Number | Date | Country | Kind |
---|---|---|---|
2018-024474 | Nov 2018 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
D523403 | Mizukoshi | Jun 2006 | S |
D648290 | Mori | Nov 2011 | S |
D674760 | Mochizuki | Jan 2013 | S |
D717254 | Jo | Nov 2014 | S |
D729250 | Han | May 2015 | S |
D777124 | Hasegawa | Jan 2017 | S |
D783550 | Hasegawa | Apr 2017 | S |
D796978 | Kawashima | Sep 2017 | S |
D839220 | Domon | Jan 2019 | S |
D845921 | Saito | Apr 2019 | S |
D859334 | Yokoyama | Sep 2019 | S |
D864884 | Yoneyama | Oct 2019 | S |
10510626 | Braun | Dec 2019 | B2 |
D873227 | Yoneyama | Jan 2020 | S |
10546825 | Hsu | Jan 2020 | B2 |
10553559 | Besshi | Feb 2020 | B2 |
10557191 | Nishida | Feb 2020 | B2 |
10600744 | Chikamatsu | Mar 2020 | B2 |
10600789 | Ha | Mar 2020 | B2 |
10605828 | Kung | Mar 2020 | B2 |
10636703 | Jeong | Apr 2020 | B2 |
10644115 | Oshima | May 2020 | B2 |
10651050 | Nakano | May 2020 | B2 |
10672878 | Ohoka | Jun 2020 | B2 |
Number | Date | Country |
---|---|---|
1162634 | Jan 2003 | JP |
1163101 | Jan 2003 | JP |
1563812 | Nov 2016 | JP |
Entry |
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Office Action issued for Japanese Patent Application No. 2018-024474, dated Mar. 1, 2019, 3 pages including abridged English translation. |
“Integrated circuit device,” Toshiba Semiconductor Company, Japan, JPO Publicly Known Design No. HC2000747100, date of making available to the public: Jun. 11, 2008, 5 pages including English translation of bibliographic data. |