Gas turbine engines are known and include a compressor which compresses a gas and delivers it into a combustion chamber. The compressed air is mixed with fuel and combusted, and products of this combustion pass downstream over turbine rotors.
The turbine rotors typically carry blades having an airfoil. In addition, static vanes are positioned adjacent to the blades to direct the flow of the products of combustion at the blades. Both the blades and the vanes are exposed to very high temperatures, and thus cooling schemes are known for providing cooling air to the airfoils of the blades and vanes.
Cooling circuits are formed within the airfoil body to circulate cooling air. One type of cooling circuit is a serpentine channel. In a serpentine channel, air flows serially through a plurality of paths, and in opposed directions. Thus, air may initially flow in a first path from a platform of a turbine blade outwardly through the airfoil and reach a position adjacent an end of the airfoil. The flow is then returned in a second path, back in an opposed direction toward the platform. Typically, the flow is again reversed back away from the platform in a third path.
The assignee of the present invention has developed a serpentine channel combined with cooling circuits that are embedded into the wall of an airfoil, which have been called microcircuits. Example microcircuits are disclosed in U.S. Pat. No. 6,896,487, entitled “Microcircuit Airfoil Main Body,” and which issued on May 24, 2005.
It is known to provide a turbine blade having microcircuit cooling adjacent the entire length of both a suction side and a pressure side.
A gas turbine engine component has an airfoil that extends from a leading edge to a trailing edge, and has a suction side and a pressure side. There are cooling passages extending from a root of the airfoil toward a tip of the airfoil. The cooling passages include a straight passage extending from the root toward the tip and adjacent the leading edge. A serpentine passage has at least three connected paths and is spaced from the straight passage toward the trailing edge. Side cooling circuits are provided between the pressure wall and each of the three serpentine paths, and the straight path. A side cooling circuit is provided between the suction wall and the straight passage. There is no side cooling circuit between at least a downstream leg of one of the paths of the serpentine passage and the suction wall.
These and other features of the present invention can be best understood from the following specification and drawings, the following of which is a brief description.
As shown in
As shown in
Microcircuit cooling is provided by microcircuits 54, 60 and 64 on the pressure side 50 of the airfoil. Microcircuit 54 has an inlet 52 from the passage 34 and outlets the cooling air at 56 onto the skin of the pressure side 50. Microcircuit 60 has an inlet 58 from the passage 38, and outlets the cooling air at 62 onto the pressure side 50. Microcircuit 64 has an inlet 66 from the passage 44 and outlets its air at 68 on the pressure side 50. Microcircuit 72 has an inlet 74 from the passage 34, and outlets its air at 76 on the suction side 102. Notably, this outlet 76 is approximately at a gage point 100. Between the gage point 100 and the trailing edge 32, there are no microcircuits. Thus, there are microcircuits between the passages 34, 38, 42, and 44, and the pressure side 50, but no microcircuits between the passages 42 and 44 and the suction side 102. In this manner, the trailing edge suction side is cooled by the serpentine cooling path. The microcircuit is shown in exaggerated width to better illustrate its basic structure. The exact dimensional ranges, etc., are disclosed below.
As can be appreciated from
As can be appreciated from
The detail of the microcircuit can have many distinct shapes, positions, spacings, etc., and varying numbers of entry/exhaust passages per microcircuit, and relative shapes and sizes of the pedestals 112 that are included. For purposes of this application, a microcircuit is preferably simply a very thin circuit placed at an area where additional cooling is beneficial. The microcircuits that come within the scope of this invention can have varying combinations of pedestal shapes and sizes.
In the exemplary embodiment, a thickness, t (see
The microcircuits 54, 60, and 64 may be formed from any suitable core material known in the art. For example, the microcircuits 54, 60, and 64 may be formed from a refractory metal or metal alloy such as molybdenum or a molybdenum alloy. Alternatively, each of the microcircuits 54, 60, and 64 may be formed from a ceramic or silica material.
Various cooling structures may be included in the passages 34 and 36 as well as the microcircuits 54, 60, and 64. Pin fins, trip strips, guide vanes, pedestals, etc., may be placed within the passages and microcircuits to manage stress, gas flow, and heat transfer.
Although an embodiment of this invention has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of this invention. For that reason, the following claims should be studied to determine the true scope and content of this invention.
This invention was made with government support under Contract No. F33615-03-D-2354-0009 awarded by the United States Air Force. The Government may therefore have certain rights in this invention.
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