This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2022-100043, filed on Jun. 22, 2022; the entire contents of which are incorporated herein by reference.
Embodiments relate to a semiconductor memory device and a method of manufacturing a semiconductor memory device.
A known semiconductor memory device has bit lines, word lines, and memory cells connected to the bit lines and word lines. The semiconductor memory device can select a bit line and a word line and apply a voltage to write and read data to/from a memory cell.
A semiconductor memory device of an embodiment includes: a stack having an insulating layer and a conductive layer, the insulating layer and the conductive layer being stacked alternately in a first direction; a semiconductor layer provided through the insulating layer and the conductive layer; a memory layer provided between the stack and the semiconductor layer in a second direction intersecting with the first direction; and an insulation extending from the insulating layer toward the semiconductor layer in the second direction. The insulation and the memory layer define an interface therebetween in a cross-section along the first direction, the cross-section including the stack, the semiconductor layer, the memory layer and the insulation, the interface having a first point and a second point, the first point overlapping with a middle portion in the first direction of the insulating layer, the second point overlapping with an end portion in the first direction of the insulating layer. The second point is closer to the insulating layer in the second direction than the first point is. The interface curves from the first point to the second point to protrude toward the semiconductor layer.
An embodiment will be hereinafter described with reference to the drawings. The relation of the thickness and planar dimension of constituent elements illustrated in the drawings, a thickness ratio among the constituent elements, and so on may be different from actual ones. Further, in the embodiment, substantially the same constituent elements are denoted by the same reference signs and a description thereof will be omitted when appropriate.
In this specification, “connecting” includes not only physically connecting but also electrically connecting unless specified.
A configuration example of a semiconductor memory device will be described.
The memory cell array 100 includes a plurality of blocks BLK (BLK0 to BLK(L−1) (L is a natural number equal to or more than two)). The blocks BLK are each an assembly of a plurality of memory cells that store data.
The command register 101 retains a command signal CMD received from a memory controller. The command signal CMD includes command data that causes the sequencer 103 to execute a read operation, a write operation, or an erase operation, for instance.
The address register 102 retains an address signal ADD received from the memory controller. The address signal ADD contains a block address BA, a page address PA, and a column address CA, for instance. For example, the block address BA, the page address PA, and the column address CA are used for the selection of a block BLK, a word line WL, and a bit line BL respectively.
The sequencer 103 controls the operation of the memory. For example, based on the command signal CMD retained in the command register 101, the sequencer 103 controls the driver 104, the row decoder 105, the sense amplifier 106, and so on to execute an operation such as a read operation, a write operation, and an erase operation.
The driver 104 generates a voltage for use in the read operation, the write operation, the erase operation, and so on. The driver 104 includes, for example, a DA converter. Then, for example, based on the page address PA retained in the address register 102, the driver 104 applies the generated voltage to a signal line corresponding to the selected word line WL.
Based on the block address BA retained in the address register 102, the row decoder 105 selects a corresponding one of the blocks BLK in the memory cell array 100. Then, the row decoder 105 transfers the voltage applied to the signal line corresponding to the selected word line WL to the selected word line WL in the selected block BLK, for instance.
In the write operation, the sense amplifier 106 applies a desired voltage to each bit line BL according to write data DAT received from the memory controller. In the read operation, based on the voltage of the bit line BL, the sense amplifier 106 determines data stored in the memory cell and transfers the determination result as read data DAT to the memory controller.
The communication between the memory and the memory controller supports a NAND interface standard, for instance. For example, the communication between the memory and the memory controller uses a command latch enable signal CLE, an address latch enable signal ALE, a write enable signal WEn, a read enable signal REn, a ready/busy signal RBn, and an input/output signal I/O.
The command latch enable signal CLE indicates that an input/output signal I/O received by the memory is a command signal CMD. The address latch enable signal ALE indicates that the received signal I/O is an address signal ADD. The write enable signal WEn is a signal instructing the memory to receive the input/output signal I/O. The read enable signal REn is a signal instructing the memory to output an input/output signal I/O.
The ready/busy signal RBn is a signal notifying the memory controller whether the memory is in a ready state in which it accepts a command from the memory controller or in a busy state in which it does not accept the command.
