Claims
- 1. A method of illuminating a device having a dial comprising the steps of:providing a substrate sufficiently large to cover a substantial portion of said dial; depositing on said substrate a plurality of conductors using thin film techniques; mounting on said substrate a light emitting element so that said light emitting element is electrically coupled to said conductors; and mounting said substrate over said dial with said light emitting element oriented to provide radiation toward said dial.
- 2. The method of claim 1 wherein said substrate is a transparent glass.
- 3. The method of claim 1 wherein said step of depositing said conductors includes depositing a layer of Cr on a glass, depositing a layer of Ni on the Cr and depositing a layer of Au on the Ni.
- 4. The method of claim 3 further comprising depositing a layer of a protective resin on the Au.
- 5. The method of claim 1 further comprising providing the light emitting element on a flip chip package having connecting bumps on one surface and connecting said bumps to said conductors.
- 6. The method of claim 1 wherein said light emitting elements are lensless so that their light is not concentrated.
- 7. The method of claim 1 further comprising arranging the light emitting elements in groupings of three on said substrate.
- 8. The method of claim 7 wherein each grouping includes a red, a green and a blue element.
- 9. A method of making an illuminating device comprising the steps of:providing a transparent substrate; depositing on said substrate a plurality of conductors using thin film techniques; and mounting on said substrate a light emitting element so that said light emitting element is electrically coupled to said conductors, said conductors providing power to said light emitting element; wherein during said step of depositing includes depositing a layer of Cr on transparent glass, depositing a layer of Ni on the Cr and depositing a layer of a conductive metal on the Ni, said layers extending between said light emitting element and an edge of said substrate.
- 10. The method of claim 9 wherein said conductive metal is selected from the group consisting of Au, Ag and Cu.
- 11. The method of claim 9 further comprising depositing a layer of a protective resin on the conductive metal.
Parent Case Info
This application is a divisional of Ser. No. 09/659,189, filed Sep. 12, 2000, now U.S. Pat. No. 6,486,561.
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