Patent Application
20180358502
The present invention relates to a sensor substrate comprising a mounting area for mounting a sensor element, and to a sensor device.
In an electronic apparatus such as a mobile phone or a tablet PC (Personal Computer), an optical sensor device comprising a light-emitting element and a light-receiving element has been used. The sensor device is constructed by arranging a light-emitting element and a light-receiving element in juxtaposition on an upper surface of a substrate. Light is emitted outwardly from the light-emitting element, and, the light reflected by a target object such as a user of the electronic apparatus is sensed by the light-receiving element. In response to the sensing of the light, for example, the approach of the target object is sensed.
From the viewpoint of downsizing such a sensor device in plan view, it has been considered advisable to arrange the light-emitting element and the light-receiving element separately in a vertical direction of the substrate. In this case, the light reflected by the target object (reflected light) passing through a through hole provided in the substrate is received by the light-receiving element (for example, refer to Patent Literature 1).
Patent Literature 1: U.S. Unexamined Patent Application Publication No. 2013/0341650
Patent Literature 2: Japanese Unexamined Patent Publication JP-A 2011-49473
SUMMARY OF INVENTION
The inventors of the invention have accomplished the invention with their attentions focused on the fact that reflected light from a target object and the other light than the reflected light, which is regarded as undesired light, enter a through hole at different angles of incidence.
A sensor substrate according to one aspect of the invention comprises a substrate comprising an upper surface including a first mounting area for mounting a light-emitting element, and a lower surface including a second mounting area for mounting a light-receiving element. The substrate is further provided with a through hole therethrough extending from a portion of the upper surface which portion is adjacent to the first mounting area, to the second mounting area of the lower surface. An inner surface of the through hole is provided with at least one protrusion extending inwardly within the through hole.
A sensor device according to one aspect of the invention, comprises: the sensor substrate mentioned above; a light-emitting element mounted on the first mounting area; a light-transmitting sealing material which covers the light-emitting element; and a light-receiving element having a light-receiving portion. The light-receiving element is mounted on the second mounting area so that the light-receiving portion faces an opening of the through hole.
Now reference to the accompanying drawings, a sensor substrate in accordance with an embodiment of the invention will be described below. In what follows, for convenience in illustrating the invention, vertically opposite sides of the construction will be designated as the upper and lower sides, it being understood that such a designation is not intended to be limiting of the orientation of the sensor substrate and a sensor device 20 in actual use. Moreover, a light-transmitting part is not hatched in the drawings to be hereafter referred to, even in the sectional view.
The sensor substrate 10 of the present embodiment comprises a substrate 1 shaped in a quadrangular plate having an upper surface 1a and a lower surface 1b which are shaped in, for example, a quadrangular form. The upper surface 1a of the substrate 1 is provided with a first mounting area 2 for mounting a light-emitting element 11. The lower surface 1b of the substrate 1 is provided with a second mounting area 3 for mounting a light-receiving element 12.
The sensor device 20 of the present embodiment is constructed by mounting the light-emitting element 11 on the first mounting area 2, and mounting the light-receiving element on the second mounting area 3. The sensor device 20 thus constructed is installed in an electronic apparatus. For example, the installed sensor device 20 is used as an optical proximity sensor device 20. Examples of the electronic apparatus include a mobile phone such as a smartphone, a PC such as a tablet PC, and an automotive sensor apparatus. Each such sensor apparatus is one of various types of an electronic apparatus having optical detection capability.
The substrate 1 is provided with a through hole 4 therethrough extending across the upper surface 1a and the lower surface 1b thereof. The upper opening of the through hole 4 is adjacent to the first mounting area 2 of the upper surface 1a of the substrate 1. A distance between the through hole 4 and the first mounting area 2 is set at about 1.2 to 1.5 mm, for example. In the example shown in
The first mounting area 2 may be provided with a wiring conductor (not shown) which is electrically connected to the light-emitting element 11. For example, the wiring conductor may be formed so as to extend from the first mounting area 2 to the interior of the substrate 1, and from there to the outer surface of the sensor substrate 10. The outer surface of the sensor substrate 10 corresponds to, for example, the lower surface 1b of the substrate 1, or the lower surface of a frame portion 1c which will hereafter be described, etc. Via the wiring conductor, electrical connection is established between the light-emitting element 11 and an external electric circuit (not shown). Examples of the external electric circuit include an electronic circuit provided in a circuit board such as a motherboard incorporated in an electronic apparatus.
