Claims
- 1. A reforming process which comprises contacting a reforming charge stock under reforming conditions with a catalyst composition made up of a mixture of two components, one component comprising a minor proportion of platinum and rhenium on a support and the second component comprising a minor proportion of iridium on a separate support.
- 2. The reforming process of claim 2 wherein said support is an inorganic oxide.
- 3. The reforming process of claim 3 wherein said support is alumina.
- 4. A reforming process which comprises contacting a reforming charge stock under reforming conditions with a catalyst composition comprising a refractory support, about 0.1 to about 5 percent by weight of platinum, about 0.1 to about 5 percent by weight of rhenium, about 0.1 to about 5 weight percent of iridium, about 0.1 to about 5 weight percent of halogen, wherein said platinum and rhenium are contained on particles of one support and iridium is contained on separate particles of said support, with the relative weight ratio of the particles containing platinumrhenium and those containing iridium being between about 10:1 to 1:10.
- 5. The reforming process of claim 4 wherein said refractory support is an inorganic oxide.
- 6. The reforming process of claim 4 wherein said refractory support is alumina.
- 7. The reforming process of claim 7 wherein said halogen is chloride.
- 8. The reforming process of claim 4 wherein the weight ratio of particles containing platinum-rhenium and those containing iridium is between about 5:1 to 1:5.
- 9. The reforming process of claim 4, wherein the size of said particles is between about 0.01 micron and about 10000 microns.
- 10. The reforming process of claim 4 wherein the size of said particles is between about 1 and about 3000 microns.
- 11. The reforming process of claim 4 wherein platinum-rhenium is deposited on a support of gamma alumina and iridium is deposited on a support of eta aluminas.
Parent Case Info
This application is a division of Ser. No. 120,956, filed Feb. 13, 1980, and now U.S. Pat. No. 4,288,348 which, in turn, is a continuation-in-part of application Ser. No. 076,047, filed Sept. 17, 1979, and now U.S. Pat. No. 4,264,475 and application Ser. No. 112,756, filed Jan. 17, 1980, and now U.S. Pat. No. 4,263,134; application Ser. No. 076,047, in turn, being a continuation-in-part of application Ser. No. 934,143, filed Aug. 16, 1978, and now abandoned, and application Ser. No. 112,756, filed Jan. 17, 1980, in turn, being a continuation of application Ser. No. 934,143, filed Aug. 16, 1978, and now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3507781 |
Spurlock et al. |
Apr 1970 |
|
3578583 |
Buss |
May 1971 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
2627822 |
Feb 1977 |
DEX |
Related Publications (1)
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Number |
Date |
Country |
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112756 |
Jan 1980 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
120956 |
Feb 1980 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
934143 |
Aug 1978 |
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
76047 |
Sep 1979 |
|
Parent |
934143 |
Aug 1978 |
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