The input/output signal I/O is a signal with, for example, an eight-bit width and can include signals such as a command signal CMD, an address signal ADD, and a write data signal DAT.
The memory and the memory controller described above may be combined to constitute one semiconductor memory device. Examples of such a semiconductor memory device include a memory card such as an SD card and a solid state drive (SSD).
Next, a circuit configuration example of the memory cell array 100 will be described.
The block BLK includes a plurality of string units SU. The string units SU each include a plurality of NAND strings NS. It should be noted that the number of the string units SU is not limited though
The NAND strings NS are each connected to one of the plurality of bit lines BL (BL0 to BL(N−1) (N is a natural number equal to or more than two)). The NAND strings NS each include, for example, memory transistors MT, a select transistor ST1, and a select transistor ST2. The memory transistors MT each constitute the single memory cell MC. The NAND strings NS each have the plurality of memory cells connected in series. The memory including such memory cells is also called a chain-type memory.
The memory transistors MT each include a control gate and a charge storage layer and are capable of nonvolatile data retention. The memory transistors MT may be of a MONOS type using an insulating film as the charge storage layer or may be an FG type using a conductive layer as the charge storage layer. Hereinafter, in the embodiment, the MONOS type will be taken as an example in the description.
The control gates of the memory transistors MT are each connected to corresponding one of the word lines WL. One of a source and a drain of one of the plurality of memory transistors MT is connected to the other of a source and a drain of the other of the plurality of memory transistors MT.
The select transistor ST1 is used for the selection of a string unit SU in various operations. The number of the select transistors ST1 is not limited.
The select transistor ST2 is used for the selection of a string unit SU in various operations. The number of the select transistors ST2 is not limited.
In each of the NAND strings NS, a drain of the select transistor ST1 is connected to corresponding one of the bit lines BL. A source of the select transistor ST1 is connected to one end of the memory transistor MT connected thereto in series. The other end of the memory transistor MT connected in series is connected to a drain of the select transistor ST2.
In the same block BLK, sources of the select transistors ST2 are connected to a source line SL. Gates of the select transistors ST1 of the string units SU are connected respectively to corresponding selection gate lines SGD. Gates of the memory transistors MT are connected respectively to corresponding word lines WL. Gates of the select transistors ST2 are connected respectively to corresponding selection gate lines SGS.
The NAND strings NS assigned the same column address CA in the plurality of blocks BL are connected to the same bit line BL. The source lines SL are connected between the plurality of blocks BLK.
Next, structure examples of the NAND string NS will be described.
The NAND string NS illustrated in
The stacks 1 each include conductive layers 11 and insulating layers 12. Each conductive layer 11 and each insulating layer 12 are alternately stacked along the Z-axis direction. The conductive layers 11 constitute the word lines WL and gate electrodes of the memory transistors MT and extend along the X-axis direction. The insulator 2 extends along the direction in which the conductive layers 11 and the insulating layers 12 are stacked (Z-axis direction), for instance.
The semiconductor layer 3 penetrates through the stacks 1 along the Z-axis direction. The semiconductor layer 3 forms a channel region of the memory transistors MT. The semiconductor layer 3 is electrically connected to the bit line BL and the source line SL.
The memory layer 4 is provided on the opposite side of on the semiconductor layer 3 from the insulator 2. The memory layer 4 is provided between the conductive layers 11 and the semiconductor layer 3 in the X-axis direction or the Y-axis direction.
The memory layer 4 has a block insulation film 41, a charge storage film 42, and a tunnel insulation film 43.
Next, an example of a method of forming the example of the NAND string NS illustrated in
First, as illustrated in
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In the NAND string NS illustrated in
The NAND string NS illustrated in
Each insulating layer 44 are provided between the corresponding conductive layer 11 and a charge storage film 42. The insulating layers 44 are provided in contact with the charge storage film 42. The insulating layers 44 function as charge storage films. The insulating layers 44 contain silicon nitride, for instance.
The insulating layers 45 are provided between the conductive layers 11 and the insulating layers 44. The insulating layers 45 contain silicon oxide, for instance. The insulating layers 45 function as block insulation films.
