Semiconductor device

Information

  • Patent Grant
  • D986840
  • Patent Number
    D986,840
  • Date Filed
    Wednesday, November 11, 2020
    4 years ago
  • Date Issued
    Tuesday, May 23, 2023
    a year ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D13 180
    • D13 107
    • D13 108
    • D13 110
    • D13 146
    • D10 104
    • D10 106
    • D26 2
    • D26 37
    • D21 391
    • CPC
    • H01L25/167
    • H01L25/0753
    • H01L27/15
    • H01L27/156
    • H01L31/02
    • H01L33/00
    • H01L33/04
    • H01L33/08
    • H01L33/10
    • H01L33/20
    • H01L33/38
    • H01L33/42
    • H01L33/48
    • H01L33/483
    • H01L33/486
    • H01L21/00
    • H01L21/02
    • H01L21/4814
    • H01L21/4846
    • H01L23/14
    • H01L23/13
    • H01L23/147
    • H01L23/00
    • H01L23/48
    • H01L23/4926
    • H01L23/498
    • H01L23/49811
    • H01L23/49861
    • H01L23/49866
    • H01L23/49872
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • F21K9/00
    • H05K5/0069
    • H05K5/0247
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention;



FIG. 2 is a front view thereof;



FIG. 3 is a rear view thereof;



FIG. 4 is a left side view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a top view thereof;



FIG. 7 is a bottom view thereof;



FIG. 8 is a cross sectional view thereof taken along line 8-8;



FIG. 9 is a perspective view of a semiconductor device according to a second embodiment of the present invention;



FIG. 10 is a front view thereof;



FIG. 11 is a rear view thereof;



FIG. 12 is a left side view thereof,



FIG. 13 is a right side view thereof;



FIG. 14 is a top view thereof;



FIG. 15 is a bottom view thereof;



FIG. 16 is a cross sectional view thereof taken along line 16-16;



FIG. 17 is a perspective view of a semiconductor device according to a third embodiment of the present invention;



FIG. 18 is a front view thereof;



FIG. 19 is a rear view thereof;



FIG. 20 is a left side view thereof;



FIG. 21 is a right side view thereof;



FIG. 22 is a top view thereof;



FIG. 23 is a bottom view thereof; and,



FIG. 24 is a cross sectional view thereof taken along line 26-26.


The dash-dash broken lines in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design. The dash-dot broken lines in the drawings are for the purpose of illustrating a boundary and form no part of the claimed design.


Claims
  • We claim the ornamental design for a semiconductor device, as shown and described.
Priority Claims (1)
Number Date Country Kind
202030216324.5 May 2020 CN national
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