This application claims priority of Chinese Patent Application No. 201410318162.X, filed by Baidu Online Network Technology (Beijing) Co., LTD. with State Intellectual Property Office on Jul. 4, 2014, the entire content of which is incorporated herein by reference.
Embodiments of the present invention generally relate to a server field, and more particularly, to a server.
With developments of computing world and increase of data volume, respective enterprises have increasingly improved requirements of a server. Currently, most servers are designed in a height of 1 U, 2 U and in a 19-inch cabinet' width (448 mm). In order to achieve a hot swap of a hard disk, the hard disks are connected together via their backplanes and each hard disk is arranged in a single layer.
However, the conventional server has low space utilization.
Embodiments of the present invention seek to solve at least one of the problems existing in the related art to at least some extent.
An objective of the present invention is to provide a server, which has high space utilization.
In order to achieve the above objective, embodiments of the present invention provide a server, including: a casing; and at least one single server node of the server, disposed in the casing and including a hard disk of a first size, a drawout hard disk tray, a hard disk backplane, a mainboard and a node power distributing board, in which the hard disk of the first size is disposed on the drawout hard disk tray and at least two layers of the drawout hard disk trays are provided; each layer of the drawout hard disk tray is connected to the hard disk backplane via a retractable cable, or, each layer of the drawout hard disk tray is connected to the mainboard and the node power distributing board via the retractable cable, and the drawout hard disk tray is configured to perform a hot swap of the hard disk of the first size.
With the server according to embodiments of the present invention, by disposing the hard disk on the drawout hard disk tray and providing at least two layers of the drawout hard disk trays, space in the server can be fully used so as to improve the space utilization. Furthermore, the hot swap of the hard disk on each layer of the drawout hard disk tray can be obtained by connecting each layer of the drawout hard disk tray to the hard disk backplane via the retractable cable, or, to the mainboard and the node power distributing board via the retractable cable.
Additional aspects and advantages of embodiments of present invention will be given in part in the following descriptions, become apparent in part from the following descriptions, or be learned from the practice of the embodiments of the present invention.
Above and/or additional aspects and advantages of embodiments of the present invention will become apparent and more readily appreciated from the following descriptions made with reference to the accompanying drawings, in which:
Reference will be made in detail to embodiments of the present invention. Embodiments of the present invention will be shown in drawings, in which the same or similar elements and the elements having same or similar functions are denoted by like reference numerals throughout the descriptions. The embodiments described herein according to drawings are explanatory and illustrative, not construed to limit the present invention. Instead, the embodiments of the present invention comprise all the variants, modifications and their equivalents within the spirit and scope of the present invention as defined by the claims.
A server according to embodiments of the present invention will be described in the following with reference to drawings.
The at least one single server node 12 may be arranged in different regions of the server.
Specifically, as shown in
Specifically, the single server node 12 includes a hard disk of a first size, a drawout hard disk tray, a hard disk backplane, a mainboard and a node power distributing board.
The hard disk of the first size is disposed on the drawout hard disk tray and at least two layers of the drawout hard disk trays are provided.
Each layer of the drawout hard disk tray is connected to the hard disk backplane via a retractable cable, or, each layer of the drawout hard disk tray is connected to the mainboard and the node power distributing board via the retractable cable, and the drawout hard disk tray is configured to perform a hot swap of the hard disk of the first size.
With the server according to embodiments of the present invention, by disposing the hard disk on the drawout hard disk tray and providing at least two layers of the drawout hard disk trays, space in the server can be fully used so as to improve space utilization. Furthermore, the hot swap of the hard disk on each layer of the drawout hard disk tray can be obtained by connecting each layer of the drawout hard disk tray to the hard disk backplane via the retractable cable, or, to the mainboard and the node power distributing board via the retractable cable.
Furthermore, as shown in
Taking the single server node as an example, in an embodiment, as shown in
Specifically, the hard disk of the first size may be configured as a 3.5-inch hard disk.
Optionally, the fan module 31 includes at least one fan. In particular, two fans are provided as shown in
Certainly, it may be understood that the single server node may further include a power transfer board, a CPU and a memory.
