Semiconductor module

Information

  • Patent Grant
  • D827591
  • Patent Number
    D827,591
  • Date Filed
    Thursday, April 20, 2017
    7 years ago
  • Date Issued
    Tuesday, September 4, 2018
    5 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/02
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/428
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front view of a semiconductor module showing our new design;



FIG. 2 is a rear view of the semiconductor module of FIG. 1;



FIG. 3 is a left side view of the semiconductor module of FIG. 1;



FIG. 4 is a right side view of the semiconductor module of FIG. 1;



FIG. 5 is a top view of the semiconductor module of FIG. 1;



FIG. 6 is a bottom view of the semiconductor module of FIG. 1;



FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,



FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 5.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2016-023736 Oct 2016 JP national
US Referenced Citations (37)
Number Name Date Kind
5347160 Sutrina Sep 1994 A
D357672 Terasawa Apr 1995 S
D364383 Yamada Nov 1995 S
D364384 Shimizu Nov 1995 S
D364385 Shimizu Nov 1995 S
5512782 Kobayashi Apr 1996 A
D389808 Yamada Jan 1998 S
D476959 Yamada Jul 2003 S
6774465 Lee Aug 2004 B2
D587662 Soutome Mar 2009 S
D648290 Mori Nov 2011 S
D703625 Lim Apr 2014 S
D704670 Chen May 2014 S
D710317 Chen Aug 2014 S
D710318 Chen Aug 2014 S
D710319 Chen Aug 2014 S
D712853 Nakamura Sep 2014 S
D721048 Nakamura Jan 2015 S
D721340 Nakamura Jan 2015 S
D748595 Bertalan Feb 2016 S
D754084 Kawase Apr 2016 S
D762185 Muehlensiep Jul 2016 S
D762597 Bertalan Aug 2016 S
D766851 Yoneyama Sep 2016 S
D767516 Yoneyama Sep 2016 S
D772184 Soyano Nov 2016 S
D773412 Yoneyama Dec 2016 S
D773413 Yoneyama Dec 2016 S
D774479 Soyano Dec 2016 S
D785577 Kawase May 2017 S
D798832 Hayashida Oct 2017 S
D799439 Hayashiguchi Oct 2017 S
D805485 Kawase Dec 2017 S
D810036 Sawayanagi Feb 2018 S
D810706 Soyano Feb 2018 S
D814431 Matsumoto Apr 2018 S
D814433 Soyano Apr 2018 S