Semiconductor module

Information

  • Patent Grant
  • D1021829
  • Patent Number
    D1,021,829
  • Date Filed
    Monday, September 13, 2021
    2 years ago
  • Date Issued
    Tuesday, April 9, 2024
    25 days ago
  • US Classifications
    Field of Search
    • US
    • D13 123
    • D13 154
    • D13 173
    • D13 178
    • D13 182
    • D13 184
    • D13 199
    • D15 144
    • D15 1441
    • D15 199
    • CPC
    • H01M10/46
    • H01M10/425
    • H01M2/1022
    • H01R24/00
    • H01R12/592
    • H01R4/2433
    • H01R112/716
    • H01R13/6461
    • H01R13/506
    • H01R13/639
    • H01R13/5837
    • H01R13/6594
    • H01R13/16582
    • H02J7/0003
    • H02J7/0013
    • H02J7/044
    • H02J7/0045
    • H02J201/006
    • H05B3/143
    • H01L21/02
    • H01L21/64
    • H01L21/67
    • H01L21/68
    • C30B25/10
    • C23C16/44
    • C23C16/45
    • C23C16/4582
    • C23C16/4583
    • C23C16/4586
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;



FIG. 2 is a rear, bottom and left side perspective view thereof;



FIG. 3 is a front view thereof;



FIG. 4 is a rear view thereof;



FIG. 5 is a top plan view thereof;



FIG. 6 is a bottom plan view thereof;



FIG. 7 is a right side view thereof; and,



FIG. 8 is a left side view thereof.


The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (2)
Number Date Country Kind
2021-005343 D Mar 2021 JP national
2021-005347 D Mar 2021 JP national
US Referenced Citations (20)
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Non-Patent Literature Citations (5)
Entry
Restriction Requirement issued for U.S. Appl. No. 29/807,561, dated Mar. 7, 2023, 12 pages.
Restriction Requirement issued for U.S. Appl. No. 29/807,563, dated Mar. 7, 2023, 12 pages.
Ex parte Quayle Action issued for U.S. Appl. No. 29/807,561, dated Aug. 22, 2023, 11 pages.
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Notification to Make Rectification issued for Chinese Patent Application No. 202130611619.7, dated Jul. 24, 2023, 3 pages including English machine translation.