The invention relates to a light-emitting device and a manufacturing method thereof. In particular, the invention relates to a semiconductor light-emitting device and a manufacturing method thereof.
Among conventional light source products, solid lighting devices formed by semiconductors (e.g., light-emitting diode (LED), organic LED (OLED), and polymer LED) have been widely applied in daily lives of human beings. The LED characterized by low power consumption, long service life, and small volume has been replacing the conventional light source.
In order to provide light with proper color, the conventional LED light source not only emits light from the LED but also generates excited light through exciting phosphor by applying the light emitted from the LED; further, the light emitted from the LED and the excited light can be mixed to generate the light with the proper color. However, whether the phosphor is uniformly sprayed onto the LED or not also poses an impact on the overall light-emitting quality of the light source.
The phosphor sprayed onto the side surface of the LED is very much likely to have uneven thickness or to be distributed non-uniformly. For instance, if the amount of yellow phosphor distributed onto the side surface of a blue LED is insufficient, or if the blue LED is even exposed due to the insufficient amount of the yellow phosphor, the blue beam is emitted from the side surface (i.e., at a large angle) of the blue LED light source. By contrast, if the amount of the yellow phosphor distributed onto the side surface of the blue LED is excessive, the yellow beam is emitted from the side surface (i.e., at a large angle) of the blue LED light source. Both of said conditions deteriorate the light-emitting quality of the overall light source, reduce the yield of the light source, and raise the overall manufacturing costs.
The invention is directed to a semiconductor light-emitting device that is characterized by exceptional light-emitting quality.
The invention is directed to a manufacturing method of a semiconductor light-emitting device, and the manufacturing method can be applied to form the semiconductor light-emitting device characterized by exceptional light-emitting quality.
In an embodiment of the invention, a semiconductor light-emitting device includes a substrate, at least one light-emitting unit arranged on the substrate, a phosphor layer at least covering an upper surface of the at least one light-emitting unit, and a reflective layer arranged on the substrate. The reflective layer surrounds the at least one light-emitting unit.
According to an embodiment of the invention, the reflective layer covers a side surface of the at least one light-emitting unit.
According to an embodiment of the invention, an upper surface of the reflective layer is substantially co-planar with the upper surface of the at least one light-emitting unit.
According to an embodiment of the invention, the phosphor layer encapsulates the at least one light-emitting unit onto the substrate, and the reflective layer covers the side surface of the phosphor layer configured to encapsulate the at least one light-emitting unit.
According to an embodiment of the invention, an upper surface of the reflective layer is substantially higher than the upper surface of the at least one light-emitting unit.
According to an embodiment of the invention, the semiconductor light-emitting device further includes a molding compound. The molding compound encapsulates the at least one light-emitting unit, the phosphor layer, and the reflective layer onto the substrate.
According to an embodiment of the invention, the semiconductor light-emitting device further includes a blocking wall. The blocking wall is arranged on the substrate and surrounds a light-emitting region, and the at least one light-emitting unit, the phosphor layer, and the reflective layer are arranged in the light-emitting region.
According to an embodiment of the invention, an upper surface of the reflective layer is substantially lower than the upper surface of the at least one light-emitting unit and an upper surface of the blocking wall.
According to an embodiment of the invention, the at least one light-emitting unit comprises a plurality of light-emitting chips, and the light-emitting chips are connected together.
According to an embodiment of the invention, if the quantity of the at least one light-emitting units is plural, the reflective layer is further arranged between the light-emitting units.
In an embodiment of the invention, a manufacturing method of a semiconductor light-emitting device includes: providing a substrate; placing at least one light-emitting unit on the substrate; encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer. The phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.
According to an embodiment of the invention, the step of encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer further includes: placing the reflective layer on the substrate, wherein the reflective layer covers side surface of the at least one light-emitting unit; placing the phosphor layer on the upper surface of the at least one light-emitting unit or on the upper surface of the at least one light-emitting unit and an upper surface of the reflective layer after the reflective layer covers the side surface of the at least one light-emitting unit.
According to an embodiment of the invention, an upper surface of the reflective layer is substantially co-planar with the upper surface of the at least one light-emitting unit.
According to an embodiment of the invention, the step of encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer further includes: encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and placing the reflective layer on a side surface of the phosphor layer of the at least one light-emitting unit.
According to an embodiment of the invention, an upper surface of the reflective layer is substantially higher than the upper surface of the at least one light-emitting unit.