Next, an example of a method of forming the other example of the NAND string NS illustrated in
First, as illustrated in
Next, as illustrated in
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In the NAND string NS illustrated in
On the other hand, the NAND string NS of the embodiment has a first structure example or a second structure example to be described below, for instance. These structure examples will be described below.
As illustrated in
The stacks 1 each include a conductive layer 11 and an insulating layer 12. Each conductive layer 11 and each insulating layer 12 are alternately stacked along the Z-axis direction. Each conductive layer 11 constitute a word line WL and a gate electrode of a memory transistor MT and extend along the X-axis direction or the Y-axis direction. Examples of the conductive layers 11 include conductive layers such as tungsten layers. Examples of the insulating layers 12 include silicon oxide layers. Surfaces 11a, of the conductive layers 11, facing the memory layer 4 and surfaces 120a, of the insulating layers 12, facing the insulations 5 may be coplanar in the Z-axis direction. The conductive layers 11 each may have a stacked structure of a plurality of layers. The stacked structure may have, for example, a tungsten layer, a titanium nitride layer, and an aluminum oxide layer.
The insulator 2 is provided along the direction in which the conductive layers 11 and the insulating layers 12 are stacked (Z-axis direction), for instance. The insulator 2 functions as a core insulator. The insulator 2 has a pillar shape, for instance. Examples of the insulator 2 include a silicon oxide layer. The NAND string NS does not necessarily have to have the insulator 2.
As illustrated in
The memory layer 4 is provided on the semiconductor layer 3 on the opposite side of the insulator 2. The memory layer 4 is provided between the conductive layers 11 and the semiconductor layer 3 and between the insulating layers 12 and the semiconductor layer 3 in the X-axis direction or the Y-axis direction. As illustrated in
The memory layer 4 has a block insulation film 41, a charge storage film 42, and a tunnel insulation film 43. The block insulation film 41 is provided between the insulations 5 and the semiconductor layer 3 in the X-axis direction or the Y-axis direction and contains, for example, oxygen and silicon. The block insulation film 41 is provided and extends between each conductive layer 11 and the semiconductor film 3 and between each insulating layer 12 and the semiconductor film 3. In this case, the block insulation film 41 is in contact with each of the insulations 5. The charge storage film 42 is provided between the tunnel insulation film 43 and the block insulation film 41 in the X-axis direction or the Y-axis direction and contains, for example, nitrogen and silicon. The tunnel insulation film 43 is provided between the charge storage film 42 and the semiconductor layer 3 and contains, for example, oxygen, nitrogen, and silicon.
The insulations 5 extend in the X-axis direction or the Y-axis direction from the insulating layers 12 toward the semiconductor layer 3. The insulations 5 are provided on the surfaces 120a. The insulations 5 are provided between the insulating layers 12 and the memory layer 4. Each insulation 5 surrounds the semiconductor layer 3. Each insulation 5 contains, for example, silicon and oxygen. In the case where each insulation 5 contains the same materials as those of the insulating layers 12, the interface between the insulation 5 and the insulating layer 12 may not be clearly visually recognized even using a device such as, for example, a transmission electron microscope (TEM). In this case, a portion overlapping with a line connecting surfaces facing the block insulation film 41, of the conductive layers 11 above and under the insulating layer 12 may be regarded as the interface between the insulation 5 and the insulating layer 12. The insulation 5 may be not in contact with each of the conductive layers 11. The block insulation film 41 may be not in contact with each of the insulating layers 12. The block insulation film 41 may be in contact with each of the conductive layers 11.
In each interface, each second point is closer to the insulating layer 12 in the X-axis direction or the Y-axis direction than each first point is. Each interface has a round shape or an arch shape bulging toward the semiconductor layer 3. Each interface curves from each first point to the upper and lower second points to protrude or bulge toward the semiconductor layer 3. This reduces interference between the adjacent memory cells MC, for instance. For example, as illustrated in
In each of the interfaces, a distance D1 in the X-axis direction or the Y-axis direction between the second point and the third point is preferably not less than 0.5 nm nor more than 5 nm. If it is less than 0.5 nm, it is difficult to reduce electrical interface between the adjacent memory cells MC. If it exceeds 5 nm, an electric field concentrates on the middle portions 11M when, for example, a voltage is applied to a gate electrode WL, which may lower write efficiency.
