FIG. 1 is a front view of a semiconductor module showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is a cross-sectional view thereof taken along line 8-8 of FIG. 5.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.