Claims
- 1. A highly magnetic Hall element comprising:
- a substrate;
- a Hall element chip formed of a semiconductor wafer and mounted over said substrate, said Hall element chip having opposed first and second surfaces;
- a resin layer, including a magnetic powder, situated between the substrate and the first surface of said Hall element chip, a substantial portion of said resin layer being positioned beneath the first surface of said Hall element chip, said resin layer adhering said Hall element chip to said substrate;
- an encap including a resin mixed with a magnetic powder, a substantial portion of said encap being positioned over the second surface of said Hall element chip, magnetic flux passing through said encap and traveling toward the second surface of said Hall element chip, said encap being thickest in a portion corresponding to a center portion of said Hall element chip;
- bonding wires, connecting two pairs of electrodes of said Hall element chip and lead portions of said substrate; and
- said sealing material sealing the encap, the Hall element chip, bonding wires, the substrate, and the resin layer.
- 2. A highly magnetic Hall element according to claim 1, wherein the powder in said resin layer is a magnetic oxide.
- 3. A highly magnetic Hall element according to claim 1, wherein the powder in said resin layer is a metal powder having a magnetic permeability higher than that of a sealing epoxy resin.
- 4. A highly magnetic Hall element according to claim 1, wherein said resin layer is prepared from epoxy-base resin.
- 5. A highly magnetic Hall element according to claim 1, wherein the powder mixed with the resin forming said encap is a magnetic oxide.
- 6. A highly magnetic Hall element according to claim 1, wherein the resin forming said encap is an epoxy-base resin.
- 7. A highly magnetic Hall element according to claim 1, wherein said resin forming said encap is a silicon rubber resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
61-102126 |
May 1986 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 043,607, filed Apr. 28, 1987, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4021767 |
Nonaka et al. |
May 1977 |
|
4048670 |
Eysermans |
Sep 1977 |
|
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0007587 |
Feb 1980 |
EPX |
1449326 |
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0555870 |
Jan 1976 |
JPX |
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2143038 |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
43607 |
Apr 1987 |
|