This invention relates to semiconductor light sources, and in particular to semiconductor lasers.
Ordinary semiconductor light sources and semiconductor lasers employ direct bandgap compound semiconductors such as Gallium Arsenide (GaAs). Typically, they work on the principle of interband electron transition, where light is emitted when an excited electron in the semiconductor material transits from the conduction band edge to the valence band edge.
By contrast, indirect bandgap semiconductors, such as Silicon (Si), require a phonon to be emitted or absorbed in order for an electron to transit from the conduction band edge to the valence band edge. This requirement makes the probability of such a transition less likely than when a phonon is not required, under otherwise the same circumstances. As a result, the emission of light is also less likely, and hence, Si, although the most widely used semiconductor, is not regarded as a suitable material for the fabrication of a semiconductor light source.
Another type of semiconductor light source, the semiconductor quantum cascade laser, employs intraband transitions, also known as inter-subband transitions, in which electrons excited to a higher level energy band, i.e., a higher energy subband, in the conduction or the valence band fall to a lower level energy band, i.e., a lower energy subband, in the same band. Quantum cascade lasers are conventionally based on compound semiconductors such as gallium indium arsenide and aluminum indium arsenide (GaInAs/AlInAs). GaInAs/AlInAs quantum cascade lasers typically produce light in the mid-infrared (IR) spectral range, e.g., between 4 and 13 μm.
Quantum cascade lasers have also been researched using a combination of silicon and germanium. Unfortunately, there is considerable difficulty in achieving a laser based on Si/Ge. This is because of a) the large lattice mismatch, e.g., 4%, between Si and Ge, b) the fact that the valence band must be used, which is less desirable due to additional complexities than using the conduction band, and c) the small band offset between the conduction and valence bands of the Si and the Ge. Although some electroluminescence has been observed, it is not believed that lasing has been achieved using Si and Ge. Furthermore, it is expected that even if lasing were to be achieved using Si and Ge that the operating wavelength would be greater that 18 μm, which would not be useful for current telecommunications applications.
The problem of developing a semiconductor light source that can be constructed on a silicon-based substrate is overcome, in accordance with principles of the invention, by a light source that is based on a combination of silicon and calcium fluoride (CaF2). The silicon and the calcium fluoride need not be pure, but may be doped, or even alloyed, to control their electrical and/or physical properties.
Preferably, the light source employs interleaved portions, e.g., arranged as a multilayer structure, of silicon and calcium fluoride and operates using intersubband transitions in the conduction band. More specifically, the Si, which has a smaller bandgap than the CaF2 provides the quantum well while the CaF2, which has a larger bandgap than the Si, provides the barrier. Advantageously, such a light source has a low lattice mismatch, e.g., as small as 0.55%, and a large conduction band offset, e.g., approximately 2.2 electron volts. A Si and CaF2 light source may be tuned to emit light in the near infrared spectral range, e.g., between 1 μm and 4 μm, and more specifically, at 1.5 μm and 1.3 μm, each of which is suitable for modern telecommunications applications. Further advantageously, a light source based primarily on silicon is cheaper to manufacture than a light source based on GaAs and it is easier to integrate such a light source with conventional electronics based on silicon technology.
Combining, e.g., doping and/or alloying the Si and CaF2 with other material, such as germanium and cadmium fluoride (CdF2), provides for the possibility of further customization of the light source's properties. For example, perfect lattice matching may be achieved by alloying a small amount of Ge with the silicon. By alloying cadmium fluoride (CdF2) with the CaF2 and doping it with trivalent metal ions such as gallium (Ga), the resulting combination may be made conductive.
The light source may be arranged so as to form a quantum cascade laser, a ring resonator laser, a waveguide optical amplifier.
In the drawing:
The following merely illustrates the principles of the invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. Furthermore, all examples and conditional language recited herein are principally intended expressly to be only for pedagogical purposes to aid the reader in understanding the principles of the invention and the concepts contributed by the inventor(s) to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.
In the claims hereof any element expressed as a means for performing a specified function is intended to encompass any way of performing that function. This may include, for example, a) a combination of electrical or mechanical elements which performs that function or b) software in any form, including, therefore, firmware, microcode or the like, combined with appropriate circuitry for executing that software to perform the function, as well as mechanical elements coupled to software controlled circuitry, if any. The invention as defined by such claims resides in the fact that the functionalities provided by the various recited means are combined and brought together in the manner which the claims call for. Applicant thus regards any means which can provide those functionalities as equivalent as those shown herein.