The thickness (X-axis-direction or Y-axis-direction length) of the insulations 5 is preferably not less than 0.5 nm nor more than 5 nm. This indicates that all the regions including parts where the thickness of the insulations 5 is smallest up to parts where the thickness is largest may have a thickness of not less than 0.5 nm nor more than 5 nm.
Each insulation 5 may further contains carbon. The concentration of the carbon in each insulation 5 is preferably not less than 1 at. % nor more than 20 at. %. If it exceeds 20%, the insulation property of the insulation 5 worsen, which may cause leakage between the word lines L or may lower withstand voltage. In the case where the insulation 5 contains carbon, the insulating layer 12 and the insulation 5 can be distinguished by, for example, a difference in the carbon concentration. The carbon concentration in the insulation 5 is preferably higher than the carbon concentration in the insulating layers 12. That is, regions where the carbon concentration is less than 1 at. % can be defined as the insulating layer 12 and a region where the carbon concentration is not less than 1 at. % nor more than 20 at. % can be defined as the insulation 5. Further, the silicon concentration in the insulation 5 may be lower than the silicon concentration in the insulating layer 12. The element concentrations of the plurality of layers including the insulations 5 and the insulating layers 12 can be measured in an observation section by, for example, element analysis such as energy dispersive X-ray spectroscopy using a transmission electron microscope (TEM-EDX).
Being lower in relative dielectric constant than silicon oxide, carbon-containing silicon oxide is capable of reducing the fringe capacitance of the memory cells and increasing a coupling ratio of the memory transistors MT, and thus is capable of increasing the trapped electron density of regions, of the charge storage film 42, overlapping with the conductive layers 11 in the X-axis direction or the Y-axis direction at the time of, for example, data write to reduce electrical interference between the adjacent memory cells MC.
Next, an example of a method of forming the first structure example of the NAND string NS in the method of manufacturing the semiconductor memory device will be described with reference to
First, as illustrated in
Next, as illustrated in
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As described above, in the first structure example of the NAND string NS of the embodiment, the formation of the insulations 5 makes it possible to improve the trapped electron density of the regions, of the charge storage film 42, overlapping with the conductive layers 11 in the X-axis direction or the Y-axis direction to reduce electrical interference between the adjacent memory cells MC at the time of, for example, data write. Further, forming the insulations 5 in the shape curved to protrude toward the semiconductor layer 3 makes it possible to reduce field concentration near, for example, the end portions 12E. This can reduce operation failures of the memory cells MC.
As illustrated in
As illustrated in
The memory layer 4 is provided on the semiconductor layer 3 on the opposite side of the insulator 2. The memory layer 4 is provided between conductive layers 11 and the semiconductor layer 3 in the X-axis direction or the Y-axis direction.
The memory layer 4 has a block insulation film 41, a charge storage film 42, and a tunnel insulation film 43. The block insulation film 41 is provided between the insulations 5 and the semiconductor layer 3 in the X-axis direction or the Y-axis direction. The charge storage film 42 is provided between the tunnel insulation film 43 and the block insulation film 41 in the X-axis direction or the Y-axis direction. The tunnel insulation film 43 is provided between the charge storage film 42 and the semiconductor layer 3. For the other description of the block insulation film 41, the charge storage film 42, and the tunnel insulation film 43, the description of the block insulation film 41, the charge storage film 42, and the tunnel insulation film 43 illustrated in
The insulations 5 extend in the X-axis direction or the Y-axis direction from the insulating layers 12 toward the semiconductor layer 3. The insulations 5 are provided on surfaces 120a. The insulations 5 are provided between the insulating layers 12 and the memory layer 4. For the other description of the insulations 5, the description of the insulations 5 illustrated in
In the interfaces, the second point are closer to the insulating layer 12 than the first points in the X-axis direction or the Y-axis direction. The interfaces each have a round shape or an arch shape bulging toward the semiconductor layer 3. Each of the interface curves from the first point to the second points above and under the first point to protrude toward the semiconductor layer 3. For example, as illustrated in
In each of the interfaces, a distance D1 in the X-axis direction or the Y-axis direction between the second point and the third point is preferably not less than 2 nm nor more than 7 nm. If it is less than 2 nm, it is difficult to reduce electrical interface between the adjacent memory cells MC. If it exceeds 7 nm, an electric field concentrates on the middle portions 11M when a voltage is applied at the time of data write to the memory cells MC, which may lower write efficiency.
