Semiconductor module

Information

  • Patent Grant
  • D942404
  • Patent Number
    D942,404
  • Date Filed
    Friday, June 28, 2019
    5 years ago
  • Date Issued
    Tuesday, February 1, 2022
    3 years ago
Abstract
Description


FIG. 1 is a front view of a semiconductor module according to our new design;



FIG. 2 is a rear view of the semiconductor module of FIG. 1;



FIG. 3 is a top side view of the semiconductor module of FIG. 1;



FIG. 4 is a bottom side view of the semiconductor module of FIG. 1;



FIG. 5 is a left view of the semiconductor module of FIG. 1;



FIG. 6 is a right view of the semiconductor module of FIG. 1; and,



FIG. 7 is a perspective view illustrating the front, the top, and the left side of the semiconductor module of FIG. 1.


The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, the bottom view, and the perspective view represents a shape of a three-dimensional shape.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2019-000461 Jan 2019 JP national
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Entry
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