Semiconductor module

Information

  • Patent Grant
  • D974311
  • Patent Number
    D974,311
  • Date Filed
    Wednesday, January 6, 2021
    4 years ago
  • Date Issued
    Tuesday, January 3, 2023
    2 years ago
  • US Classifications
    Field of Search
    • US
    • D13 101
    • D13 110
    • D13 112
    • D13 118
    • D13 120
    • D13 123
    • D13 133
    • D13 146
    • D13 147
    • D13 159
    • D13 154
    • D13 156
    • D13 174
    • D13 182
    • D13 184
    • D13 199
    • D14 356
    • D14 433
    • D14 435
    • D14 438
    • CPC
    • H01R24/00
    • H01R12/00
    • H01R12/70
    • H01R13/62
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;



FIG. 2 is a rear, bottom and left side perspective view thereof;



FIG. 3 is a front view thereof;



FIG. 4 is a rear view thereof;



FIG. 5 is a top plan view thereof;



FIG. 6 is a bottom plan view thereof;



FIG. 7 is a right side view thereof; and,



FIG. 8 is a left side view thereof.


The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines is translucent.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2020-015961 D Jul 2020 JP national
US Referenced Citations (19)
Number Name Date Kind
D790491 Hayashida Jun 2017 S
D796459 Iwai Sep 2017 S
D824866 Matsubara Aug 2018 S
D845921 Saito Apr 2019 S
D853341 Kurz Jul 2019 S
D853343 Nii Jul 2019 S
D856947 Nii Aug 2019 S
D864884 Yoneyama Oct 2019 S
D873227 Yoneyama Jan 2020 S
D900759 Majima Nov 2020 S
D901405 Saito Nov 2020 S
D903611 Sannai Dec 2020 S
D904325 Omichi Dec 2020 S
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D923591 Aoki Jun 2021 S
D932452 McBride Oct 2021 S
D945384 Yamauchi Mar 2022 S
20220190556 Kigoshi Jun 2022 A1
20220231003 Mimori Jul 2022 A1
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Number Date Country
3290197 Apr 2003 CN
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D1128311 Dec 2001 JP
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D1563907 Nov 2016 JP
D1563908 Nov 2016 JP
D1563910 Nov 2016 JP
D1692093 Aug 2021 JP
D1711446 Mar 2022 JP
Non-Patent Literature Citations (2)
Entry
DigiKey, No Announcement Date [online], retrieved on Sep. 6, 2022, retrieved from internet, https://www.xppower.com/resources/press-releases/high-voltage-dc-dc-power-module-for-scientific-and-semiconductor-applications.
AP power, Announced on Sep. 30, 2020 [online], retrieved on Sep. 6, 2022, retrieved from internet, https://web.archive.org/web/20200930054949/https://www.xppower.com/resources/press-releases/high-voltage-dc-dc-power-module-for-scientific-and-semiconductor-applications.