Moreover, the second mounting area 3 may also be provided with a wiring conductor similar to that as above described. The wiring conductor may be formed so as to extend from the second mounting area 3 to the outer surface of the substrate 1. Just as is the case with the light-emitting element 11, the wiring conductor may be electrically connected to the light-receiving element 12 for establishing electrical connection between the light-receiving element 12 and an external electric circuit.
The lower opening of the through hole 4 is positioned within the second mounting area 3. For example, the second mounting area 3 corresponds to the central region of the lower surface 1b of the substrate 1. In the example shown in
The substrate 1 in the sensor substrate 10 of the present embodiment may be regarded as a type which has a recess (so-called cavity) for receiving therein the light-receiving element 12 on a lower surface side thereof. That is, in the substrate 1 as seen in transparent plan view, the through hole 4 is provided so as to be adjacent to the first mounting area 2, as well as to lie within the recess. In other words, the through hole 4 is located at a position where incidence of light emitted from the light-emitting element 11 mounted at a certain distance from the through hole 4 (reflected light) is easy. In addition, the through hole 4 is located at a position where the reflected light is easily passed toward the light-receiving element 12 mounted immediately below the through hole 4.
The through hole 4 serves to enable transmission and reception of light between the first mounting area 2 and the second mounting area 3. By the transmission and reception of light, detection of a target object (not shown) approaching the electronic apparatus is performed.
More specifically, the light emitted outwardly from the light-emitting element 11 mounted on the first mounting area 2 is reflected by the target object existing outside the sensor device 20, and the light (reflected light) returns to the sensor device 20. The reflected light passes through the through hole 4, and is sensed by the light-receiving element 12 mounted on the second mounting area 3. By the sensing of the reflected light, for example, the existence or approach of the target object is detected.
When the electronic apparatus in which the sensor device is installed is, for example, a mobile phone such as a smartphone, then the target object is the face of a mobile phone user. In the sensor device 20 installed as a proximity sensor device in a smartphone which is the electronic apparatus, light is emitted outwardly (upwardly) from the light-emitting element 11. When the target object, viz., user's face, approaches the electronic apparatus, the light is reflected by the target object, and then returns to the sensor device 20, and the amount of incident light (luminous flux) entering the through hole 4 is increased. The increase of the light amount is detected by the light-receiving element 12, and the approach of the target object, for example, user's move to start smartphone operation, is detected.
For example, a gallium-arsenide (Ga—As) light-emitting (infrared-emitting) diode may be used as the light-emitting element 11. On the other hand, for example, a photodiode (infrared photodiode) may be used as the light-receiving element 12. Light to be received by or emitted from each element may be infrared rays. The light-receiving element 12 is composed of a main body (no reference numeral) composed of a semiconductor substrate such for example as a silicon substrate, and a light-receiving portion 12a located on part of the upper surface of the main body. The main body of the light-receiving element 12 may be additionally provided with a logic circuit or the like for processing information about light reception. In the sensor device 20, with the placement of an illuminance sensor-specific detecting circuit on a light-receiving element 12—bearing side thereof, in addition to the described proximity sensor function, an illuminance sensor function can also be attained.
The light-receiving element 12 needs to be configured to receive reflected light which passes through the through hole 4 as described above. Thus, the light-receiving element 12 is mounted so that a light-receiving portion 12a thereof faces the lower-end opening of the through hole 4.
Examples of the material for forming the substrate 1 include a ceramic material, and a composite material containing an organic resin material and a ceramic material. Examples of the ceramic material include ceramic sintered body materials such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, and a mullite sintered body. Examples of the organic resin material include epoxy resin, polyimide resin, polyamide-imide resin, and phenol resin.
