Semiconductor module

Information

  • Patent Grant
  • D832227
  • Patent Number
    D832,227
  • Date Filed
    Tuesday, May 2, 2017
    7 years ago
  • Date Issued
    Tuesday, October 30, 2018
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D13 110
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/32
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/171151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;



FIG. 2 is a rear, bottom, and left side perspective view thereof;



FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;



FIG. 4 is a top plan view thereof;



FIG. 5 is a bottom plan view thereof; and,



FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2016-024833 Nov 2016 JP national
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