In some applications where a fluid, such as ink, is deposited on a medium, the fluid may be stored in a reservoir prior to being deposited on the medium. Devices for determining an amount of the fluid in the reservoir in the past have been expensive to manufacture and cumbersome to use.
The print engine 108 is coupled to the controller 112 and is configured to deposit ink or other suitable fluid onto a medium 120 under control of the controller 112. The medium 120 may be advanced through a print zone 114 by the media transport system 110 under control of the controller 112. The media transport system 110 may comprise rollers, belts, a drum, or other suitable mechanisms for advancing media in the device 100.
In particular, the print engine 108 is shown as including print cartridges 122A, 122B, 122C, 122D, 122E, 122F, collectively referred to as print cartridges 122. The print cartridges 122 may also be referred to as pens. The print cartridges 122 may be arranged in some embodiments as a page wide array of print cartridges that do not move significantly while depositing ink on the medium 120. In other embodiments, the print cartridges may be disposed on a carriage that moves the cartridges relative to the medium.
The print cartridges 122 are fluidly coupled to containers 124A, 124B, 124C, 124D, 124E, 124F, collectively referred to as containers 124. The containers 124 may be located at the ink supply station 102 as shown in
Each of the containers 124 includes a collapsible ink reservoir 128 within a pressure chamber 132. The air pressure source 104 is fluidly coupled to the pressure chambers 132 to pressurize the ink reservoirs 128. Thus, according to some embodiments, a single air pressure source 104 provides pressurized air to each of the chambers 132. The ink reservoirs 128 are in fluid communication with respective print cartridges 122 via conduits 140.
The pressure sense module 106 is disposed along the conduits 140 to sense pressure within the conduits. The controller 112 is coupled to the pressure sense module to obtain pressure data from the pressure sense module 106. As illustrated, the pressure sense module 106 is within the device 100 and is spaced from the ink supply station 102 and the print engine 108.
The air pressure source 104 provides pressurized air to the pressure sense module 106 via conduit 140. As such, the pressure sense module 106, in some embodiments, may perform differential pressure measurements by measuring the difference in pressure between the pressure delivered to the module 106 via conduit 142 and the pressure of each of the conduits 140.
Conduits 144A, 144B, 144C, 144D, 144E, 144F are in fluid communication, respectively, with conduits 140A, 140B, 140C, 140D, 140E, 140F. The conduits 144A, 144B, 144C, 144D, 144E, 144F are also in fluid communication with print cartridges 122A, 122B, 122C, 122D, 122E, 122F, respectively.
In some embodiments, the controller 112 is configured to obtain pressure data for one or more of the conduits 144 from the module 106. Using the pressure data obtained from the module 106, the controller 112 may determine, or estimate, an amount of ink in a reservoir 128 based on the differential pressure sensed at the corresponding conduit 140.
Since the pressure sense module 106 is separate from the ink supply station 102, the pressure sense module 106 and the components thereof are not typically replaced with replacement of empty reservoirs 128. Further, in some embodiments, cost savings may be effected by not including pressure sensors at the ink supply station 102. Moreover, by performing pressure sensing for multiple conduits in a single module, manufacturing costs may be reduced. Moreover, use of a pressure sensor to approximate an amount of ink remaining in an ink supply is further described in U.S. Pat. No. 6,454,375, the disclosure of which is hereby incorporated by reference. Additional features are illustrated in the figures and are described below.
The substrate 202 may comprise a ceramic substrate or a substrate formed of another suitable material. In some embodiments, the substrate 202 is substantially chemically inert and has a low coefficient of thermal expansion. The substrate 202 is shown as having surfaces 222, 224. The substrate 202 is also shown as having holes 228 formed between the surfaces 222, 224. The holes 228 are positioned to permit a differential pressure measurement. The substrate 202 also includes apertures 230 for receiving the fasteners 216. The fasteners 216, in some embodiments, may comprise screws.
The circuit 204 is shown as positioned at the surface 222 of the substrate 202. The circuit 204, in some embodiments, may comprise a flex circuit. The circuit 202 may comprise polyethermide or other suitable material with a pattern of copper circuitry formed thereon, such as by etching. In other embodiments, the circuit 204 may comprise a suitable printed circuit material, such as FR4 or the like.
Sensors 240 are shown as being mounted on the substrate 202 and connected to the circuit 204. In some embodiments, the sensors 240 may be wire bonded to the circuit 204. The sensors 240 may be bonded to the surface 222 of the substrate 202 by a suitable adhesive. In some embodiments, the adhesive used to bond the sensors to the surface 222 comprises a compliant adhesive that is relatively insensitive to changes in temperature and humidity. The sensors 240 are mounted on the substrate at holes 238. Moreover, as shown in
The gasket 206 (
The cover 208 is coupled to the substrate 202 via the gasket 206 and covers the sensors 240. As shown in
As shown in FIGS. 2 and 5-7, the cover 208 also includes a port 248. The port 248 is in fluid communication with an inner chamber 250 (
The manifold 214 provides connection locations for conduits 140, 144 (
An o-ring 212 is associated with each of the sensors 240. The o-rings 212 are compressed as the fasteners engage the cover 208 to create a tight seal between the manifold 214 and the substrate 202. In some embodiments, however, the o-rings 212 may be omitted. In these embodiments, an adhesive pattern seals the manifold 214 to the substrate 202.
A memory 278 may also be included in the module 106. As shown, the memory 278 may be coupled to the circuit 204. In some embodiments, the memory 278 may comprise a non-volatile memory, such as EEPROM memory. The memory 278, in some embodiments, is configured to store and stores calibration information for multiple ones of the sensors 240. The memory 278 may also store zeroing information for multiple ones of the sensors 240. The calibration information may include information relating to the slope of the voltage/pressure curve for each sensor. The zeroing information may relate to the voltage output by a sensor when there is substantially zero pressure differential across the sensor. The information stored at the memory 278 may be obtained by the controller 112 (
Although the present disclosure has been described with reference to example embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the claimed subject matter. For example, although different example embodiments may have been described as including one or more features providing one or more benefits, it is contemplated that the described features may be interchanged with one another or alternatively be combined with one another in the described example embodiments or in other alternative embodiments. The present disclosure described with reference to the example embodiments and set forth in the following claims is manifestly intended to be as broad as possible. For example, unless specifically otherwise noted, the claims reciting a single particular element also encompass a plurality of such particular elements.
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20070013752 A1 | Jan 2007 | US |