For example, in the case where the substrate 1 is formed of an aluminum oxide sintered body, the substrate 1 can be produced in the following manner. To begin with, raw material powder such as aluminum oxide and silicon oxide is kneaded with suitable organic binder and organic solvent to prepare a slurry. The slurry is then shaped into sheet form by the doctor blade method or lip coater method to prepare a ceramic green sheet. After that, the ceramic green sheet is cut into a plurality of sheets each having predetermined shape and dimensions. The plurality of sheets are laminated on top of each other into a laminated body, and, the laminated body is fired. The substrate 1 can be produced by the procedure mentioned above.
The frame portion 1c may be formed of a material similar to that used for the substrate 1 (body portion in flat-plate form) by a method similar to that adopted for the formation of the substrate 1. In this case, the ceramic green sheet is punched into a frame-like sheet. The frame-like sheet is laminated on the lower side of the above-described laminated body which becomes the substrate 1, and, the sheet and the laminated body are co-fired. In this way, the substrate having the frame portion 1c can be integrally formed.
The inner surface of the through hole 4 is provided with at least one protrusion extending inwardly within the through hole 4. In this embodiment, as will hereafter be described, a plurality of protrusions (a first protrusion 5 and a second protrusion 6) are arranged on the inner surface of the through hole 4. For example, as shown in
In the sensor substrate 10 of the embodiment, undesired light having a relatively large angle of incidence, or equivalently, undesired light which enters the through hole 4 at a lower angle, is effectively blocked by the protrusion lying within the through hole 4. Thus, it is possible to provide the sensor substrate 10 which facilitates manufacture of the sensor device 20 in which the likelihood of undesired light reception by the light-receiving element 12 is effectively diminished.
Moreover, the sensor device 20 of the embodiment comprises the sensor substrate 10 having the above-described structure. Thus, it is possible to provide the sensor device 20 in which the likelihood of undesired light reception by the light-receiving element 12 is effectively diminished.
In the sensor substrate 10 and the sensor device 20 having the above-described structure, the through hole 4 has a quadrangular shape such as a rectangular shape in plan view. The opening at the upper end of the through hole 4 is slightly greater in size than at least the light-receiving portion 12a. For example, each side of the opening of the through hole 4 has a dimension larger than each side of the light-receiving portion 12a by about 100 to 300 μm in plan view.
Moreover, in the sensor substrate 10 and the sensor device 20 having the above-described structure, the dimensions of the first protrusion 5 and the second protrusion 6 (the extending length of each protrusion within the through hole 4) are suitably set to the extent that would permit easy passage of the reflected light A through the through hole 4. For example, the dimensions of the first protrusion 5 and the second protrusion 6 in plan view are set to the extent that would bring most part of the light-receiving portion 12a into view within the through hole 4.
In the sensor substrate 10 and the sensor device 20 of the present embodiment, the through hole 4 of the substrate 1 is formed by, for example, boring a hole through the ceramic green sheet which becomes the substrate 1 (cut sheet having predetermined shape and dimensions) in the thickness direction. Then, a plurality of the cut sheets are laminated together so that their holes are continuous with each other in the vertical direction, thus forming the through hole 4 extending through the substrate 1 in the thickness direction.
Moreover, for example, the first protrusion 5 and the second protrusion 6 lying on the inner surface of such a through hole 4 may be formed of a material similar to that used for the substrate 1 by a method similar to that adopted for the formation of the substrate 1. When laminating together a plurality of the sheets each having a hole for forming the through hole 4 as described above, some sheets may be laminated while being displaced from the others so that the part surrounding the hole protrudes inwardly within the through hole 4 obtained after the lamination of the sheets, and may be co-fired. The protruding parts of the displaced sheets become the first protrusion 5 and the second protrusion 6.
In this case, the ceramic green sheets having parts forming the first protrusion 5 and the second protrusion 6 may contain pigments, such as chromium oxide or molybdenum oxide, which are effective for absorption and interception of light (infrared rays).
Moreover, the first protrusion 5 and the second protrusion 6 may be formed of a ceramic material which differs from that used for the substrate 1, or a material other than a ceramic material such as an organic resin material or a metal material.
