This application claims the benefit of the filing date of Taiwan Patent Application No. 103104862, filed Feb. 14, 2014, entitled “SEMICONDUCTOR PACKAGE AND METHOD THEREOF,” and the contents of which are hereby incorporated by reference in their entirety.
The present invention relates to a semiconductor package and method thereof, and more particularly, to a magneto-electric resistive random access memory chip package and method thereof.
A magneto-electric resistive random access memory (MRAM) chip mainly uses the self-spin characteristic of an electron in recording a “0” and “1” of a signal by the magneto resistive changes which is generated by the difference in the magnetization direction in the free layer of magnetic structure. The MRAM chip has the same working principle in saving data to a hard disk drive, where the saved data is permanently saved and the data cannot be altered unless there is external magnetic field affection. The MRAM chip has the same characteristics in low energy consumption and fast response with static random-access memory (SRAM) and the same characteristic in high density with dynamic random access memory (DRAM). In other words, the MRAM comprises the advantage of the SRAM and the DRAM and the opportunity of mass application of the MRAM is just around the corner.
Because of the operating characteristics of the MRAM, isolated unnecessary or non-read-write operating magnetic fields are needed. Therefore, a magnetic field shielding protection is needed in an MRAM package. The known external magnetic field shielding structure so far is using a metallic layer for shielding a chip to achieve the effect of magnetic field shielding. There are two ways of providing magnetic field shielding. One is the metallic layer attaching to the active surface of a chip directly, and the other is forming the metallic layer outside of the encapsulating material. The disadvantage of the first way of providing magnetic field shielding is that the metallic layer cannot provide the shielding protection to the wires links on the chip as the external magnetic field can affect the chip via the wire-bonding region and change the magneto resistance. The second way usually lets a portion of wires dispose outside of the encapsulating material, and sputtering coats the metallic layer outside of the encapsulating material. However, the second way needs specialized equipment, a complicated process, and makes wires sweep easily. While cutting the encapsulating material, the cutter will make contact with the metallic layer, then the burr and the wearing of the cutter will appear easily.
Accordingly, one aspect of the present invention is to provide a semiconductor package and method thereof to improve the disadvantages of prior art.
Accordingly, another aspect of the present invention is to provide a semiconductor package and method thereof which can cover the wire-bonding region, and the wires to prevent the wires from sweeping.
Accordingly, the other aspect of the present invention is to provide a semiconductor package and method thereof which does not need specialized equipment, and simplifies the process.
According to the aspects of the present invention above, the present invention provides a semiconductor package comprising a package carrier, a chip, a film, a first shielding metal plate, and an encapsulating material, wherein the package carrier has at least one conductive component; the chip has an active surface and a corresponding back surface, and the back surface of the chip is attached to the package carrier. Wherein at least one contact point is disposed on the active surface and electrically coupled to the conductive component by a wire; the film is disposed on the active surface and covering a portion of the wire; the first shielding metal plate is disposed on the film; the encapsulating material covering the chip, the wire, at least one portion of the package carrier, the film and at least one portion of the first shielding metal plate.
According to an embodiment, the semiconductor package further comprises a second shielding metal plate disposed between the chip and the package carrier, wherein the material of the first and the second shielding metal plate comprises iron-nickel alloy.
According to the embodiment of the semiconductor package, wherein the package carrier comprises a lead frame and the conductive component is a lead.
According to another embodiment of the semiconductor package, wherein the package carrier comprises a circuit board and the conductive component is a circuit.
According to the embodiment of the semiconductor package, wherein the chip comprises a magneto resistive random access memory (MRAM).
According to the aspects of the present invention above, the present invention provides a semiconductor package method comprising: providing a package carrier, with the package carrier having at least one conductive component; providing a chip, with the chip having an active surface and a corresponding back surface and the back surface of the chip being attached to the package carrier, wherein the active surface has at least one pad; electrically coupling the pad to the conductive component by a wire; providing a first shielding metal plate, with the first shielding metal plate having a film and is disposed on the active surface for covering the active surface and a portion of the wire; and providing an encapsulating material for covering the chip, the wire, at least one portion of the package carrier, the film and at least one portion of the first shielding metal plate.
According to an embodiment, the semiconductor package method before providing the chip, further comprising: attaching a second shielding metal plate to the package carrier with the back surface of the chip attached to the second shielding metal plate.
According to an embodiment, the semiconductor package method, wherein the material of the first and the second shielding metal plate comprises iron-nickel alloy.
According to an embodiment, the semiconductor package method, wherein the chip comprises a magneto resistive random access memory (MRAM).
According to the semiconductor package and method thereof provided by the present invention, the shielding metal plates can cover the wire-bonding region and the wires via the film to prevent wire sweeping. The shielding metal plates cover the active surface of the chip without using specialized equipment to simplify the process. The advantage and spirit of the invention may be understood by the following recitations together with the appended drawings.
The embodiments and the practical applications of the present invention will be described in the following paragraphs, so as to sufficiently explain the characteristics, spirits, and advantages of the invention.
It is worth noting that these embodiments are merely representative of the embodiments of the present invention, wherein an example of a specific method, apparatus, conditions, materials, etc. is not intended to limit the invention or the corresponding embodiment of the invention.
The following embodiments of the present invention of the semiconductor package and method thereof mainly focus on the package of an MRAM; however, it is not limited to the chip package mentioned above. Any chip that needs magnetic shielding can use the package structure and method of the present invention.
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Therefore, in the embodiment, the semiconductor package of the present invention comprises: the package carrier 100, the chip 110, the first shielding metal plate 122, the second shielding metal plate 106, and the encapsulating material 126. As shown in
It is worth noting that the first shielding metal plate 122 and the second shielding metal plate 106 can have the same design and volume, and in some embodiments, the first shielding metal plate 122 and the second shielding metal plate 106 can have a different design and volume.
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It is worth noting that the first shielding metal plate 122 not only provides the magnetic field shielding protection on the active surface 112 of the chip 110, but also provides an excellent heat dissipation path because of the metal material of the first shielding metal plate 122. Therefore, in some embodiments of the present invention, to strengthen the heat dissipation effect, the encapsulating material 126 optionally covers a portion of the first shielding metal plate 122 that is exposed to the outside surface to increase the heat dissipation effect, as shown in
In summary, in the semiconductor package and method thereof of the present invention, the shielding metal plate can cover the wire and wire-bonding region via the film, while covering the whole active surface of the chip. The shielding metal plate provides an excellent magnetic field shielding effect, and prevents wire sweeping. In addition, the process of covering the shielding metal plate to the active surface of the chip does not need a special entity which simplifies the whole process of semiconductor packaging.
With the example and explanations above, the features and spirits of the invention will be hopefully well described. Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
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103104862 | Feb 2014 | TW | national |