According to an embodiment of the invention, after encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer, the manufacturing method further includes: encapsulating the at least one light-emitting unit, the phosphor layer, and the reflective layer onto the substrate by a molding compound.
According to an embodiment of the invention, before encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer, the manufacturing method further includes: placing a blocking wall on the substrate, wherein the blocking wall surrounds a light-emitting region, and the at least one light-emitting unit, the phosphor layer, and the reflective layer are arranged in the light-emitting region.
According to an embodiment of the invention, when the at least one light-emitting unit is encapsulated onto the substrate by the phosphor layer and the reflective layer, the blocking wall is adapted to restricting the reflective layer to be located in the light-emitting region.
According to an embodiment of the invention, the step of placing the at least one light-emitting unit on the substrate further includes: placing a plurality of ht-emitting chips on the substrate, wherein the light-emitting chips are connected together and constitute the at least one light-emitting unit.
According to an embodiment of the invention, if the quantity of the at least one light-emitting units is plural, the reflective layer is further arranged between the light-emitting units.
Based on the above, the reflective layer of the semiconductor light-emitting device provided in an embodiment of the invention can block the light emitted from the side surface of the light-emitting unit, such that the semiconductor light-emitting device is capable of emitting light with favorable quality. Besides, according to the manufacturing method of the semiconductor light-emitting device provided herein, when the light-emitting unit is encapsulated by the phosphor layer and the reflective layer, the side surface of the light-emitting unit is covered, and the semiconductor light-emitting device capable of emitting light with favorable quality can be formed.
Several exemplary embodiments accompanied with figures are described in detail below to further describe the disclosure in details.
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the disclosure.
In the semiconductor light-emitting device 100 provided in the first embodiment, the light-emitting unit 120 is encapsulated onto a surface 111 of the substrate 110 by the phosphor layer 130 and the reflective layer 140. Since the phosphor layer 130 covers the upper surface 121 of the light-emitting unit, the thickness of the phosphor layer 130 is proper, such that the light emitted from the upper surface 121 of the light-emitting unit 120 can be converted to have appropriate color by means of the phosphor layer 130. On the other hand, the reflective layer 140 is capable of covering or reflecting the light emitted from the side surface 123 of the light-emitting unit 120 and simultaneously reflect the light reflected by the phosphor layer 130 or by other optical devices on the upper surfaces 121 of the light-emitting units 120. Hence, the light emitted by the semiconductor light-emitting device 100 is mainly the light with proper color and mainly come from the upper surface 121 of the light-emitting unit 120. Thereby, the overall light-emitting quality of the semiconductor light-emitting device 100 is further improved.
In the first embodiment, the semiconductor light-emitting device 100 is exemplified to elaborate the semiconductor light-emitting device provided in the embodiments of the invention, which should however not be construed as a limitation to the invention. Other exemplary semiconductor light-emitting devices and the manufacturing method thereof are provided in some other embodiments below to elaborate the semiconductor light-emitting device discussed in the disclosure.
Specifically, the substrate 110A provided in the present embodiment is a ceramic substrate whose surface 111A has a circuit layer, and thus the substrate 110A is suitable for providing carrying, electrical connection, and heat dissipation function for the light-emitting unit 120A. In another aspect, the light-emitting unit 120A provided herein is a flip-chip LED, for instance; hence, the light-emitting unit 120 can be directly electrically connected to the surface 111A of the substrate 110A.
With reference to
To be specific, as shown in
With reference to
Particularly, the material of the reflective layer 140A includes silicon and titanium dioxide (TiO2), for instance, and the viscosity of the reflective layer 140A is within a range from 1000 mPa·s to 20000 mPa·s, for instance. The reflectivity of the reflective layer 140A falls within a range from 90% to 99%. The phosphor layer is made of phosphor and adhesives. However, the material, the viscosity, and the reflectivity of the reflective layer 140A are not limited in the invention, and neither is the material of the phosphor. In other embodiments of the invention, the reflective layer can be made of other materials with proper viscosity and reflectivity, and the phosphor layer can be made of the mixture of proper substance and phosphor capable of achieving the effects of fluorescent light. To be more specific, the reflective layer 140A provided herein is made of white glue and thus can be easily formed on the substrate 110A as well as surround the light-emitting unit 120A.
