Ink jet printers use print heads that emit different colors of ink onto a medium in a desired pattern. Over time, the functionality of the print heads can be reduced due to contamination of ink, particles, paper stands, other debris, or other defects. As a result, print heads are serviced to ensure nozzle health.
The present disclosure discloses print heads having embedded service structures. As discussed above, ink jet printers use print heads that emit different colors of ink onto a medium in a desired pattern. Over time, the functionality of the print heads can be reduced due to contamination of ink, particles, paper stands, other debris, or other defects. As a result, print heads are serviced to ensure nozzle health.
Examples of the present disclosure provide embedded service structures that help minimize the amount of contamination in the print heads. The embedded service structures can create frictional anisotropy that can be used to create a wipe direction and a non-wipe direction. The embedded service structures may also collect ink or debris instead of a nozzle region so the print heads may be cleaned or serviced more efficiently. As a result, operational efficiency of the print heads can be improved by reducing the amount of down time for maintenance and improving the operational life span of the print heads.
In one implementation, the print head die 104 may be embedded in a mold 108. The mold 108 may be an epoxy mold compound (EMC). An example EMC may include compounds such as CEL400ZHF40WG from Hitachi® Chemical. In one example, the molded print head 100 may include a plurality of print head dies 104.
In one example, the embedded service structure 102 may have a texture 110 created in the mold 108. The texture 110 may include grooves or openings. In one implementation, the grooves or openings may be created by nano-structures. In another implementation, the texture 110 may include ridges. For example, a series of ridges may be used to create frictional anisotropy which can create a wiping direction and a non-wiping direction.
In one implementation, the embedded service structure 102 may be located adjacent to at least one print head die 104. The embedded service structure 102 may be located close to the at least one print head die 104. Close may be defined as being within 1 millimeter (mm) or less of the at least one print head die 104. In one example, the embedded service structure 102 may be located between two print head dies 104.
It should be noted that the shape of the texture 110 is provided as an example and that the texture 110 embedded in the mold 108 may have a variety of different shapes. In addition, it should be noted that the number of textures 110 is provided as an example and that any number of textures 110 may be embedded in the mold 108.
It should also be noted that although only a single embedded service structure 102 is illustrated in
In one implementation, the print head die 204 may be embedded in a mold 208. The mold 208 may be an epoxy mold compound (EMC). An example EMC may include compounds such as CEL400ZHF40WG from Hitachi® Chemical. In one example, the molded print head 200 may include a plurality of print head dies 204.
In one example, the embedded service structure 202 may be an embedded service material having a low surface energy. For example, the embedded service material may include materials such as a polyhexafluoroethylene, a polytetrafluoroethylene (PTFE), a poly(vinylidene fluoride) (PVF), a poly(chlorotrifluoroethylene), a polyethylene (PE), a polypropylene (PP), or a silica filler with a low surface energy coating in an epoxy matrix.
In one example, the embedded service structure 202 may be co-planar with the print head dies 204. In other words, at least one surface of the print head dies 204 and the embedded service structure 202 share, or lie, on a common plane. As illustrated in
In one implementation, the embedded service structure 202 may be located adjacent to at least one print head die 204. The embedded service structure 202 may be located close to the at least one print head die 204. Close may be defined as being within 1 millimeter (mm) or less of the at least one print head die 204. In one example, the embedded service structure 202 may be located between two print head dies 204.
It should be noted that the shape of the embedded service structure 202 is provided as an example and that the embedded service structure 202 embedded in the mold 208 may have a variety of different shapes. It should also be noted that although only a single embedded service structure 202 is illustrated in
At block 302, the method 300 begins. At block 304, the method 300 provides a structured carrier having a service structure. The structured carrier may be a printed circuit board (PCB) (e.g., an FR4 PCB). The service structure may be fabricated to include the service structures that are used to create the embedded service structures in the molded print head.
At block 306, the method 300 applies a thermal release tape over the structured carrier. The thermal release tape may be any type of material that allows for adhesion of electrical components at room temperature and removal via heating of the thermal release tape. The thermal release tape may be used to remove the structured carrier from the molded print head. An example of the thermal release tape that can be used may be product number 3195V from Nitto Denko®.
At block 308, the method 300 applies at least one print head die on the release tape. In one example, a plurality of print head dies may be applied to the release tape.
The schematic flow diagram 400 illustrates an example structured carrier 410, the thermal release tape 412 and the print head dies 104 in block 402 after the blocks 304, 306 and 308 are completed. As illustrated in block 402, the structured carrier includes service structures 450 that are transferred and embedded into a mold, as discussed below.
Referring back to
In one example, the mold 108 may be applied using a compression mold tool. In one example, the compression mold tool may be from TOWA®. The mold 108 may be applied at 140 degrees Celsius (° C.) for approximately 5 minutes.
Referring back to
In one example, the embedded service structure may correspond to a shape and number of service structures formed on the structured carrier. The embedded service structure may capture ink and debris instead of a nozzle area so the print head can be serviced easily.
In
At block 408, the manufacturing of molded print head 100 is completed. For example, the molded print head 100 may be cured after being released from the thermal release tape 412. In one example, the molded print head 100 may be cured for approximately one hour at 150° C. Referring back to
At block 502, the method 500 begins. At block 504, the method 500 provides a structured carrier. The structured carrier may be a printed circuit board (PCB) (e.g., an FR4 PCB).
At block 506, the method 500 applies a thermal release tape over the structured carrier. The thermal release tape may be any type of material that allows for adhesion of electrical components and removal via heating of the thermal release tape. The thermal release tape may be used to remove the structured carrier from the molded print head. An example of the thermal release tape that can be used may be product number 3195V from Nitto Denko®.
At block 508, the method 500 applies at least one print head die on the release tape. In one example, a plurality of print head dies may be applied to the release tape.
At block 510, the method 500 applies a service structure on the thermal release tape adjacent to the at least one print head die. In one example, the service structure may be a material with a low surface energy. As described above, a low surface energy surface has a tendency to not wet as easily as a high surface energy. As a result, ink and debris may not accumulate as easily on the low surface energy surface created by the embedded service structure. For example, the embedded service material may include materials such as a polyhexafluoroethylene, a polytetrafluoroethylene (PTFE), a poly(vinylidene fluoride) (PVF), a poly(chlorotrifluoroethylene), a polyethylene (PE), a polypropylene (PP), or a silica filler with a low surface energy coating in an epoxy matrix. The schematic flow diagram 600 in
Referring back to
In one example, the mold 208 may be applied using a compression mold tool. In one example, the compression mold tool may be from TOWA®. The mold 208 may be applied at 140 degrees Celsius (° C.) for approximately 5 minutes.
Referring back to
In one example, the embedded service structure and the at least one print head die may be co-planar. In other words, at least one surface of the print head die and the embedded service structure share, or lie, on a common plane.
In
At block 608, the manufacturing of molded print head 200 is completed. For example, the molded print head 200 may be cured after being released from the thermal release tape 612. In one example, the molded print head 200 may be cured for approximately one hour at 150° C. Referring back to
It will be appreciated that variants of the above-disclosed and other features and functions, or alternatives thereof, may be combined into many other different systems or applications. Various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
Filing Document | Filing Date | Country | Kind |
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PCT/US2015/055720 | 10/15/2015 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2017/065774 | 4/20/2017 | WO | A |
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Number | Date | Country | |
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20180244044 A1 | Aug 2018 | US |