Semiconductor integrated circuit apparatus and method of designing the same

Abstract

In a semiconductor integrated circuit apparatus formed by a core cell constituting a circuit function and a power wiring cell including a power wiring, a metal of a power wiring unit cell constituting the power wiring cell is formed to take a shape of T, and the power wiring unit cell is disposed adjacently, thereby forming a serial power wiring. The core cell and the power wiring cell are connected to each other through a metal wiring in the core cell in which coordinates in a horizontal direction are preset, and a power signal is thus supplied.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view showing a logic cell of a semiconductor integrated circuit apparatus according to a first embodiment of the invention,

FIG. 2 is a view showing a power wiring unit cell on a minimum unit constituting a power wiring cell in the logic cell,

FIG. 3 is a view showing a power wiring unit cell having different cell heights in the power wiring unit cell,

FIG. 4 is a view showing a structure of a power wiring unit cell according to a second embodiment of the invention,

FIG. 5 is a view showing a structure of the power wiring unit cell according to the embodiment,

FIG. 6 is a view showing a logic cell of a semiconductor integrated circuit apparatus according to a third embodiment of the invention,

FIG. 7 is a view showing a structure of a power wiring unit cell in the logic cell,

FIG. 8 is a view showing a power wiring unit cell having different cell heights in the power wiring unit cell,

FIG. 9 is a view showing a logic cell of a semiconductor integrated circuit apparatus according to a fourth embodiment of the invention,

FIG. 10 is a view showing a power wiring unit cell in the logic cell,

FIG. 11 is a view showing a power wiring unit cell having different cell heights in the power wiring unit cell, and

FIG. 12 is a view showing a semiconductor integrated circuit apparatus constituted by using the conventional art.

Claims

1. A semiconductor integrated circuit apparatus, comprising: at least two power wirings provided in a first direction which is coincident with a direction of a cell train in a block in which a logic cell is disposed and serving to supply a source voltage into the logic cell;wherein the power wiring has a slit at a regular interval in the first direction.

2. The semiconductor integrated circuit apparatus according to claim 1, wherein the slit takes a shape of a comb in which it is arranged like a comb at a regular interval in the first direction.

3. The semiconductor integrated circuit apparatus according to claim 1, wherein the slit takes a shape of a grid.

4. The semiconductor integrated circuit apparatus according to claim 1, further comprising: a core cell constituting a circuit function and a power wiring cell to be connected to the core cell, and constituting the logic cell;wherein a power supply wiring in the core cell is extended to a boundary portion between the power wiring cell and the core cell; andthe power wiring cell is constituted by a power wiring unit cell on a minimum unit including a slit in the vicinity of the boundary portion.

5. The semiconductor integrated circuit apparatus according to claim 4, wherein the power wiring unit cell constitutes a shape of T by combining a wiring arranged in the first direction corresponding to the direction of the cell train in the block in which the logic cell is disposed and a wiring extended in a second direction which is orthogonal to the first direction.

6. The semiconductor integrated circuit apparatus according to claim 5, wherein the power wiring unit cell is disposed adjacently at a regular interval in the first direction, thereby constituting a power wiring including a serial comb-shaped slit.

7. The semiconductor integrated circuit apparatus according to claim 5, wherein a position of an arrangement of a source voltage supply wiring in the core cell is preset into coordinates in the first direction with respect to the wiring in the second direction of the power wiring cell, thereby carrying out a connection to a metal wiring in the second direction of the power wiring.

8. The semiconductor integrated circuit apparatus according to claim 5, wherein a portion constituting the T shape of the power wiring cell is formed by an active region.

9. The semiconductor integrated circuit apparatus according to claim 5, wherein a portion constituting the T shape of the power wiring cell is formed by a metal and an active region.

10. The semiconductor integrated circuit apparatus according to claim 4, wherein the power wiring unit cell constitutes a shape of I by a wiring portion having a small width which is extended in a second direction that is perpendicular to the first direction and a wiring portion formed on both ends of the wiring portion and extended in the first direction.

11. The semiconductor integrated circuit apparatus according to claim 10, wherein the wiring portion is a metal or an active region.

12. The semiconductor integrated circuit apparatus according to claim 1, wherein at least one contact is disposed in a metal portion of the power wiring unit cell.

13. A method of designing a semiconductor integrated circuit apparatus in which a power wiring cell and a core cell to be connected to the power wiring cell are disposed to constitute a logic cell, the apparatus including at least two power wirings provided in a first direction which is coincident with a direction of a cell train in a block in which the logic cell is disposed and serving to supply a source voltage into the logic cell in a boundary portion with the core cell, comprising the steps of:preparing the power wiring cell in which the power wiring has a slit at a regular interval in the first direction; andarranging the power wiring cell corresponding to the core cell.

14. The method of designing a semiconductor integrated circuit apparatus according to claim 13, wherein the step of preparing the power wiring cell includes a step of preparing plural kinds of power wiring units cells having at least two heights.

15. The method of designing a semiconductor integrated circuit apparatus according to claim 13, wherein the step of preparing the power wiring cell includes a step of preparing plural kinds of power wiring unit cells in which the power wiring portion extended in the first direction has at least one wiring width.

16. The method of designing a semiconductor integrated circuit apparatus according to claim 13, wherein the arranging step includes a step of causing a metal or an active region of the power wiring unit cell to form a band-shaped straight line in the first direction, and the power wiring cell and a source voltage supply wiring in the core cell are connected to each other in an automatic layout.

17. The method of designing a semiconductor integrated circuit apparatus according to claim 13, wherein the arranging step includes a step of connecting a terminal provided on a boundary between the power wiring cell and the core cell to the power wiring cell in the automatic layout in the source voltage supply wiring in the core cell.