Patent Grant
8061287
The present application claims priority from Japanese Patent Application No. 2006-264287, which was filed on Sep. 28, 2006, the disclosure of which is herein incorporated by reference in its entirety.
The present disclosure relates generally to technical fields including a sewing data processing apparatus that processes sewing data used to sew a cloth piece having a size and shape determined by applique pattern data to a work cloth by using a sewing machine so that an applique pattern of the cloth piece is formed on the work cloth, a sewing machine equipped with the sewing data processing apparatus, and a computer-readable recording medium with a recorded sewing data processing program.
In the related art, a technology is known for utilizing an optically-readable mark attached to a work cloth in production of the work cloth, management of products for sales of the products, or display of a quality of the work cloth.
The mark is directly printed to a fabric or printed to a piece of paper or cloth which is to be attached to the fabric. In such cases, depending on the handling of the fabric, the mark can be partially or totally lost, or separated due to water and chemicals used in various processing steps. To solve this problem, a sewing machine has been proposed which forms an optically-readable mark by sewing it to the work cloth (see Japanese Patent Application Laid Open Publication No. Hei 6-67422). The mark that is sewn to the work cloth by the sewing machine generally has low occurrence of being lost or separated from the work cloth, and may also be protected from deformation.
However, when a mark is directly sewn to the work cloth, the mark may badly affect the appearance and design of the work cloth. Also, generally an amount of information added to the mark formed by sewing is not sufficient, and there is a desire to give much more information to the work cloth.
It is one object of the present disclosure to provide a sewing data processing apparatus that can attach an IC tag (i.e., integrated circuit) capable of storing a lot of information to a work cloth without damaging a design of the work cloth, a sewing machine equipped with the sewing data processing apparatus, and a computer-readable recording medium in which a sewing data processing computer program is recorded.
According to a first aspect of the present disclosure, there is provided a sewing data processing apparatus which processes sewing data used to sew a cloth piece having a size and shape which is determined by applique pattern data to a work cloth by using a sewing machine so that an applique pattern including the cloth piece may be formed on the work cloth, the apparatus comprising: an IC tag area acquisition device that acquires an IC tag area which is determined on the basis of a size and shape of an IC tag; a determination device that determines whether the IC tag area which is acquired by the IC tag area acquisition device can be included in an applique pattern area which is determined on the basis of the applique pattern data; and a location setting device that, if the determination device determines that the IC tag area can be included in the applique pattern area, sets positions of the applique pattern area and the IC tag area in a sewable area of the sewing machine in such a manner that the IC tag area is positioned in the applique pattern area.
According to a second aspect of the present disclosure, there is provided a sewing data processing apparatus which processes sewing data used to sew a cloth piece having a size and shape which is determined by applique pattern data to a work cloth by using a sewing machine so that an applique pattern including the cloth piece may be formed on the work cloth, the apparatus comprising: an IC tag area acquisition device that acquires an IC tag area which is determined on the basis of a size and shape of an IC tag; a location specification device that specifies a position of an applique pattern area obtained on the basis of the applique pattern data and a position of the IC tag area in a sewable area of the sewing machine; a determination device that determines whether the IC tag area is included in the applique pattern area when the IC tag area and the applique pattern area positioned at the positions specified by the location specification device; and a location setting device that, if the determination device determines that the IC tag area is included in the applique pattern area, sets positions of the applique pattern area and the IC tag area to the positions specified by the location specification device in the sewable area of the sewing machine.
According to a third aspect of the present disclosure, there is provided a computer-readable recording medium storing a sewing data processing program which processes sewing data used to sew a cloth piece having a size and shape which is determined by applique pattern data to a work cloth by using a sewing machine so that an applique pattern including the cloth piece may be formed on the work cloth, the program comprising: IC tag area acquisition instructions for acquiring an IC tag area which is determined on the basis of a size and shape of an IC tag; determination instructions for determining whether the IC tag area which is acquired during execution of the IC tag area acquisition instructions can be included in an applique pattern area which is determined on the basis of the applique pattern data; and position setting instructions for setting the positions of the applique pattern area and the IC tag area in a sewable area of the sewing machine in such a manner that the IC tag area is located in the applique pattern area if, during execution of the determination instructions, it is determined that the IC tag area can be included in the applique pattern area.
