Semiconductor wafer processing tape

Abstract

Description

FIG. 1 is a perspective view showing our new design;

FIG. 2 is a top plan view;

FIG. 3 is a bottom plan view;

FIG. 4 is a left side view;

FIG. 5 is a front side view;

FIG. 6 is a right side view;

FIG. 7 is a cross sectional view at 7—7 of FIG. 1; and,

FIG. 8 is a cross sectional view at 8—8 of FIG. 1.

Claims

The ornamental design for a “semiconductor wafer processing tape,” as shown and described.