With reference to
In view of the above, according to the manufacturing method of the semiconductor light-emitting device provided herein, the light-emitting unit 120A is encapsulated onto the substrate 110A by the reflective layer 140A and the phosphor layer 130A, and the reflective layer 140A arranged on the substrate 110A surrounds the light-emitting unit 120A. Hence, the reflective layer 140A can block the light emitted from the side surface of the light-emitting unit 120A, and the light emitted from the upper surface 121A of the light-emitting unit 120A can be converted to have proper color by means of the phosphor layer 130A that has the appropriate thickness and uniformly covers the upper surface of the light-emitting unit 120A. As a result, by applying the manufacturing method of the semiconductor light-emitting device discussed herein, the semiconductor light-emitting device 100A characterized by exceptional light-emitting quality can be formed. However, the manufacturing method of the semiconductor light-emitting device provided in the disclosure is not limited to that described in the second embodiment.
With reference to
With reference to
The phosphor layer 130B formed on the upper surface 121B of the light-emitting unit 120B has the proper thickness; hence, the light-emitting unit 120B is capable of emitting the light with proper color through the phosphor layer 130B, and the light beams with significantly different colors can be blocked by the reflective layer 140B.
Particularly, the upper surface 141B of the reflective layer 140B provided in the present embodiment is substantially higher than the upper surface 121B of the light-emitting unit 120B and thus can achieve favorable optical blocking effects.
Particularly, the material of the reflective layer 140B includes silicon and titanium dioxide (TiO2), for instance, and the viscosity of the reflective layer 140B is within a range from 1000 mPa·s to 20000 mPa·s, for instance. The reflectivity of the reflective layer 140B falls within a range from 90% to 99%. The phosphor layer is made of phosphor or adhesives. However, the material, the viscosity, and the reflectivity of the reflective layer 140B are not limited in the invention, and neither is the material of the phosphor. In other embodiments of the invention, the reflective layer can be made of other materials with proper viscosity and reflectivity, and the phosphor layer can be made of the mixture of proper substance and phosphor capable of achieving the effects of fluorescent light.
With reference to
In view of the above, according to the manufacturing method of the semiconductor light-emitting device provided herein, the light-emitting unit 120B is encapsulated onto the substrate 110B by the reflective layer 140B and the phosphor layer 130B, and the reflective layer 140B arranged on the substrate 110B surrounds the light-emitting unit 120B covered by the phosphor layer 130B. Hence, the reflective layer 140B can block the light emitted from the side surface of the light-emitting unit 120B, and the light emitted from the upper surface 121B of the light-emitting unit 120B can be converted to have proper color by means of the phosphor layer 130B that has the appropriate thickness and uniformly covers the upper surface 121B of the light-emitting unit 120B. As a result, by applying the manufacturing method of the semiconductor light-emitting device discussed herein, the semiconductor light-emitting device 100B characterized by exceptional light-emitting quality can be formed.
According to the present embodiment, the semiconductor light-emitting device 100C further includes a blocking wall 160C that surrounds a light-emitting region A, and the light-emitting unit 120C, the phosphor layer 130C, and the reflective layer 140C are arranged in the light-emitting region A. The manufacturing method of the semiconductor light-emitting device 100C provided in the fourth embodiment of the invention and the semiconductor light-emitting device 100C are elaborated with reference to cross-sectional views.
To clearly explain the semiconductor light-emitting device and the manufacturing method thereof in the present embodiment,
Similar to the previous embodiment, in the present embodiment as shown in
With reference to
In particular, the material of the blocking wall 160C includes silicon and TiO2 (or silicon dioxide, SiO2) and is pre-solidified on the substrate 110C to surround the light-emitting region A.
With reference to
Particularly, the material of the reflective layer 140A includes silicon and TiO2, for instance, and the viscosity of the reflective layer 140C is within a range from 1000 mPa·s to 20000 mPa·s, for instance. The reflectivity of the reflective layer 140C falls within a range from 90% to 99%. However, the material, the viscosity, and the reflectivity of the reflective layer 140C are not limited in the invention, and neither is the material of the phosphor. In other embodiments of the invention, the reflective layer may be made of other materials with proper viscosity and reflectivity.
With reference to
With reference to
With reference to
In particular, the material of the blocking wall 160C includes silicon and TiO2 (or SiO2) and is pre-solidified on the substrate 110D to surround the light-emitting region B.