According to a fourth aspect of the present disclosure, there is provided a computer-readable recording medium storing a sewing data processing program which processes sewing data used to sew a cloth piece having a size and shape determined by applique pattern data to a work cloth by using a sewing machine so that an applique pattern including the cloth piece may be formed on the work cloth, the program comprising: IC tag area acquisition instructions for acquiring an IC tag area which is determined on the basis of a size and shape of an IC tag; a location specification instructions for specifying a position of an applique pattern area obtained on the basis of the applique pattern data and a position of the IC tag area in a sewable area of the sewing machine; determination instructions for determining whether the IC tag area is included in the applique pattern area when the IC tag area and the applique pattern area are positioned at the positions specified during execution of the location specification instructions; and location setting instructions for setting the positions of the applique pattern area and the IC tag area to the positions specified during execution of the location specification instructions in the sewable area of the sewing machine.
Exemplary embodiments will be described in detail with reference to the accompanying drawings in which:
Exemplary embodiments of the broad principles outlined herein are described. The following will sequentially describe various embodiments of a sewing data processing apparatus, with reference to the drawings. A sewing data processing apparatus according to a first embodiment may be integrated with a sewing machine that forms stitches on a work cloth by moving the work cloth relative to a vertically moving needle. It should be noted that the sewing data processing apparatus may be separated from the sewing machine. First, a physical configuration and an electrical configuration of a sewing machine 1 according to a first embodiment will be described below.
First, the physical configuration of the sewing machine 1 will be described below with reference to
As shown in
Further, the head portion 14 may be equipped with a needle bar mechanism (not shown), which may vertically drive a needle bar (not shown), mounted with a sewing needle 29, a needle bar swinging pulse motor 80 (see
An LCD (liquid crystal display) 15 having a vertically long rectangular shape may be attached to a front surface of the pillar 12. The LCD 15 may indicate various patterns and function names for performing various functions required in sewing as well as a variety of messages. A touch panel 26 may be attached on a front surface of LCD 15. The touch panel 26 may respond to the display positions of various settings such as settings of pattern names of a plurality of patterns and function names for performing various functions, numerical settings of a feed amount of the work cloth by means of a feed adjustment pulse motor 78 (see
Although not shown in
Next, a configuration of the arm portion 13 will be described below. The arm portion 13 may include an open/close cover 16 for opening and closing its upper side. Inside the open/close cover 16, a thread spool (not shown) may be included for supplying a thread to the sewing needle 29. Although not shown, a needle thread extending from the thread spool may be supplied to the sewing needle 29 mounted to the needle bar after running through a tensioner and a thread take-up spring which may be mounted on the head portion 14 to adjust the thread tension and a plurality of thread hooking portions such as a thread take-up lever which vertically reciprocates to pull up the needle thread.
The arm portion 13 may also include a sewing machine drive shaft (not shown), which extends in the longitudinal direction of the arm portion 13. The sewing machine drive shaft may be driven rotationally by a sewing machine motor 79 (see
The lower front surface of the arm portion 13 may include a sewing start/stop switch 21, a reverse stitch switch 22, a needle up/down switch 23, a presser foot elevation switch 24, an automatic thread hooking start switch 25, etc. The sewing start/stop switch 21 may command starting and stopping of the sewing machine operation, that is, starting and stopping of sewing. The reverse stitch switch 22 may be used to feed the work cloth from the rear side to the front side, which is the opposite of the ordinary direction. The needle up/down switch 23 may switch the upper and lower stopping positions of the needle bar. The presser foot elevation switch 24 may command the elevation of a presser foot 30. The automatic thread hooking start switch 25 may command starting of automatic thread hooking which hooks a thread over the thread take-up lever, the tensioner, and the thread take-up spring and pass the thread through an eye of the sewing needle 29.
