SENSOR MODULE

Abstract

A sensor module including a sensor and a transparent body which is provided over the sensor, wherein the transparent body comprises a base portion and a convex lens which extends outwardly from the base portion and is located above the sensor, wherein an opaque material is provided on the base portion and surrounds the convex lens.

Description

Claims

1. A sensor module comprising a sensor and a transparent body which is provided over the sensor, wherein the transparent body comprises a base portion and a convex lens which extends outwardly from the base portion and is located above the sensor, wherein an opaque material is provided on the base portion and surrounds the convex lens, wherein the opaque material is provided in a recess in the transparent body, the recesses surrounding the convex lens.

2. The sensor module of claim 1, wherein the opaque material is in contact with the convex lens.

3. The sensor module of claim 1 wherein the opaque material is in contact with a bottom portion of the convex lens.

4. The sensor module of claim 1 wherein the base portion of the transparent body has a substantially flat upper surface.

5. (canceled)

6. The sensor module of claim 5, wherein an inner edge of the recess corresponds with an outer edge of the convex lens.

7. The sensor module of claim 5, wherein the recess is generally circular.

8. The sensor module of claim 5, wherein the recess includes one or more outwardly extending arms.

9. The sensor module of claim 5, wherein the recess has a depth of at least 50 microns.

10. The sensor module of claim 1, wherein the opaque material is formed from a material that was liquid and that has been cured to become solid.

11. The sensor module of claim 1, wherein the opaque material is a polymer.

12. The sensor module of claim 11, wherein the polymer is opaque at near infrared wavelengths.

13. The sensor module of claim 11, wherein the polymer is curable using light.

14. The sensor module of claim 1, wherein the transparent body is transfer moulded or compression moulded.

15. The sensor module of claim 1, further comprising a substrate which supports the transparent body, and further comprising a cover which is supported by the substrate, the cover including an opening through which the convex lens projects.

16. The sensor module of claim 15, wherein the opaque material and the cover together substantially prevent light from being incident upon the sensor unless that light has passed through the convex lens.

17. A method of making a sensor module, the method comprising: providing a transparent body over a sensor, the transparent body comprising a convex lens extending from a base portion;delivering liquid to the base portion such that the liquid surrounds the convex lens, wherein a recess which surrounds the convex lens is formed in the base portion, and wherein the liquid flows in the recess to surround the convex lens; andcuring the liquid in order to convert the liquid into an opaque solid.

18. The method of claim 17, wherein the liquid is opaque.

19. (canceled)

20. The method of claim 17, wherein the liquid is delivered to an outwardly extending arm of the recess.

21. The method of claim 17, wherein the liquid has a viscosity of less than 500 Pas.

22. The method of claim 17, wherein the liquid is delivered around the convex lens and adjacent to the convex lens, so that the liquid surrounds the convex lens.

23. The method of claim 22, wherein the liquid has a viscosity of at least 100 Pas.

24. The method of claim 22, wherein the liquid moves inwardly and forms a meniscus against the convex lens.

25. The method of claim 17, wherein the liquid is delivered from a nozzle which forms part of an inkjet head.

26. The method of claim 17, wherein the sensor module is one of a plurality of sensor modules provided in an array.

27. The method of claim 26, further comprising providing the sensor modules of the array with covers, the covers being provided as a single piece which is fitted to the array of sensor modules such that the convex lenses of the sensor modules project through openings in the covers.

28. The method of claim 27, further comprising dicing the array of sensor modules to form individual sensor modules.