The insulations 5 each may have a thickness (X-axis-direction or Y-axis-direction length) that decreases from the first point toward the second points of the interfaces. The thickness of the insulations 5 is preferably not less than 2 nm nor more than 7 nm. This indicates that all the regions from the parts where the thickness of the insulations 5 is smallest up to the parts where the thickness is largest may have a thickness of not less than 2 nm nor more than 7 nm.
Each insulation 5 may further contain carbon. The concentration of the carbon in the insulation 5 is preferably not less than 1 at. % nor more than 20 at. %. If it exceeds 20%, the insulation property of the insulation 5 worsen, which may cause leakage between the word lines L or may lower withstand voltage. In the case where the insulations 5 contain carbon, the insulating layers 12 and the insulations 5 can be distinguished by, for example, a difference in the carbon concentration. The carbon concentration in the insulations 5 is preferably higher than the carbon concentration in the insulating layers 12. That is, a region where the carbon concentration is less than 1 at. % can be defined as the insulating layer 12 and a region where the carbon concentration is not less than 1 at. % nor more than 20 at. % can be defined as the insulation 5. Further, the silicon concentration in the insulation 5 may be lower than the silicon concentration in the insulating layer 12. The element concentrations of the plurality of layers including the insulations 5 and the insulating layers 12 can be measured in an observation section by, for example, element analysis such as TEM-EDX.
Being lower in relative dielectric constant than silicon oxide, carbon-containing silicon oxide is capable of reducing the fringe capacitance of the memory cells and increasing a coupling ratio of the memory transistors MT, and thus is capable of increasing the trapped electron density of regions, of the charge storage film 42, overlapping with the conductive layers 11 in the X-axis direction or the Y-axis direction at the time of, for example, data write, to reduce electrical interference between the adjacent memory cells MC.
The charge storage film 42 may have a thickness (X-axis-direction or Y-axis-direction length) that increases from the first points toward the second points of the interfaces. The thickness of the regions, of the charge storage film 42, overlapping with the first points is preferably smaller than the insulating pars 5. This makes it possible to reduce deterioration in data retention properties due to the spread of electrons in the charge storage film 42. The thickness of the charge storage film 42 is preferably, for example, not less than 2 nm nor more than 10 nm. If it is less than 2 nm, the charge trapping performance worsens to lower, for example, write characteristics. If it exceeds 10 nm, electrical interference between the adjacent memory cells MC becomes large.
The charge storage film 42 has regions 42a overlapping with the conductive layers 11 in the X-axis direction or the Y-axis direction and regions 42b overlapping with the insulations 5 in the X-axis direction or the Y-axis direction. In
Next, an example of a method of forming the second structure example of the NAND string NS in the method of manufacturing the semiconductor memory device will be described with reference to
First, after up to the block insulation film 41 is formed by the process illustrated in
Next, as illustrated in
Next, as in the first structure example, as illustrated in
Next, as in the first structure example, as illustrated in
As described above, in the second structure example of the NAND string NS, the thickness of the charge storage film 42 varies in the Z-axis direction, which makes it possible to reduce deterioration in the data retention properties due to the spread of the electrons in the charge storage film 42. Further, increasing the thickness of the charge storage film 42 from the first points toward the second points of the interfaces makes it possible to form the charge storage film 42 with a high quality without increasing an aspect ratio of a memory hole MH, which makes it possible to reduce deterioration in the charge retention properties, for instance. Consequently, operation failures of the memory cells MC can be reduced.
The constituent elements of the second structure example may be appropriately combined with the constituent elements of the first structure example.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2022-100043 | Jun 2022 | JP | national |