Further, the head portion 14 provided at the left end of the arm portion 13 may include the above-described needle bar, thread take-up lever, tensioner, and thread take-up spring as well as an automatic thread hooking apparatus (not shown), an automatic threading mechanism (not shown), etc. On the rear side of the needle bar, a presser bar (not shown), is arranged which may be supported in such a way that it can be raised and lowered. The lower end of the presser bar may include presser foot 30 for pressing the work cloth.
Next, the electrical configuration of the sewing machine 1 will be described below with reference to
The CPU 61 may conduct main control on the sewing machine 1, to perform various calculations and processing required in sewing, in accordance with a sewing control program which may be stored in the ROM 62. The CPU 61 may also set positions of an IC tag area and an applique pattern area in the sewable area in accordance with a sewing data processing program which may be stored in the ROM 62. It should be noted that a sewing machine operation program may also be stored in the external storage device such as a memory card. In the case, however, the program is read into the RAM 63 to be executed.
The ROM 62 may have sewing control program storage area in which the sewing control program is stored. The sewing control program may include the drive control of the various drive mechanisms, pattern selection control to select various patterns and various display controls. The ROM 62 may also have a sewing data processing program storage area in which the sewing data processing program is stored. The sewing data processing program may set the positions of the IC tag area and the applique pattern area in the sewable area. It should be noted that these various kinds of sewing information data pieces may be partially or totally stored in the EEPROM 64. Otherwise, the data stored in the external storage device may be read into the sewing machine 1.
The RAM 63 is a random access memory. The RAM 63 may have various storage areas as necessary for storing various kinds of sewing information data read from the ROM 62, various kinds of settings read from the EEPROM 64, and results of calculations performed by the CPU 61. The storage areas of the RAM 63 will be described below in detail with reference to
As described above, the sewing machine 1 has functions as a sewing data processing apparatus of the present disclosure. Next, processing procedures will be described below of various embodiments for setting the positions of the IC tag area and the applique pattern area in the sewable area by using the sewing machine 1 having the above-described configuration.
First, the main processing which may be performed by the sewing machine 1 in one embodiment will be described below with reference to
First, as one example of the IC tag, the IC tag 100 of Example 1 will be described below with reference to
Next, the applique pattern 200 according to Example 1 and applique pattern data 300 used to sew the applique pattern 200 will be described below with reference to
Next, the main processing of one embodiment for setting positions of the IC tag area and the applique pattern area in a sewable area will be described with reference to
A program that performs various processing shown in
In the main processing shown in
Subsequently, the IC tag area based on the shape data of the IC tag read at S5 may be set and stored in the IC tag area storage area 632 in the RAM 63 (S10). An area of an outer periphery of a profile of the IC tag 100 shown in
Next, the applique pattern data 300 stored in the ROM 62 or a storage area such as the external storage device 39 may be read and stored in the applique pattern data storage area 633 in the RAM 63 (S15). Subsequently, the applique pattern data storage area 633 may be referred to in order to determine the safety area in which the IC tag area can be located in the applique pattern area, based on the profile and seam allowance of the applique pattern as well as the shrinkage (estimated) of the work cloth and the cloth piece (S17). It should be noted that the profile of the applique pattern is generally determined on the basis of the applique pattern data. The seam allowance may be used when sewing the cloth piece on which the applique pattern is formed to the work cloth. This processing may be performed to prevent the IC tag area from being located in an area in which the applique attaching stitches 204 and the applique sewing stitches 203 shown in
Subsequently, the IC tag location processing may be performed to position the IC tag area in the safety area set in the applique pattern area determined on the basis of the applique pattern data 300 (S20). This IC tag location processing will be described below with reference to a flowchart shown in
Since the safety area set at S17 of
On the other hand, in Example 1, as shown in
If having determined at S24 that the IC tag area cannot be included (NO at S24), to read the next safety area subsequently, the safety area counter J may be incremented by 1 (S25). Then, the safety area counter J may be stored in the safety area counter storage area 635. Then, the processing may be repeated from S22. On the other hand, in Example 1, as shown in
Following S20 of
On the other hand, in a case where the IC tag location flag is stored as being “1” as in the case of Example 1, it is determined that the IC tag area can be positioned in the safety area 213 set in the applique pattern area 210 (YES at S55). Subsequently, whether to paste the IC tag to the cloth piece may be determined (S60). If the IC tag should be covered by an applique pattern, the IC tag may be pasted to the cloth piece or the IC tag may be positioned to the work cloth to which the cloth piece is sewn. Therefore, the processing confirms whether the IC tag is positioned on the cloth piece or the work cloth. Whether the IC tag is positioned on the cloth piece or the work cloth may be stored beforehand in the ROM 62 or the EEPROM 64 or, entered by the user each time.
