Semiconductor module

Information

  • Patent Grant
  • D814433
  • Patent Number
    D814,433
  • Date Filed
    Wednesday, October 12, 2016
    8 years ago
  • Date Issued
    Tuesday, April 3, 2018
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 678000
    • 257 684000
    • 257 690000
    • 257 691000
    • 361 679010
    • 361 713000
    • 361 728000
    • 361 736000
    • 361 760000
    • 361 761000
    • 361 772000
    • 361 775000
    • 361 783000
    • 361 820000
    • 174 250000
    • 174 253000
    • 438 015000
    • 438 025000
    • 438 026000
    • 438 051000
    • 438 055000
    • 438 063000
    • 438 064000
    • 438 106000
    • CPC
    • H01L21/00
    • H01L2224/42
    • H01L2224/43
    • H01L2021/00
    • H01L2021/02
    • H01L2021/04
    • H01L21/4814
    • H01L21/4846
    • H01L21/4871
    • H01L21/67144
    • H01L23/02
    • H01L23/13
    • H01L23/14
    • H01L23/147
    • H01L2924/171
    • H01L2924/1711
    • H01L2924/1715
    • H01L2924/17151
    • H01L2924/181
    • H01L2924/1811
    • H01L2924/1815
    • H01L2924/19042
    • H01L2924/1905
    • H01L2224/08054
    • H01L23/58
    • H05B41/14
    • H02B6/4201
    • G02B6/4256
    • G02B6/4257
    • G02B6/4261
    • G02B6/4262
    • G02B6/428
    • G02B6/4281
    • H05K1/14
    • H05K1/141
    • H05K1/142
    • H05K1/144
    • H05K1/18
    • H05K1/181
    • H05K1/182
    • H05K1/026
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front view of a semiconductor module showing our new design.



FIG. 2 is a rear view of the semiconductor module of FIG. 1.



FIG. 3 is a left side view of the semiconductor module of FIG. 1.



FIG. 4 is a right side view of the semiconductor module of FIG. 1.



FIG. 5 is a top view of the semiconductor module of FIG. 1.



FIG. 6 is a bottom view of the semiconductor module of FIG. 1.



FIG. 7 is a front, right, and bottom perspective view of the semiconductor module of FIG. 1; and,



FIG. 8 is a rear, left, and top perspective view of the semiconductor module of FIG. 1.


The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Terminals extend from a circumferential edge part of a front surface. Rhombic plate members having rounded corners are centered along the long sides of the rear view, such that the longer diagonal line of each rhombic plate member extends along a long side.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (3)
Number Date Country Kind
D2014-026634 Nov 2014 JP national
D2014-026635 Nov 2014 JP national
D2014-026636 Nov 2014 JP national
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Non-Patent Literature Citations (1)
Entry
U.S. Appl. No. 29/580,738, filed Oct. 12, 2016.
Divisions (1)
Number Date Country
Parent 29528214 May 2015 US
Child 29580736 US