Software modules, or simply modules which are implied to be software, may be represented herein as any combination of flowchart elements or other elements indicating performance of process steps and/or textual description. Such modules may be executed by hardware that is expressly or implicitly shown.
Unless otherwise explicitly specified herein, the drawings are not drawn to scale.
Additionally, unless otherwise explicitly specified herein, any lens shown and/or described herein is actually an optical system having the particular specified properties of that lens. Such an optical system may be implemented by a single lens element but is not necessarily limited thereto. Similarly, where a mirror is shown and/or described what is actually being shown and/or described is an optical system with the specified properties of such a mirror, which may be implemented by a single mirror element but is not necessarily limited to a single mirror element. This is because, as is well known in the art, various optical systems may provide the same functionality of a single lens element or mirror but in a superior way, e.g., with less distortion. Furthermore, as is well known in the art, the functionality of a curved mirror may be realized via a combination of lenses and mirrors and vice versa. Moreover, any arrangement of optical components that are performing a specified function, e.g., an imaging system, gratings, coated elements, and prisms, may be replaced by any other arrangement of optical components that perform the same specified function. Thus, unless otherwise explicitly specified here, all optical elements or systems that are capable of providing specific function within an overall embodiment disclosed herein are equivalent to one another for purposes of the present disclosure.
In the description, identically numbered components within different ones of the FIGs. refer to the same components.
Semiconductor light source 100 works as a basic light emitting unit. On a theoretical level, semiconductor light source 100 is a single quantum well structure and in particular, it is a single silicon quantum well that has a CaF2 barrier. More specifically, since Si has a smaller bandgap than CaF2, the Si provides the quantum well, while the CaF2, which has a larger bandgap than the Si, provides the barrier. An electrode on one side of the quantum well structure supplies electrons that tunnel through the barrier and may be carried off by an electrode on the other side of the quantum well structure. Preferably, semiconductor light source 100 operates using intersubband transitions in the conduction band. Advantageously, such a light source has a low lattice mismatch, e.g., as small as 0.55%, and a large conduction band offset, e.g., approximately 2.2 electron volts.
Physically, light source 100 includes a) silicon (Si) substrate 101, b) silicon dioxide layer SiO2 102, c) Si layer 103, d) conductive Si (n+ Si) layer 105, e) CaF2 layer 107, f) Si layer 109, g) CaF2 layer 111, h) conductive CaF2 layer 113 i) metal layers 115 and 117, and j) conductors 125 and 127.
Substrate 101 may be a conventional silicon wafer, such as those commercially available. Silicon dioxide layer 102 is a conventional layer of SiO2, commonly referred to as a buried oxide (BOX) layer. SiO2 layer 102 has a lower index of refraction than Si. Thus, this layer functions to provide confinement of light generated above in regions that have a higher index of refraction from leaking out of that region. In other words, SiO2 layer 102 provides optical isolation that keeps generated light from leaking into substrate 101. Si layer 103 is a single crystalline layer of Si that provides a suitable base on which to grow additional single crystalline layers that make up the active layers of light source 100. Wafers made up of Si substrate 101, silicon dioxide layer 102, and Si layer 103 are available commercially and are know as silicon on insulator (SOI) wafers.
Conductive silicon layer 105 may be doped to be n-type, so that it is suitably conductive and can function effectively as one of the electrodes of the quantum well structure. In other words, conductive silicon layer 105 is arranged to act as a plate electrode. Those of ordinary skill in the art would readily be able to appropriately dope conductive silicon layer 105 to achieve a desired level of conductivity. Typically, the more conductive silicon layer 105 is, the more light will be generated. Conductive silicon layer 105 is electrically connected to metal electrode layer 117, which is in turn coupled to conductor 127, so that electricity is conducted to silicon layer 105 via conductor 127 and electrode layer 117.
CaF2 layer 107 is a thin layer, e.g., 5 to 50 angstroms, of CaF2 that does not need to be doped. Si layer 109 is a thin layer, e.g., 5 to 100 angstroms, of Si that does not need to be doped. CaF2 layer 111 is a thin layer, e.g., typically 5 to 50 angstroms, of CaF2 that does not need to be doped.
Conductive CaF2 layer 113 is layer of CaF2 that is combined with at least one other material. Typically, conductive CaF2 layer 113 is thicker than thinner CaF2 layers 107 and 111. Conductive CaF2 layer 113 is combined, e.g., doped or alloyed, with the at least one other material so that the resulting combination is effectively conductive, e.g., n-type conductive. One way to achieve n-type conductivity is to alloy CdF2 with the CaF2 of layer 113 and then doping the entire alloy with a trivalent metal ion, e.g., gallium (Ga). Note that by an alloy what is meant is a greater concentration of CdF2 than would be considered to be a mere dopant. For example, the doping of conductive Si layer 105 may be performed using a concentration of 0.005% of antimony with the silicon while the alloying of CaF2 with CdF2 may consist of 1% of CdF2 within the CaF2.
