The field to which the disclosure generally relates includes sensor devices and methods of making them and using them to measure variables.
In a number of variations, sensor devices may be used to measure environmental conditions or variables pertaining to components.
A number of variations may include a product comprising: a substrate; and a sensor device comprising a non-conductive layer and a conductive layer overlying the non-conductive layer wherein the sensor device is constructed and arranged to measure or monitor a variable comprising at least one of temperature, pressure, volatile organic compound concentration, state of charge, or state of health of the substrate.
A number of variations may include a method comprising: providing a substrate; providing a non-conductive layer and overlying the substrate with the non-conductive layer; providing a conductive layer and overlying the non-conductive layer with the conductive layer to form a sensor device constructed and arranged to measure or monitor at least one variable comprising at least one of temperature, pressure, volatile organic compound concentration, state of charge, or state of health of the substrate.
A number of variations may include a method comprising: providing a substrate; providing a sensor device electronically coupled to the substrate comprising a non-conductive layer and a conductive layer overlying the non-conductive layer constructed and arranged to measure or monitor at least one variable comprising at least one of temperature, pressure, volatile organic compound concentration, state of charge, or state of health of a substrate; determining at least one of deformation of the non-conductive layer or substrate, or change in resistance of the conductive layer to provide measurement or monitoring of the at least one variable based on at least one calculation.
Other illustrative variations within the scope of the invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while disclosing variations within the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Select examples of variations within the scope of the invention will become more fully understood from the detailed description and the accompanying drawings, wherein:
The following description of the variations is merely illustrative in nature and is in no way intended to limit the scope of the invention, its application, or uses.
In a number of variations, the non-conductive layer 16 may include a polymeric material. The non-conductive layer 16 may comprise a polymer including, but not limited to, Acrylonitrile butadiene styrene (ABS), Polymethyl Methacrylate (PMMA), Celluloid, Cellulose acetate, Cycloolefin Copolymer (COC), Ethylene-Vinyl Acetate (EVA), Ethylene vinyl alcohol (EVOH), Fluoroplastics (including PTFE, FEP, PFA, CTFE, ECTFE, ETFE) Ionomers, Kydex™, a trademarked acrylic/PVC alloy, Liquid Crystal Polymer (LCP), Polyacetal (POM or Acetal), Polyacrylates (Acrylic), Polyacrylonitrile (PAN or Acrylonitrile), Polyamide (PA or Nylon), Polyamide-imide (PAI), Polyaryletherketone (PAEK or Ketone), Polybutadiene (PBD), Polybutylene (PB), Polybutylene terephthalate (PBT), Polycaprolactone (PCL), Polychlorotrifluoroethylene (PCTFE), Polyethylene terephthalate (PET), Polycyclohexylene dimethylene terephthalate (PCT), Polycarbonate (PC), Polyhydroxyalkanoates (PHAs), Polyketone (PK), Polyester, Polyetheretherketone (PEEK), Polyetherketoneketone (PEKK), Polyetherimide (PEI), Polyethersulfone (PES), Polysulfone, Polyethylenechlorinates (PEC), Polyimide (PI), Polylactic acid (PLA), Polymethylpentene (PMP), Polyphenylene oxide (PPO), Polyphenylene sulfide (PPS), Polyphthalamide (PPA), Polystyrene (PS), Polysulfone (PSU), Polytrimethylene terephthalate (PTT), Polyurethane (PU), Polyvinyl acetate (PVA), Polyvinyl chloride (PVC), Polyvinylidene chloride (PVDC), Styrene-acrylonitrile (SAN), polycarbonate+acrylonitrile butadiene styrene mix (ABS+PC), Polypropylene (PP) (including, but not limited to, impact, random, and homo), Polyethylene (PE) (including, but not limited to, linear low density, linear high density), combinations or blends in any amount thereof, or may be another type. In a number of variations, the non-conductive layer 16 may be a combination of the above polymers in any amount or concentration. In a number of variations, the non-conductive layer 16 may include a composite layer comprising several layers of the materials listed. In a number of variations, the non-conductive layer 16 may be formed via a method including, but not limited to, injection molding, extrusion molding, structural foam, vacuum forming, extrusion blow molding, a hand lay-up operation, a spray lay-up operation, a pultrusion operation, a chopped strand mat, vacuum bag molding, pressure bag molding, autoclave molding, resin transfer molding, vacuum assisted resin transfer molding, bladder molding, compression molding, mandrel wrapping, wet layup, chopper gun, filament winding, melting, staple fiber, continuous filament, lamination, or may be formed another way.
