Exemplary embodiments of the present invention will be understood in more detail from the following descriptions taken in conjunction with the accompanying figures, in which;
Exemplary embodiments of the present invention will be described below in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those of ordinary skill in the art.
The tester 110 in the form of hardware (H/W) applies an electric signal to a semiconductor chip placed on a wafer (not shown) to test electric characteristics of the semiconductor chip. The prober 120 in the form of hardware (H/W) operating as a wafer transferring device places a wafer on an appropriate point of a chuck (not shown). Generally, an electric signal of the tester 110 is transferred into the wafer of the prober 120, and the tester 110 reads a test result from the prober 120 to determine whether there is a defect on the wafer or not.
The tester drives the prober 120, and needs to be actually connected to the prober 120 to examine defects of the wafer. That is, the tester 110 can not read data without the prober 120, such that it can not perform a normal test operation. The semiconductor test system 100 of this exemplary embodiment of the present invention, however, includes the emulator 130 and can perform a virtual test operation as if there is the prober 120.
Referring to
The test software 210 is an operating system software of the tester 110. The test software 210 receives an electric signal from the tester 110 through the first interface 131. The test software 210 generates a test command by using the electric signal of the tester 110. The test command is provided to the prober 120 through the second interface 132 or to the virtual prober software 220.
In an exemplary embodiment the test software 210 provides a test command to the virtual prober software 220 when the virtual prober software 220 is in an enable state. In this case, a virtual test operation is performed. When the virtual prober software 220 is in a disable state, however, the test software 210 provides a test command to the prober 120. In this case, a real test operation is performed.
The prober software 220 is connected to the test software 210 through the Ethernet. Besides the Ethernet, the prober software 220 may also be connected to the test software 210 through semaphores, a local area network, and a message queue.
The virtual prober software 220 receives a test command from the test software 210 during a virtual test operation. The virtual prober software 220 performs a virtual test operation in response to the test command. The virtual test result is delivered into the test software 210 again. The virtual prober software 220 emulates the prober 120 as if an actual prober 120 operates. The virtual prober software 220 virtually generates data identical to that from the actual prober 120 and then sends the data into the test software 210.
Since the tester 110 determines testing of a device by using data, it can not distinguish an actual test result outputted from the actual prober 120 from a virtual test result outputted from the emulator 130. A buffer memory 230 of the emulator 130 includes a plurality of commands corresponding to various test signals of the tester 110 and their processed results, such that the emulator 130 emulates the actual prober 120.
The process unit 221 analyzes the test command inputted through the input/output unit 221. That is, the process unit 221 determines whether a new test command is inputted from tire input/output unit 221, and whether the inputted test command is suitable for a predetermined format. The process unit 221 delivers the virtual test result into the input/output unit 221.
The control unit 222 controls the buffer memory 230 or the monitor 240 according to the processed result of the process unit 221. The control unit 222 notifies a user of an error situation when there is an error in an inputted test command or when there is an error in the virtual test result. Although a monitor 240 is illustrated in
First, the test software 210 of
When the virtual prober software 220 is not in the enable state, that is, No, a test command is applied to the actual prober 120 of
Next an operation of the virtual prober software 220 is described. In operation S310, the virtual prober software 220 determines whether a test command is inputted from the test software 210. An operation S310 repeats until the test command is inputted, and it proceeds to an operation S320 when the test command is inputted,
In operation S320, the process unit 222 of
In this exemplary embodiment, the process unit 222 detects the test result stored in the buffer memory 230 in response to the test command. The process unit 222 verifies whether there is an error in the virtual test result. This will be described in more detail with reference to
In operation S330, the virtual prober software 220 determines whether there was an error in operation S320. When there is an error in operation S320, that is, Yes, the control unit 223 of
In operation S140, the test software 210 sends the actual test result provided from the actual prober 120 or tire virtual test result provided from the virtual prober software 220 into the tester 110 and ends.
A conventional semiconductor test system requires an actual prober for driving tests. Additionally, a wafer is loaded in the actual prober. Accordingly, when conventionally developing a test or a test program, the prober needs to be set up. The semiconductor test system of the exemplary embodiment of the present invention, however, outputs a virtual test result as if the actual prober is installed without actually doing so. According to exemplary embodiments of the present invention, the inconvenience such as an actual prober setup during test or test program development and connection for the test may be resolved.
The semiconductor test system of the exemplary embodiment of the present invention outputs a test result as if the actual prober is installed, without the actual prober having to be installed. According to the exemplary embodiment of the present invention, an actual prober setup during test or test program development can be eliminated.
The above-disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other exemplary embodiments, which fall within the true spirit and scope of the present invention. Thus, to the maximum extent allowed by law, the scope of the present invention is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.
Number | Date | Country | Kind |
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2006-55560 | Jun 2006 | KR | national |
This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 2006-55560, filed on Jun. 20, 2006, the entire contents of which are hereby incorporated by reference.