With reference to
In view of the above, according to the manufacturing method of the semiconductor light-emitting device provided herein, the light-emitting unit 120D is encapsulated onto the substrate 110D by the reflective layer 140D and the phosphor layer 130D, and the blocking wall 160D can prevent the reflective layer 140D from overflowing to the outside of the light-emitting region B or the outside of the substrate 110D. Thereby, the production yield of the semiconductor light-emitting device 100D can be improved. The reflective layer 140D on the substrate 110D surrounds the light-emitting unit 120D covered by the phosphor layer 130D. Therefore, the reflective layer 140D is capable of blocking the light emitted from the side surface of the light-emitting unit 120D, and the light emitted from the upper surface 121D of the light-emitting unit 120D can be converted to a proper color by means of the phosphor layer 130D that has the appropriate thickness and uniformly covers the upper surface 121D of the light-emitting unit 120D. As a result, by applying the manufacturing method of the semiconductor light-emitting device discussed herein, the semiconductor light-emitting device 100D characterized by exceptional light-emitting quality can be formed.
On the other hand, the arrangement of encapsulating the light-emitting unit 120D onto the substrate 110D by the phosphor layer 130D as described in the fifth embodiment should not be construed as a limitation to the invention.
In the fourth embodiment and the fifth embodiment, the light-emitting chips 122C and 122D are closely arranged, which should however not be construed as a limitation to the invention. In another embodiment, the distance between the light-emitting chips may be 50 micrometers (μm) constantly.
In the present embodiment, the light-emitting units 120E and the metal layer 170E are located on the light-emitting region C on the substrate 110E, and the blocking wall 160E surrounds the light-emitting region C after the light-emitting units 120E are arranged on the metal surface 171E. In particular, the material of the blocking wall 160E includes silicon and TiO2 (or SiO2) and is pre-solidified on the substrate 110E to surround the light-emitting region C.
In the present embodiment, the reflective layer 140E is located in the light-emitting region C, and the blocking wall 160E is suitable of limiting the reflective layer 140E to be located in the light-emitting region C. The space among the light-emitting units 120E is filled with the reflective layer 140E, i.e., the reflective layer 140E in the light-emitting region C is located in an area exposed by the light-emitting units 120E and covers the side surfaces of the light-emitting units 120E.
From another perspective, an upper surface 141E of the reflective layer 140E is substantially lower than upper surfaces 121E of the light-emitting units 120E and an upper surface 161E of the blocking wall 160E. That is, the upper surface 141E of the reflective layer 140E is co-planar with or lower than the upper surfaces of the light-emitting units 120E, and thus the flowable material constituting the reflective layer 140E can be easily formed in the light-emitting region C.
According to the present embodiment, the phosphor layer 130E covers the reflective layer 140E and the light-emitting units 120E, and the light-emitting units 120E are encapsulated onto the substrate 110E. The reflective layer 140E can block the light emitted from the side surfaces of the light-emitting units 120E, and the upper surface 141E of the reflective layer 140E can provide a large reflective surface, such that the light from the upper surfaces 120E of the light-emitting units 120E can be emitted in an efficient manner. Moreover, the phosphor layer 130E can be well formed on the reflective layer 140E and the light-emitting units 120E. As a result, the semiconductor light-emitting device 100 provided herein is characterized by exceptional light-emitting quality.
To sum up, the reflective layer of the semiconductor light-emitting device provided in an embodiment of the invention surrounds the light-emitting unit and exposes the phosphor layer on the upper surface of the light-emitting unit. While the reflective layer reflects the light emitted from the upper surface of the light-emitting unit, the reflective layer can simultaneously block the light emitted from the side surface of the light-emitting unit, such that the semiconductor light-emitting device is capable of emitting light with favorable quality. Besides, according to the manufacturing method of the semiconductor light-emitting device provided in an embodiment of the invention, when the light-emitting unit is encapsulated by the phosphor layer and the reflective layer, the reflective layer surrounds the light-emitting unit and exposes the phosphor layer adjoining the upper surface of the light-emitting unit. Thereby, while the reflective layer reflects the light emitted from the upper surface of the light-emitting unit, the reflective layer can simultaneously block the light emitted from the side surface of the light-emitting unit, such that the semiconductor light-emitting device is capable of emitting light with favorable quality.
Although the disclosure has been provided with reference to the above embodiments, it will be apparent to one of ordinary skill in the art that modifications to the described embodiments may be made without departing from the spirit of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims and not by the above detailed descriptions.
This application claims the priority benefits of U.S. provisional application Ser. No. 62/134,577, filed on Mar. 18, 2015. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
Number | Date | Country | |
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62134577 | Mar 2015 | US |