Conductive CaF2 layer 113 acts as an electrode, similar to conductive silicon layer 105. Conductive CaF2 layer 113 is electrically connected to metal electrode layer 115, which is in turn coupled to conductor 125, so that electricity is brought to conductive CaF2 layer 113 via conductor 125 and electrode layer 115.
A Si and CaF2 light source, such as exemplary semiconductor light source 100 of
Note that although n-type Si and CaF2 have been shown, those of ordinary skill in the art will recognize that it may be possible to similarly employ p-type Si and CaF2.
Also shown in
Combining, e.g., doping and/or alloying the Si and CaF2 with other material, such as germanium and cadmium fluoride (CdF2) provides for the possibility of further customization of the properties of a semiconductor light source arranged in accordance with the principles of the invention. For example, in exemplary semiconductor light source 100 (
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For example,
Returning to
More specifically, region 609 depicts a Si quantum well between CaF2 regions 607 and 611, each of which acts as a barrier. The quantum well is formed by Si layer 509 (
Due to the multiple layer structure and the widths of the layers of exemplary semiconductor light source active region 500 (
The difference in energy between the energy levels depends on the particular materials employed and the thicknesses of the layers of the employed materials. Preferably the energy difference between E2 and E1 is on the order of 0.8 eV, which corresponds to a light wavelength on the order of 1.5 μm. Alternatively, the energy difference between E2 and E1 is on the order of 0.95 eV, which corresponds to a light wavelength on the order of 1.3 μm. Also, preferably, the energy difference between E2 and E3 is on the order of the energy of a phonon.
The primary operation is for an electron to tunnel through CaF2 region 607 to reach energy level E1 in quantum well 609. A photon is emitted as the electron tunnels through CaF2 region 611 to quantum well 639 while droping to energy level E2 therein. Thereafter, a phonon is emitted as the electron tunnels through CaF2 region 641 while dropping to energy level E3 in quantum well 659. This emission of a phonon and dropping from E2 to E3 is conventionally called relaxation. The electron then exits active region 500 by tunneling through CaF2 region 661.
Superlattice region 700 is made up of alternating layers of Si, e.g., Si layers 709, 713, 717, 721, 725, 729, and 733, and CaF2, e.g., CaF2, layers 707, 711, 715, 719, 723, 727, 731 and 735. Typically the Si layers of superlattice region 700 are lightly doped to improve conductivity and facilitate electron transport through superlattice region 700. The CaF2 layers of superlattice region 700 may be doped. Typically the widths of the CaF2 layers may remain constant while the widths of the Si layers are varied. The number of layers employed and the doping required, if any, for each of the layers needs to be such that the resulting energy levels of the superlattice overlap when a potential voltage is applied so as a) to form a so called “mini” band and b) to provide enough spatial separation so that the applied potential difference can shift the highest energy band of the active region which is being supplied with electrons from superlattice region 700 to the same energy level as the relaxation energy level from which superlattice region 700 is receiving electrons. Thus, the particular design in terms of number of layers and their widths is dependent on the particular operating potential difference desired and the energy levels of the active regions when operating, and should be such that under typical operating conditions the mini band is formed. Those of ordinary skill in the art will readily be able to design superlattice regions for various applications.
Preferably at the end of the alternating active and superlattice regions of exemplary quantum cascade laser 1000 that is opposite to substrate 1001 is alloyed superlattice region 1035. CaF2/CdF2 superlattice region 1035 has a structure similar to that of superlattice region 700 (
Exemplary quantum cascade laser 1000 also includes a) silicon (Si) substrate 101, b) silicon dioxide layer SiO2 102, c) Si layer 103, d) conductive Si (n+ Si) layer 105, e) metal layers 115 and 117, and j) conductors 125 and 127.
Molecular beam epitaxy may be employed to deposit the various layers of Si and CaF2, and CdF2. For depositing silicon, an e-beam source, e.g., an electron beam evaporator, may be employed as the source of the Si atoms. For CaF2, CdF2, and dopants a thermal evaporator, e.g., an effusion cell, may be employed as the source of the molecules.
Those of ordinary skill in the art will readily recognize that semiconductor light sources arranged in accordance with the principles of the invention need not simply be straight but may be shaped into various shapes, e.g., to form a ring resonator laser or a waveguide optical amplifier.