Semiconductor module

Information

  • Patent Grant
  • D933618
  • Patent Number
    D933,618
  • Date Filed
    Wednesday, June 26, 2019
    6 years ago
  • Date Issued
    Tuesday, October 19, 2021
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D10 80
    • D10 103
    • D13 110
    • D13 133
    • D13 139
    • D13 154
    • D13 173
    • D13 182
    • D14 217
    • D14 432
    • D14 433
    • CPC
    • H01L20/4238
    • H01L23/528
    • H01L29/0696
    • H01L29/1095
    • H01L29/417
    • H01L29/66068
    • H01L29/1608
    • H01L29/7395
    • H01L29/7802
    • H01L29/66325
    • H01L29/66348
    • H01L29/161
    • H01L29/162
    • H01L29/163
    • H01L29/164
    • H01L29/165
    • H01L29/166
    • H01L29/167
    • H01L21/18
    • H01L21/19
    • H01L21/20
    • H01L21/21
    • H01L21/22
    • H01L21/23
    • H01L21/24
    • H01L21/25
    • H01L21/26
    • H01L21/27
    • H01L21/28
    • H01L21/29
    • H01L21/30
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front view of a semiconductor module showing our new design;



FIG. 2 is a rear view of the semiconductor module thereof;



FIG. 3 is a left view of the semiconductor module thereof;



FIG. 4 is a right view of the semiconductor module thereof;



FIG. 5 is a top side view of the semiconductor module thereof; and,



FIG. 6 is a bottom side view of the semiconductor module thereof.


The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, and the bottom view represents a shape of a three-dimensional shape.


Claims
  • The ornamental design for a semiconductor module, as shown and described.
Priority Claims (3)
Number Date Country Kind
D2018-23983 Oct 2018 JP national
D2018-23984 Oct 2018 JP national
D2018-23985 Oct 2018 JP national
US Referenced Citations (27)
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Foreign Referenced Citations (2)
Number Date Country
2002-076057 Mar 2002 JP
2008-066655 Mar 2008 JP