In a number of variations, the conductive layer 18 may include a metallic or semi-metallic material. In a number of variations, the conductive layer 18 may include a metal including, but not limited to, plastic steel, stainless steel, copper, nickel, tin, gold, silver, molybdenum, palladium, tungsten, graphite, zinc, iron, bronze, aluminum, titanium, platinum, silicide, or may be another type), metallic alloys, graphite, graphene, another form of carbon, combinations thereof, or may be another type. In a number of variations the conductive layer may include a non-metal material that conducts electric current sufficient to measure changes in impedance or resistance. In a number of variations, the conductive layer 18 may be a combination of the materials in any amount or concentration. In a number of variations, the conductive layer 18 may include a composite layer comprising several layers of the materials. In a number of variations, the conductive layer 18 may be formed on or overlying the non-conductive layer 16 via a method including, but not limited to, inkjet/laser printing, 3-D printing, casting, extrusion, forging, plating (electroless, electro), plasma spraying, aerosol spraying, thermal spraying, dip coating, roll-to-roll coating, spin coating, spray coating, chemical solution deposition, thermal evaporation, pulsed laser deposition, cathodic arc deposition, or known etching techniques (i.e. sputter, Chemical Vapor Deposition, Physical Vapor Disposition, Atomic Vapor Disposition, ALD, or combination of deposition and thermal growth), conversion coating, ion beam mixing, thin film printing, or may be formed another way.
In a number of variations, the at least one lead 22 may include a conductor such as a metal material, and may be used to measure resistance or impedance in an area of interest. In a number of variations, the at least one lead 22 may include a metal including, but not limited to, plastic steel, stainless steel, copper, nickel, tin, gold, silver, molybdenum, palladium, tungsten, graphite, zinc, iron, bronze, aluminum, titanium, platinum, silicide, or may be another type), metallic alloys, combinations thereof, or may be another type of electrical conducting material. In a number of variations, the at least one lead 22 may be a combination of materials in any amount or concentration. In a number of variations, the at least one lead 22 may include a composite layer comprising several layers of materials. In a number of variations, the at least one lead 22 may be formed on or overlying the conductive layer 18, or otherwise in contact therewith (such as being formed on the non-conductive layer 16), via a method including, but not limited to, inkjet/laser printing, 3-D printing, casting, extrusion, forging, plating (electroless, electro), plasma spraying, thermal spraying, dip coating, roll-to-roll coating, spin coating, spray coating, chemical solution deposition, thermal evaporation, pulsed laser deposition, cathodic arc deposition, or known etching techniques (i.e. sputter, Chemical Vapor Deposition, Physical Vapor Disposition, Atomic Vapor Disposition, ALD, or combination of deposition and thermal growth), conversion coating, ion beam mixing, thin film printing, or may be formed another way. In a number of variations, the at least one lead 22 may be attached to the conductive layer 18, or the non-conductive layer 16, through an adhesive comprising at least one of, silver paste, acrylonitrile, cyanoacrylate, acrylic, resorcinol glue, epoxy resin, epoxy putty, ethylene-vinyl acetate, phenol formaldehyde resin, polyamide, polyester, polyethylene, polypropylene, polysulfides, polyurethane, polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl chloride emulsion, polyvinylpyrrolidone, rubber cement, silicone, combinations thereof, or may be another type. The contact between the impedance leads and the conductive surface may be ohmic or nearly ohmic. A conductive adhesive may be used or a metal with direct contact to the conducting layer may be applied by printing, CVD, PVD, or another process. In a number of variations as shown in
In a number of variations, the sensor device 14 may be physically attached to the substrate 12 via an attachment 50. In a number of variations, the attachment 50 may include an adhesive including at least one of, acrylonitrile, cyanoacrylate, acrylic, resorcinol glue, epoxy resin, epoxy putty, ethylene-vinyl acetate, phenol formaldehyde resin, polyamide, polyester, polyethylene, polypropylene, polysulfides, polyurethane, polyvinyl acetate, polyvinyl alcohol, polyvinyl chloride, polyvinyl chloride emulsion, polyvinylpyrrolidone, rubber cement, UV-cure, silicone, combinations thereof, or may be another type.
