Semiconductor driving circuit module

Information

  • Patent Grant
  • D923591
  • Patent Number
    D923,591
  • Date Filed
    Wednesday, September 11, 2019
    5 years ago
  • Date Issued
    Tuesday, June 29, 2021
    3 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 327 108000
    • 327 112000
    • 327 333000
    • 326 026000
    • 326 027000
    • CPC
    • H01L21/00
    • H01L21/02
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L2224/42
    • H01L2224/43
    • H01L2224/01
    • H01L2224/08055
    • H01L2224/08054
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L23/00
    • H01L23/48
    • H01L23/4926
    • H01L23/495
    • H01L23/19517
    • H01L23/498
    • H01L23/49805
    • H01L23/49811
    • H01L23/49861
    • H01L23/49866
    • H01L23/49872
    • H01L23/49575
    • H01L23/49579
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H03K17/04123
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a semiconductor driving circuit module showing our new design;



FIG. 2 is a front view of the semiconductor driving circuit module of FIG. 1;



FIG. 3 is a rear view of the semiconductor driving circuit module of FIG. 1;



FIG. 4 is a left side view of the semiconductor driving circuit module of FIG. 1;



FIG. 5 is a right side view of the semiconductor driving circuit module of FIG. 1;



FIG. 6 is a top view of the semiconductor driving circuit module of FIG. 1;



FIG. 7 is a bottom view of the semiconductor driving circuit module of FIG. 1; and,



FIG. 8 is a perspective view of the semiconductor driving circuit module of FIG. 1 shown in a used condition, mounted on a semiconductor element shown in broken lines.


The broken line portions of the semiconductor driving circuit module in FIGS. 1-8 represent unclaimed portions of the claimed design and form no part thereof. The broken lines in FIG. 8 showing the semiconductor element represent the environment only and form no part thereof.


Claims
  • The ornamental design for a semiconductor driving circuit module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2019-005627 Mar 2019 JP national
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