Optionally, as shown in
As shown in
In the embodiment, the 3.5-inch hard disks are arranged in three layers and at most four 3.5-inch hard disks are disposed in each layer, so that the space utilization of the server is improved, thus improving server density and memory density greatly. In addition, the space in rear of the fan may be used to dissipate heat so as to obtain the heat dissipation with high performance, thus optimizing the heat dissipation and reducing power consumption of the fan.
In an embodiment, as shown in
The second group of hard disks 33 are disposed on a second group of drawout hard disk trays. The second group of drawout hard disk trays include at least two layers of drawout hard disk trays, and at most four hard disks of the first size are disposed in each layer of the drawout hard disk tray.
As shown in
Each layer of the drawout hard disk tray in the second group is connected to the hard disk backplane via the retractable cable, or, each layer of the drawout hard disk tray in the second group is connected to the mainboard and the node power distributing board via the retractable cable, so that each layer of the drawout hard disk tray in the second group can be pulled out with the retractable cable and continue operating without being powered off, thus obtaining the hot swap.
A mainboard having low power consumption, such as a Jbod card or a CPU card having low power consumption may be disposed below or in front of the second group of drawout hard disk trays.
In the embodiment, by arranging the 3.5-inch hard disks in at least two layers in rear of the fan and disposing at most four 3.5-inch hard disks in each layer, the space utilization of the server is further improved and the server density and the memory density are further improved.
In an embodiment, as shown in
Specifically, the hard disk of the second size 51 is configured as a 2.5-inch hard disk.
Optionally, as shown in
The hard disk of the second size 51 is located in front of the fan module 31 and disposed in the vertical insertion manner, which allows for the hot swap of at most twelve hard disks of the second size 51. as shown in
In the embodiment, by disposing the 2.5-inch hard disk in the vertical insertion manner and allowing for the hot swap of at most twelve 2.5-inch hard disks, the space utilization of the server is improved, and the server density and memory density are improved greatly. In addition, the space in rear of the fan may be used to dissipate heat so as to obtain the heat dissipation with high performance, thus optimizing the heat dissipation and reducing the power consumption of the fan.
In an embodiment, as shown in
In the embodiment, the single server node is arranged in the primary tray, and different portions of the single server node are located in different sub trays, so that different configurations of the server can be obtained by replacing the sub tray, thus realizing a flexible change of the server configuration.
In an embodiment, as shown in
The power pack 71 is configured to provide power.
Specifically, as shown in
The centralized power management board 72 is connected with the power pack 71 and the node power distributing board 73 of the single server node, and configured to perform a centralized power distribution and management on the single server node according to the power provided by the power pack.
Specifically, when the single server nodes are arranged in a left and right direction, the centralized power management board provides a centralized power supply to the single server nodes arranged in the left and right direction.
The node power distributing board 73 is corresponding to the single server node, connected with the centralized power management board 72 and configured to perform the power distribution and management on the single server node corresponding to the node power distributing board.
For example, the node power distributing board 73 at a left side is configured to supply power to the single server node at the left side and the node power distributing board 73 at a right side is configured to supply power to the single server node at the right side.
In the embodiment, the power sources are arranged in middle, so as to realize the centralized power supply. Compared with a technical solution in which the power source is arranged at side in the related art, in the embodiment, when being pulled out, the hard disk will not interfere with a power distributing unit (PDU) and a node cable in a rear portion of the cabinet. In addition, with the redundancy power design, the reliability of the power source can be improved.
It should be noted that, terms such as “first” and “second” are used herein for purposes of description and are not intended to indicate or imply relative importance or significance. Furthermore, in the description of the present invention, “a plurality of relates to two or more than two.
Reference throughout this specification to “an embodiment,” “some embodiments,” “one embodiment”, “another example,” “an example,” “a specific example,” or “some examples,” means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. Thus, the appearances of the phrases such as “in some embodiments,” “in one embodiment”, “in an embodiment”, “in another example,” “in an example,” “in a specific example,” or “in some examples,” in various places throughout this specification are not necessarily referring to the same embodiment or example of the present invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
Although explanatory embodiments have been shown and described, it would be appreciated by those skilled in the art that the above embodiments cannot be construed to limit the present invention, and changes, alternatives, and modifications can be made in the embodiments without departing from spirit, principles and scope of the present invention.
Number | Date | Country | Kind |
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201410318162.X | Jul 2014 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2014/093520 | 12/10/2014 | WO | 00 |