Patent Application
20060222037
1. Field of the Invention
The present invention relates to a semiconductor laser diode that converts an electric input signal into light and outputs the light.
2. Background Art
A semiconductor laser diode is a device that converts an electric input signal into light and outputs the light. Conventionally, an electric circuit element has been disposed outside the semiconductor laser diode in order to optimize the input signal depending on purposes or uses. For example, a terminal resistor is connected in series to a semiconductor laser diode. Although there is an optical modulator to which a terminal resistor is connected in parallel (e.g., refer to Japanese Patent Laid-Open No. 2004-219949), both means and effects differ from those in the case of a semiconductor laser diode.
However, since an electric circuit element is disposed outside, it was difficult downsize the total constitution including the electric circuit element. In addition, there was a problem that the frequency responding characteristics of input signals were deteriorated because of parasitic impedance produced by the connection of the semiconductor laser diode to the external electric circuit element.
The present invention has been made to solve foregoing problems, and it is an object of the present invention to provide a semiconductor laser diode that can downsize the total constitution including an electric circuit element, and can reduce parasitic impedance produced by the connection to an electric circuit element to prevent the deterioration of frequency responding characteristics of input signals.
According to one aspect of the present invention, a semiconductor laser diode comprises a semiconductor clad layer of a first conductivity type, an active layer formed on the semiconductor clad layer of a first conductivity type, a semiconductor clad layer of a second conductivity type formed on the active layer, an insulation film formed on the semiconductor clad layer of a second conductivity type, a metal electrode electrically connected to the semiconductor clad layer of a second conductivity type, and an electric circuit element formed on the insulation film.
Other and further objects, features and advantages of the invention will appear more fully from the following description.
According to the present invention, a semiconductor laser diode that can downsize the total constitution including an electric circuit element, and can reduce parasitic impedance produced by the connection to an electric circuit element to prevent the deterioration of frequency responding-characteristics of input signals.
First Embodiment
On a semiconductor clad layer of a first conductivity type 1, an active layer 2 is formed, and a semiconductor clad layer of a second conductivity type 3 is formed thereon. Current block layers 4 are formed on the both sides of the active layer 2, and an insulation film 5 is formed on the semiconductor clad layer of the second conductivity type 3. A metal electrode 6 is formed so as to electrically connect to the semiconductor clad layer of the second conductivity type 3.
Further, in the semiconductor laser diode according to the first embodiment, a resistor 7 is formed on the insulation film 5 as an electric circuit element. The resistor 7 can be formed by the vapor deposition of a thin film. The resistor 7 is electrically connected to the metal electrode 6.
By thus incorporating the resistor 7, no resistors are required to install outside so as to prevent the deterioration of frequency responding characteristics of input signals produced by the mismatch of impedance between the semiconductor laser diode and the drive circuit; therefore, the total constitution including the resistor 7 can be downsized. Further, parasitic impedance produced by the connection to the resistor 7 can be reduced to prevent the deterioration of frequency responding characteristics of input signals. Since optional input impedance can be obtained by using resistors of different resistance, the impedance can be easily matched with the drive circuit.
Second Embodiment
By thus incorporating the inductor 9, no installation of an inductor that constitute a bias circuit of direct current component for preventing increase in power consumption of the drive circuit and the heat generation of the resistance portion caused by flowing the direct current components in an impedance matching resistor for isolating the direct current component and high frequency (frequency modulation) component of input signals and preventing the deterioration of frequency responding characteristics; therefore, the total constitution including the inductor 9 can be downsized as in the case of the first embodiment 1. Further, parasitic impedance produced by the connection to the inductor 9 element can be reduced to prevent the deterioration of frequency responding characteristics of input signals.
A metal electrode 6 is connected to a pulse generator 11 through a matching resistor 10, and a direct current source 12 is connected to the inductor 9. Thereby the direct current component of input signals can be supplied through the inductor, and the high frequency component of input signals can be supplied without involving the inductor.
Third embodiment
Fourth Embodiment
By thus incorporating the capacitor 13, as in the first embodiment, the total constitution including the capacitor 13 can be downsized, and parasitic impedance produced by the connection to the capacitor 13 can be reduced to prevent the deterioration of frequency responding characteristics of input signals.
Further, a low-pass filter can be composed of the capacitance component of the capacitor and the inductance component of the wire for connecting to the drive circuit, and by truncating unnecessary harmonic components of the input signals, high-purity signals can be transmitted.
Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may be practiced otherwise than as specifically described.
The entire disclosure of a Japanese Patent Application No. 2005-107997, filed on Apr. 4, 2005 including specification, claims, drawings and summary, on which the Convention priority of the present application is based, are incorporated herein by reference in its entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-107997 | Apr 2005 | JP | national |