In a number of variations, the sensor device 14, non-conductive layer 16, and/or conductive layer 18 may operate as or include a strain gauge. In a number of variations, the sensor device 14, non-conductive layer 16, and/or conductive layer 18 may be used to operate as a strain gauge to measure state of charge (SOC) or state of health (SOH) of a battery, or other status, by measuring deformation of the substrate 12 and/or non-conductive layer 16, or change in resistance of the conductive layer 18 through at least one calculation. In a number of variations, SOC or SOH calculation may include several percent changes in resistance over the charge window and larger variations for lower state of health. With reference to
In a number of variations, thermal expansion of non-conductive layer 16 and conductive layer 18 may be compensated through variations in sensor layout, or by factoring out thermal expansion determined to occur at various temperatures. For example, the sensor device 14 may be thermally insulated, or comparisons may be made with a reference sensor device. In a number of variations thermal expansion due to battery operation may be monitored to identify heat thresholds. Multiple leads 22 may be used to pinpoint a location of deformation, wherein different changes may be detected through different leads at positioned at known locations In a number of variations, the sensor device 14, non-conductive layer 16, and/or conductive layer 18 may be used to operate as a strain gauge to measure compounds such as volatile organic compounds (VOC's) in vapor state by measuring deformation of the substrate 12 and/or non-conductive layer 16, or change in resistance of the conductive layer 18 through at least one calculation. In a number of variations, the VOC's may include, but are not limited to, aromatic hydrocarbons, octane, ketones, or aldehydes, glycols, or may be another compound. In a number of variations, resistance changes comparable to SOC changes, though with a significantly different temporal response, may be registered for VOC sensing. In a number of variations electrochemical energy storage in the battery 13 may be monitored for a generation of a VOC, indicative of a monitored condition. In a number of variations, the presence of VOC's may indicate electrolyte decomposition within the substrate 12 or battery, may indicate leaks within the substrate 12 as a pouch, casing or housing, or may indicate another VOC generating event as the monitored condition. In a number of variations, electrolyte decomposition may decrease the life cycle of the battery.
In a number of variations, placement of a plurality of sensor devices 14 onto various locations on or in close proximity to a substrate 12 may decouple the deformation measurements of the substrate 12 and/or non-conductive layer 16 to provide more accurate measurement and monitoring on deformation related to SOC or SOH versus deformation related to the presence of VOC's. Comparable resistance changes may be indicated by all three but all may have a different temporal response. SOC changes may be cyclical in nature, SOH changes may be persistent, and VOC induced changes may be rapid and may be sustained. In a number of variations, this may allow the sensor device 14 or plurality of sensor devices 14 to measure the presence of VOC's in relation to the substrate 12 independent of the state of charge or state of health measurements of the substrate 12 via a calculation and may be measured independent of SOC or SOH measurement through the use of the PTC thermocouple.
In a number of variations, spikes in the measured resistance, as illustrated as spike 29 in
With reference again to
Also, in a number of variations, the data acquisition module (DAQ) 24, battery control module (BCM) 23, or electronic control module (ECM) 25, may be configured to provide storage for data received by or loaded to the at least one of the other of the data acquisition module (DAQ) 24, battery control module (BCM) 23, or electronic control module (ECM) 25, or to the at least one sensor device 14, or to a different component of a vehicle, or the like, for processor-executable instructions or calculations. The data, calculations, and/or instructions may be stored, for example, as look-up tables, formulas, algorithms, maps, models, and/or any other suitable format. The memory may include, for example, RAM, ROM, EPROM, and/or any other suitable type of storage article and/or device.