If having determined at S60 to paste the IC tag to the cloth piece (YES at S60), then, mark sewing data used to form stitches on the cloth piece that serves as a mark when locating the IC tag to the cloth piece may be created and added to the applique pattern data (S70). This mark sewing data only needs to serve as a mark when locating the IC tag and so may be, for example, sewing data used to form stitches that match the profile of the IC tag or mark sewing data used to form stitches that indicate the center of the IC tag. However, since the cloth piece is used to form an applique pattern thereon, the thread used to form the mark stitches may preferably be removed easily after the IC tag is positioned so that stitches due to the mark sewing data do not damage the outer appearances of the applique pattern. In Example 1, as the mark sewing data, as shown in
On the other hand, if having determined not to paste the IC tag to the cloth piece (NO at S60), subsequently, the mark sewing data used to form stitches on the work cloth that serves as a mark when locating the IC tag to the work cloth may be created and added to the applique pattern data (S80). As at S70, the mark sewing data only needs to serve as a mark when locating the IC tag. Since the applique pattern area on the work cloth is covered by the cloth piece, stitches made by the mark sewing data, if left, do not damage the outer appearances of the applique pattern. Therefore, in contrast to a case where the IC tag is pasted to the cloth piece, a thread used to form the mark stitches need not be removed easily, for example, in contrast to the above-described stitches 501 through 504 in
Subsequently, reinforcement-stitches data used to sew the IC tag to the work cloth may be created and added to the applique pattern data (S90). Any stitches can be employed arbitrarily as far as they serve to sew the IC tag to the work cloth. In Example 1, as the reinforcement-stitches data, sewing data is created which has a needle drop point on the profile line of the IC tag area 131 such as a needle location 602, indicated by a circle in
Following S70 or S90, the positions of the IC tag area and the applique pattern area may be displayed on the LCD 15 (S95). The user can confirm the positions indicated on the LCD 15 and, in accordance with the positions, position the IC tag to the work cloth. Then, the main processing shown in
According to the sewing machine 1 equipped with the sewing data processing apparatus of the first embodiment described in detail above, it is possible to determine the positions of the applique pattern area and the IC tag area so that the area of the IC tag attached to the work cloth may be included in the safety area set in the applique pattern area. Therefore, in accordance with the positions of the applique pattern area and the IC tag area determined by the sewing machine 1 equipped with the sewing data processing apparatus of the first embodiment, the IC tag attached to the work cloth can be covered by an applique pattern and the IC tag capable of storing a lot of information can be attached to the work cloth without damaging the design.
Further, according to the present sewing machine 1, the safety area may be determined taking into account the profile of the applique pattern, the seam allowance used to sew the cloth piece to the work cloth, and the shrinkages of the work cloth and the cloth piece. It is thus possible to prevent the applique attaching stitches 204 and the applique sewing stitches 203 formed on the basis of the applique pattern data from being positioned in the IC tag area set inside the safety area.
Further, in the present sewing machine 1, relocation of the applique pattern area and the IC tag area once located to the sewable area at S24 shown in
Further, the image scanner sensor 27 may acquire, as outline data, form information that may represent the size and shape of the IC tag to be mounted to the work cloth, and the IC tag area may be determined based on this data. Therefore, the IC tag area which may be used to determine positions to which the applique pattern area and the IC tag area are positioned may be appropriately determined in such a manner that the IC tag may be covered by the applique pattern.
