bulletin, vol. 14, No. 1--Herdzik et al.--p. 260. |
"Thin Film Stripes for Electronic Interconnection"--d'Heurle--IBM Technical Disclosure Bulletin, vol. 14, No. 2, 7-1971, pp. 596-597. |