In a number of variations, the interfaces may include, for example, analog/digital or digital/analog converters, signal conditioners, amplifiers, filters, other electronic devices or software modules, and/or any other suitable interfaces. The interfaces may conform to, for example, RS-232, parallel, small computer system interface, universal serial bus, CAN, MOST, LIN, FlexRay, and/or any other suitable protocol(s). The interfaces may include circuits, software, firmware, or any other device to assist or enable the data acquisition module (DAQ) 24, battery control module (BCM) 23, or electronic control module (ECM) 25, in communicating with other devices.
In a number of variations, the methods or parts thereof may be implemented in a computer program product including instructions or calculations carried on a computer readable medium for use by one or more processors to implement one or more of the method steps or instructions. The computer program product may include one or more software programs comprised of program instructions in source code, object code, executable code or other formats; one or more firmware programs; or hardware description language (HDL) files; and any program related data. The data may include data structures, look-up tables, or data in any other suitable format. The program instructions may include program modules, routines, programs, objects, components, and/or the like. The computer program may be executed on one processor or on multiple processors in communication with one another.
In a number of variations, the program(s) can be embodied on computer readable media, which can include one or more storage devices, articles of manufacture, or the like. Illustrative computer readable media include computer system memory, e.g. RAM (random access memory), ROM (read only memory); semiconductor memory, e.g. EPROM (erasable, programmable ROM), EEPROM (electrically erasable, programmable ROM), flash memory; magnetic or optical disks or tapes; and/or the like. The computer readable medium also may include computer to computer connections, for example, when data may be transferred or provided over a network or another communications connection (either wired, wireless, or a combination thereof). Any combination(s) of the above examples is also included within the scope of the computer-readable media. It is therefore to be understood that the method may be at least partially performed by any electronic articles and/or devices capable of executing instructions corresponding to one or more steps of the disclosed methods.
In a number of variations, as shown in
As detailed above, the sensor device 14 may have multiple advantages including superior long term stability of the sensor since the polymer's chemical reactivity to the ambient environment is decoupled from the transduction mechanism through inclusion of the conductive layer 18, a faster response, and a higher degree reversibility since the transduced signal does not rely on a chemical interaction between the polymer and analyte. Use of the non-conducting layer 16 supports performance without a need to be shielded the sensor device 14 from water and oxygen since the polymer will not degrade over time. The sensor device 14 may be used for analyte detection, identification, classification, and/or tracking through a polymer non-conducting layer 16 with conductive layer 18 that may be provided as a coating on the non-conducting layer 16. Electrical resistance or impedance changes may be used for analyte classification. Signal processing for the detection, identification, classification and/or tracking of a narrow band of likely analyte. Tuning sensitivity for a specific analyte may be accomplished by altering the composition of the non-conductive layer 16. For example, PMMA may be used due to its sensitivity to polar compounds while PE or PP may be used due to their sensitivity to nonpolar species. An array of sensors with unique response to individual analyte may be used for classifications. Examples of uses of the products and methods described herein may include food quality inspection, pharmaceutical processing, chemical synthesis, beverage processing, monitoring for health purposes, cosmetic production, manufacturing plant monitoring, vehicle interior air quality, residential air evaluation, vehicle shed testing, or any application where the monitoring, detection, identification, classification, and/or tracking of analytes is desired.
The following description of variants is only illustrative of components, elements, acts, product and methods considered to be within the scope of the invention and are not in any way intended to limit such scope by what is specifically disclosed or not expressly set forth. The components, elements, acts, product and methods as described herein may be combined and rearranged other than as expressly described herein and still are considered to be within the scope of the invention.