In this case, there is used a material which is useful in restraining light from entering the through hole 4 by light (infrared rays) absorption or reflection. Examples of such a material include a resin material with a filler such as a carbon filler added, and a mirror-finished metal material such as molybdenum.
In a case where the substrate 1 is formed of an organic resin material, the through hole 4 having a protrusion of predetermined shape can be formed in the substrate 1 in the following manner, for example. That is, the shaping of the organic resin material is effected with use of a mold capable of forming a protrusion having a predetermined design. The shaping process using the mold permits production of the substrate 1 provided with the through hole 4 having a protrusion such as the first protrusion 5 and the second protrusion 6. Also in this case, for example, a colorant which lends itself to interception of undesired light such as infrared rays may be added to the organic resin material.
Moreover, the light-emitting element 11 may be covered and sealed with a light-transmitting sealing material 13 formed of a light-transmitting resin material such as silicone resin or epoxy resin. This makes it possible to protect the light-emitting element 11 from an external environment, and thereby improve the long-term reliability of the sensor device 20.
The light-receiving element 12 may also be covered and sealed with a sealing material 14 formed of a resin material such as silicone resin or epoxy resin. The sealing material 14 may be a colored material intended to keep undesired light from entering the light-receiving portion 12a from below the sensor device 20.
As in the example shown in
When at least one protrusion is provided, it is possible to reduce the possibility of the passage of undesired light having a relatively large angle of incidence through the through hole 4. Moreover, by forming the plurality of protrusions, the possibility of the passage of undesired light through the through hole 4 is reduced.
In this case, since the first protrusion 5 is disposed at the upper end of the through hole 4 on the first mounting area 2 side, the distance from the first mounting area 2 to the opening of the through hole 4 is increased. This leads to an increase in the angle of incidence of undesired light which tries to enter into the opening of the through hole 4 from the first mounting area 2. Hence, the first protrusion 5 serves to reduce the possibility that undesired light will enter the through hole 4. Moreover, the second protrusion 6 is disposed at the lower end of the through hole 4 on the side opposite to the first mounting area 2. This arrangement makes it possible to effectively reduce the possibility that undesired light reflected by a part of the inner surface of the through hole 4 which part lies above the second protrusion 6 (upper side surface) will travel further toward the second mounting area 3. Hence, the second protrusion 6 makes it possible to effectively reduce the possibility of undesired light entry into the second mounting area 3.
Moreover, since the first protrusion 5 and the second protrusion 6 are disposed apart from each other, reflected light having a small angle of incidence is allowed to travel between the first protrusion 5 and the second protrusion 6 so as to reach the second mounting area 2. In this case, as described previously, the dimensions of the first protrusion 5 and the second protrusion 6 are set to the extent that would allow the reflected light A to pass through the through hole 4 so as to be received by the light-receiving portion 12a. By way of example, as described previously, in the case where the through hole 4 has a quadrangular opening having a dimension of about 500 to 1000 μm square, the first protrusion 5 and the second protrusion 6 each have a quadrangular shape having a dimension of about 150 μm by 100 μm.
In the example shown in
In this case, the vertical dimension of a part of the inner surface of the through hole 4 which part lies above the second protrusion 6 (upper side surface) becomes small. That is, the possibility that the undesired light beam B will strike the part of the inner surface of the through hole 4 which part lies above the second protrusion 6 is reduced. Therefore, the amount of undesired light reflected by the upper side surface is reduced. Thus, the amount of undesired light reflected downwardly by the upper side surface for travel to the second mounting area 3 is reduced.
Hence, in the sensor substrate 10 and the sensor device 20 of this modified example, the possibility of undesired light reception by the light-receiving element 12 mounted on the second mounting area 3 is effectively reduced. This makes it possible to provide the sensor device 20 which detects the approach of a target object with high detection accuracy when used as a proximity sensor, for example.
By way of example, a vertical dimension H1 of the first protrusion 5 is about 125 μm, and a vertical dimension H2 of the second protrusion 6 is about 200 μm.
