Semiconductor wafer with dicing positions for solar cell fabrication

Information

  • Patent Grant
  • D720313
  • Patent Number
    D720,313
  • Date Filed
    Monday, June 16, 2014
    10 years ago
  • Date Issued
    Tuesday, December 30, 2014
    10 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 257 628000
    • 257 668000
    • 257 678000
    • 257 684000
    • 257 618000
    • 257 627000
    • 361 713000
    • 324 537000
    • 324 757030
    • 324 757040
    • 324 761010
    • 324 762010
    • 324 762020
    • 324 762030
    • 324 762050
    • D06 300
    • D06 309
    • D09 428
    • D09 433
    • D25 138
    • D25 139
    • D25 140
    • D25 155
    • D25 156
    • D25 157
    • 117 095000
    • 438 142000
    • 438 149000
    • 438 150000
    • 438 689-692
    • 438 697000
    • 438 113000
    • 438 033000
    • 438 460-465
    • 029 025350
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a top perspective view of a semiconductor wafer with dicing positions for a solar cell fabrication showing our new design;



FIG. 2 is a front side elevation view thereof;



FIG. 3 is a rear side elevation view thereof;



FIG. 4 is a top plan view thereof;



FIG. 5 is a bottom plan view thereof;



FIG. 6 is a left side elevation view thereof; and,



FIG. 7 is a right side elevation view thereof.


Claims
  • The ornamental design for a semiconductor wafer with dicing positions for solar cell fabrication, as shown and described.
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