Variation 1 may include a product that may include a substrate; and a sensor device comprising a non-conductive layer and a conductive layer overlying the non-conductive layer wherein the sensor device is constructed and arranged to measure or monitor a variable comprising at least one of temperature, pressure (strain), volatile organic compound concentration, state of charge, or state of health of the substrate.
Variation 2 may include a product as set forth in Variation 1 wherein the substrate is a battery.
Variation 3 may include a product as set forth in any of Variations 1-2 wherein the substrate is a cooling fin.
Variation 4 may include a product as set forth in any of Variations 1-3 wherein the non-conductive layer comprises Polymethyl Methacrylate.
Variation 5 may include a product as set forth in any of Variations 1-4 wherein the conductive layer comprises graphite.
Variation 6 may include a product as set forth in any of Variations 1-5 wherein the sensor device may be mechanically and thermally coupled to the substrate and the conductive layer may be electrically isolated from substrate.
Variation 7 may include a product as set forth in any of Variations 1-6 wherein the sensor device further comprises a data acquisition module.
Variation 8 may include a product as set forth in any of Variations 1-7 wherein the data acquisition module is electrically coupled to an electronic control module of a vehicle.
Variation 9 may include a product as set forth in any of Variations 1-8 wherein the variable is measured via at least one of deformation of the non-conductive layer or substrate, or change in resistance of the conductive layer through at least one calculation.
Variation 10 may include a method that may include providing a substrate; providing a non-conductive layer and overlying the substrate with the non-conductive layer; providing a conductive layer and overlying the non-conductive layer with the conductive layer to form a sensor device constructed and arranged to measure or monitor at least one variable comprising at least one of temperature, pressure (strain), volatile organic compound concentration, state of charge, or state of health of the substrate.
Variation 11 may include a method as set forth in Variation 10 wherein the substrate is a battery.
Variation 12 may include a method as set forth in any of Variations 10-11 wherein the substrate is a cooling fin.
Variation 13 may include a method as set forth in any of Variations 10-12 wherein the non-conductive layer comprises Polymethyl Methacrylate.
Variation 14 may include a method as set forth in any of Variations 10-13 wherein the conductive layer may comprise graphite or graphenes.
Variation 15 may include a method as set forth in any of Variations 10-14 wherein the sensor device may be mechanically and thermally coupled to the substrate and the conductive layer may be electrically isolated from the substrate.
Variation 16 may include a method as set forth in any of Variations 10-15 wherein the sensor device further comprises a data acquisition module.
Variation 17 may include a method as set forth in any of Variations 10-16 wherein the data acquisition module is electrically coupled to an electronic control module of a vehicle.
Variation 18 may include a method as set forth in any of Variations 10-17 wherein the conductive layer is spray-coated overlying the non-conductive layer.
Variation 19 may include a method as set forth in any of Variations 10-18 further comprising attaching the sensor to the substrate through an attachment.
Variation 20 may include a method that may include providing a substrate; providing a sensor device mechanically and thermally coupled to the substrate comprising a non-conductive layer and a conductive layer overlying the non-conductive layer constructed and arranged to measure or monitor at least one variable comprising at least one of temperature, pressure, volatile organic compound concentration, state of charge, or state of health of a substrate; and determining at least one of deformation of the non-conductive layer or substrate, or change in resistance of the conductive layer to provide measurement or monitoring of the at least one variable based on at least one calculation.
The above description of select variations within the scope of the invention is merely illustrative in nature and, thus, variations or variants thereof are not to be regarded as a departure from the spirit and scope of the invention.
This application is a U.S. National-Stage entry under 35 U.S.C. § 371 based on International Application No. PCT/US16/30023, filed Apr. 29, 2016, which was published under PCT Article 21(2) and claims benefit of U.S. Provisional Application No. 62/186,568 filed Jun. 30, 2015.
Filing Document | Filing Date | Country | Kind |
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PCT/US16/30023 | 4/29/2016 | WO | 00 |
Number | Date | Country | |
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62186568 | Jun 2015 | US |