Semiconductor device

Information

  • Patent Grant
  • D1043595
  • Patent Number
    D1,043,595
  • Date Filed
    Wednesday, April 26, 2023
    a year ago
  • Date Issued
    Tuesday, September 24, 2024
    2 months ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/428
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a semiconductor device showing our new design;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a top plan view thereof;



FIG. 5 is a right side view thereof; and,



FIG. 6 is a left side view thereof.


The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. Only the shaded areas denoted by the dash-dotted lines and the solid lines are claimed.


Claims
  • The ornamental design for a semiconductor device, as shown and described.
Priority Claims (1)
Number Date Country Kind
2022-023716 D Nov 2022 JP national
US Referenced Citations (25)
Number Name Date Kind
5401910 Mandai Mar 1995 A
D406822 Huber Mar 1999 S
6330165 Kohjiro Dec 2001 B1
D456367 Matteson Apr 2002 S
6433418 Fujisawa Aug 2002 B1
D475028 Hori May 2003 S
D475355 Hori Jun 2003 S
D475982 Hori Jun 2003 S
D480371 Sako Oct 2003 S
D489338 Seddon May 2004 S
D504874 Celaya May 2005 S
D509810 Hsu Sep 2005 S
D510728 Celaya Oct 2005 S
6992386 Hata Jan 2006 B2
D648290 Mori Nov 2011 S
D756317 Finn May 2016 S
D768115 Kazanchian Oct 2016 S
D822627 Nasu Jul 2018 S
D822628 Nasu Jul 2018 S
D823270 Nasu Jul 2018 S
D832227 Chikamatsu Oct 2018 S
D832228 Chikamatsu Oct 2018 S
D853978 Auer Jul 2019 S
D887998 Krasnopolski Jun 2020 S
D993201 Saito Jul 2023 S
Non-Patent Literature Citations (2)
Entry
MP8904DD-LF-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP8904DD-LF-Z/5292888, 2024. (Year: 2024).
MP2672AGD-0000-Z,https://www.digikey.com/en/products/detail/monolithic-power-systems-inc/MP2672AGD-0000-Z/13572801, 2024. (Year: 2024).