Semiconductor package

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Information

Patent Grant
D396696

References
Source

Patent Number
D396,696
Date Filed
Thursday, January 30, 1997
28 years ago
Date Issued
Tuesday, August 4, 1998
27 years ago

Inventors
- Yuichi Takagi
- Kazuhiko Ueda
Original Assignees
- Sony Corporation
Examiners
- Gandy; James
- Matta; Cathron B.
Agents
- Foley & Lardner

US Classifications
- D13 - Equipment for production, distribution, or transformation of energy
Field of Search
- US
- D13 182
- 174 522-524
- 206 710-719
- 257 254
- 257 659
- 257 666
- 257 678-697
- 257 709
- 257 730
- 257 738
- 257 780
- 257 796
- 437 183
- 437 217
- 437 220
- 361 730
International Classifications
- 1303
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for a semiconductor package, as shown and described.

US Referenced Citations (6)

Number	Name	Date	Kind
4538168	Van Dyk Soerewyn	Aug 1985
4600968	Sekiya et al.	Jul 1986
4681221	Chickanosky et al.	Jul 1987
5023703	Hidaka et al.	Jun 1991
5394009	Loo	Feb 1995
5493153	Arikawa et al.	Feb 1996