In the example shown in
In this case, undesired light reflected by the upper side surface toward the first mounting area 2 (light beam B) is effectively blocked by the second protrusion 6 having a relatively large dimension in the reflection direction of the light beam B.
Thus, also in the sensor substrate 10 and the sensor device 20 of this modified example, the possibility of undesired light reception by the light-receiving element 12 mounted on the second mounting area 3 is effectively reduced.
By way of example, a lateral dimension L1 of the first protrusion 5 is about 150 μm, and a lateral dimension L2 of the second protrusion 6 is about 200 μm.
Moreover, as in the example shown in
The projection 7 is lower in height than the light-emitting element 11 mounted on the first mounting area 2. Since the height of the projection 7 is lower than the height of the light-emitting element 11, the possibility that the projection 7 will interfere with outward emission of light from the light-emitting element 11 is efficiently reduced. Moreover, the possibility of mechanical damage to the projection 7 is reduced.
By the projection 7, the possibility that undesired light having a large angle of incidence will enter the through hole 4 is reduced. Thus, in this case, in conjunction with the above-described effects of the protrusion within the through hole 4, the possibility that undesired light will enter the second mounting area 3 through the through hole 4 can be effectively reduced.
For example, the projection 7 may be formed of a material similar to that used for the substrate 1 by a method similar to that adopted for the formation of the substrate 1. For example, in the case where the projection 7 is formed of a ceramic material similar to that used for the substrate 1, the projection 7 can be formed in the following manner. Raw material powder similar to that used for forming the substrate 1 (aluminum oxide, etc.) is kneaded with an organic solvent to prepare a paste. After that, the paste is applied to a predetermined location on the ceramic green sheet which becomes the substrate 1, and, the paste and the ceramic green sheet which becomes the substrate 1 (laminated body) are co-fired. In this way, the projection 7 can be formed integrally with the substrate 1 comprising the first protrusion 5, the second protrusion 6, the frame portion 1c, etc.
In the case where the substrate 1 is formed of an organic resin material, with use of the above-described mold adapted to have a portion conforming to the shape of the projection 7, the organic resin material can be molded into the substrate 1 with an integral projection part. In this way, the substrate 1 having the projection 7 can be produced.
In addition, pigments or the like which is effective for interception of undesired light such as infrared rays by light absorbing or reflecting capability, may be added to the projection 7.
In the sensor substrate 10 and the sensor device 20 of the above-described embodiment, the substrate 1 and the protrusion may be integrally formed of the same ceramic material.
In this case, both the mechanical strength of the protrusion and the strength of connection of the protrusion to the substrate 1 can be effectively enhanced. Moreover, each of the first protrusion 5 and the second protrusion 6 exhibits relatively high mechanical strength in itself. Therefore, the possibility of mechanical damage to the substrate 1 including the first protrusion 5 and the second protrusion 6 is effectively reduced. Thus, this construction is effective also for improvement in the long-term reliability of the sensor substrate 10 and the sensor device 20.
Moreover, since the substrate 1, the first protrusion 5, and the second protrusion 6 can be integrally formed through one co-firing process, this is also advantageous from the viewpoint of productivity.
The sensor device 20 of the embodiment comprises: the sensor substrate 10 having any one of the above-described structures; the light-emitting element 11 mounted on the first mounting area 2; the light-transmitting sealing material 13 which covers the light-emitting element 11; and the light-receiving element 12 having the light-receiving portion 12a, the light-receiving element 12 being mounted on the second mounting area 3 so that the light-receiving portion 12a faces the opening of the through hole 4.
According to such a sensor device 20, since the sensor device comprises the sensor substrate 10 having the above-described structure, it is possible to effectively reduce the possibility of undesired light reception by the light-receiving element 12.
The light-emitting element 11 and the light-receiving element 12 are fixedly joined to the first mounting area 2 and the second mounting area 3, respectively, via, for example, a brazing material such as a low-melting-point brazing metal containing solder, or a joining material such as an adhesive or glass (not shown).
The light-emitting element 11 and the light-receiving element 12 may be electrically connected to an external electric circuit via, for example, a wiring conductor as described earlier. Electric power for light emission (photoelectric conversion) from the external electric circuit is supplied, via the wiring conductor, to the light-emitting element 11, and, the light-receiving element 12 transmits information about the detection of reflected light.
