FIG. 1 is a front view of a semiconductor module showing our new design.
FIG. 2 is a rear view of the semiconductor module of FIG. 1.
FIG. 3 is a left side view of the semiconductor module of FIG. 1.
FIG. 4 is a right side view of the semiconductor module of FIG. 1.
FIG. 5 is a top view of the semiconductor module of FIG. 1.
FIG. 6 is a bottom view of the semiconductor module of FIG. 1.
FIG. 7 is a front, right, and bottom perspective view of the semiconductor module of FIG. 1; and,
FIG. 8 is a rear, left, and top perspective view of the semiconductor module of FIG. 1.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Terminals extend from a circumferential edge part of a front surface. Rhombic plate members having rounded corners are centered along the long sides of the rear view, such that the longer diagonal line of each rhombic plate member extends along a long side.