Semiconductor module

Information

  • Patent Grant
  • D884662
  • Patent Number
    D884,662
  • Date Filed
    Wednesday, November 7, 2018
    6 years ago
  • Date Issued
    Tuesday, May 19, 2020
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/12
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/428
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front view of a semiconductor module showing our new design;



FIG. 2 is a rear view of the semiconductor module of FIG. 1;



FIG. 3 is a left side view of the semiconductor module of FIG. 1;



FIG. 4 is a right side view of the semiconductor module of FIG. 1;



FIG. 5 is a top view of the semiconductor module of FIG. 1;



FIG. 6 is a bottom view of the semiconductor module of FIG. 1;



FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,



FIG. 8 is a top, rear, and left side perspective view of the semiconductor module of FIG. 1.


The portions of the semiconductor module shown in broken lines form no part of the claimed design.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (1)
Number Date Country Kind
2018-012139 Jun 2018 JP national
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Non-Patent Literature Citations (1)
Entry
Stegner et al., “New PrimePACK™ package to lever IGBT5”, PCIM Europe 2015, vol. 19 No. 21, May 2015, pp. 766-771.