In the sensor device 20 of this modified example, a plurality of light-emitting elements 11 are mounted on the first mounting area 2.
Since the plurality of light-emitting elements 11 are mounted on the first mounting area 2, it is possible to provide the sensor device 20 which easily and effectively detects the approach of a target object in a plurality of directions. In the example shown in
In the example shown in
In this case, the first protrusion 5 disposed at the upper end of the through hole 4 on the first mounting area 2 side is elongated in the opposite direction away from the first mounting area 2. This leads to further increase in the angle of incidence of undesired light which tries to enter into the opening of the through hole 4 from the first mounting area 2. Hence, the possibility that undesired light will enter the through hole 4 is reduced by the first protrusion 5.
In this case, the protrusion which is thinner than the substrate 1 is located close to the outside of the construction. Therefore, for example, the sensor device 20 needs to be handled carefully to avoid mechanical damage such as chipping to the protrusion. From the standpoint of reducing the possibility of such a mechanical damage, the earlier described construction in which the second protrusion 6 has a relatively large lateral dimension is suitable for this purpose.
Moreover, in the example shown in
The light-transmitting material 15 may be formed from a material similar to that used for the earlier described light-transmitting sealing material 13 by a method similar to that adopted for the formation of the light-transmitting sealing material 13. For example, as practiced in the example shown in
In the alternative, the light-transmitting material 15 may be disposed so that part thereof extends upwardly beyond the upper end of the through hole 4 (not shown). Moreover, the light-transmitting material 15 may have a filter function to cut light which is not subjected to detection, such as ultraviolet rays.
In the example shown in
Also in this case, by providing the protrusion 7, it is possible to enhance the effect of reducing the possibility that the undesired light beam B will enter the through hole 4.
Moreover, in the example shown in
In this case, for example, when the light-receiving portion 12a of the light-receiving element 12 is smaller in size than the opening of the through hole 4 in plan view, the possibility of arrival of undesired light at the light-receiving portion 12a is effectively reduced. When the light-receiving portion 12a which is smaller than the opening of the through hole 4 in plan view is located at the center of the through hole 4 as seen in plan view, it is advantageous in the following point. That is, it is possible to reduce the entry of undesired light into the through hole 4 in a position other than the light-receiving portion 12a while sufficiently securing opening dimensions for the light-receiving portion 12a.
Accordingly, it is possible to provide the sensor device 20 in which the possibility of undesired light reception by the light-receiving portion 12a is effectively reduced. In addition, it is possible to provide the sensor substrate 10 which facilitates manufacture of such a sensor device 20.
It should be understood that the invention is not limited to the embodiments and modified examples thereof as described heretofore, and that various changes are possible without departing from the scope of the invention. For example, the inner surface of the through hole 4 may be made greater in surface roughness (made rougher) than, for example, the upper surface 1a of the substrate 1. This makes it possible to enhance the strength of connection of the light-transmitting material 15 to the through hole 4, for example.
Moreover, an exposed surface of the wiring conductor may be covered with a plating layer composed of nickel, gold, etc. Besides, the frame portion 1c may be omitted from the construction (not shown). In the absence of the frame portion 1c, a spacer member (not shown) may be interposed between the lower surface 1b of the substrate 1 and an external electric circuit such as a motherboard to leave a space between the substrate 1 and the external electric circuit.
1: Substrate
1
a: Upper surface
1
b: Lower surface
1
c: Frame portion
2: First mounting area
3: Second mounting area
4: Through hole
5: First protrusion
6: Second protrusion
7: Projection
10: Sensor substrate
11: Light-emitting element
12: Light-receiving element
12
a: Light-receiving portion
13: Light-transmitting sealing material
14: Sealing material
15: Light-transmitting material
20: Sensor device
31: Part of electronic apparatus (glass plate)
A: Reflected light beam
B: Undesired light beam
L: Virtual straight line
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-241243 | Dec 2015 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2016/085934 | 12/2/2016 | WO | 00 |
