Semiconductor module

Information

  • Patent Grant
  • D1012048
  • Patent Number
    D1,012,048
  • Date Filed
    Wednesday, September 15, 2021
    3 years ago
  • Date Issued
    Tuesday, January 23, 2024
    a year ago
  • US Classifications
    Field of Search
    • US
    • D13 123
    • D13 154
    • D13 173
    • D13 178
    • D13 182
    • D13 184
    • D13 199
    • D15 144
    • D15 1441
    • D15 199
    • CPC
    • H01M10/46
    • H01M10/425
    • H01M2/1022
    • H01R24/00
    • H01R12/592
    • H01R4/2433
    • H01R112/716
    • H01R13/6461
    • H01R13/506
    • H01R13/639
    • H01R13/5837
    • H01R13/6594
    • H01R13/16582
    • H02J7/0003
    • H02J7/0013
    • H02J7/044
    • H02J7/0045
    • H02J201/006
    • H05B3/143
    • H01L21/02
    • H01L21/64
    • H01L21/67
    • H01L21/68
    • C30B25/10
    • C23C16/44
    • C23C16/45
    • C23C16/4582
    • C23C16/4583
    • C23C16/4586
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;



FIG. 2 is a rear, bottom and left side perspective view thereof;



FIG. 3 is a front view thereof, the rear view being a mirror image of FIG. 3;



FIG. 4 is a top plan view thereof;



FIG. 5 is a bottom plan view thereof;



FIG. 6 is a right side view thereof;



FIG. 7 is a left side view thereof;



FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5 thereof;



FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5 thereof;



FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 5 thereof; and,



FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. 5 thereof.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2021-005674 D Mar 2021 JP national
US Referenced Citations (10)
Number Name Date Kind
D394244 Majumdar May 1998 S
D470463 Iwasaki Feb 2003 S
D472530 Iwasaki Apr 2003 S
D873226 Kanda et al. Jan 2020 S
D874411 Kanda et al. Feb 2020 S
D973029 Tanikawa Dec 2022 S
20160104654 Ushijima Apr 2016 A1
20190304946 Cottet Oct 2019 A1
20220319975 Matsuo Oct 2022 A1
20230037158 Legen Feb 2023 A1
Foreign Referenced Citations (4)
Number Date Country
D1615883 Oct 2018 JP
D1615885 Oct 2018 JP
D1615980 Oct 2018 JP
D1615981 Oct 2018 JP
Non-Patent Literature Citations (7)
Entry
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,875, dated Mar. 7, 2023, 11 pages.
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Ex parte Quayle Action issued for U.S. Appl. No. 29/808,053, dated Mar. 8, 2023, 11 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/808,055, dated Mar. 8, 2023, 11 pages.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619661.3, dated Jul. 24, 2023, 3 pages including English machine translation.
Notification to Make Rectification issued for Chinese Patent Application No. 202130619752.7, dated Jul. 24, 2023, 3 pages including English machine translation.