Further, mark sewing data may be created which is used to form the stitches 501 through 504 that serve as a mark when locating the IC tag 100 on the cloth piece or the work cloth. The mark sewing data can thus be added to an appropriate position in the applique pattern data (S70, 80) in accordance with whether the IC tag is positioned to the work cloth (NO at S60) or to the cloth piece (YES at S60). If it is determined in the main processing that the IC tag should be positioned on the work cloth (NO at S60), further, reinforcement-stitches data can be created which may be used to form stitches with which to sew the IC tag positioned at the appropriate position to the work cloth by using as a mark the stitches 501 through 504 formed on the basis of the mark sewing data. The IC tag can thus be fixed securely on the work cloth.
The sewing machine 1 equipped with the sewing data processing apparatus of the first embodiment may further include the LCD 15 that notifies of the result of the determination that the applique pattern area has no area to include the IC tag area and the positions of the applique pattern area and the IC tag area. Therefore, if the result of the determination in the case where the applique pattern area has no area to include the IC tag area is indicated on the LCD 15, the user can know whether any area is available in which the IC tag area can be included. Further, if the positions of the applique pattern area and the IC tag area are indicated on the LCD 15, the IC tag can be positioned to the work cloth or the cloth piece in accordance with the indicated positions and the IC tag may be covered by the applique pattern.
It should be noted that the present disclosure is not limited to the above-described embodiment described in detail above and can be changed in a variety of manners without departing from the spirit and scope of this disclosure, as characterized in the appended claims.
Although the first embodiment has been described first with reference to the case where the sewing data processing apparatus has been integrated with the sewing machine 1, it is not limited to this configuration, and the sewing data processing apparatus may be separated from the sewing machine 1. Further, although the first embodiment has been described with reference to the case where the present disclosure has been applied to the sewing machine 1 equipped with one needle bar, the present disclosure may be applied to a multi-needle type sewing machine that is equipped with a plurality of needle bars.
Further, in the first embodiment, at S5 of
Further, for example, if the shape of an IC tag is entered through the touch panel 26, the entered shape data may be read and stored in the IC tag shape storage area 631 in the RAM 63 (S5). It should be noted that the touch panel 26 may be replaced with any one of various switches, a trackball, or a joystick on a game controller that interfaces with the user.
Further, in the first embodiment, a safety area has been set in an applique pattern at S17 taking into account the profile of the applique pattern, the seam allowance used when sewing the cloth piece to the work cloth, and the shrinkage of the work cloth and the cloth piece. However, the safety area may be determined taking into account either one of the seam allowance used when sewing the cloth piece to the work cloth and the shrinkage of the work cloth and the cloth piece. Further, if a safety area need not be determined because, for example, the cloth piece to form the applique pattern is pasted to the work cloth with an adhesive or pressure-sensitive adhesive agent, the IC tag area may be positioned in such a manner as to be included in the applique pattern instead of determining the safety area.
Further, in the first embodiment, mark sewing data used to form stitches that serve as a mark when locating the IC tag on the cloth piece or work cloth has been created and added to applique pattern data at S70 or S80. However, for example, this processing may be omitted if such stitches need not be formed when locating the IC tag on the work cloth based on the positions notified at S95.
Further, in the first embodiment, reinforcement-stitches data used to sew the IC tag to the work cloth has been created and added to applique pattern data at S95. However, for example, this processing may be omitted if the IC tag need not be sewn to the work cloth because, for example, the IC tag is fixed to the work cloth with an adhesive or pressure-sensitive adhesive agent.
Further, in the first embodiment, when locating the IC tag on the cloth piece, the IC tag is assumed to be pasted at the position on the cloth piece set at S20, and when locating the IC tag on the work cloth, the IC tag is assumed to be sewn at the position on the work cloth set at S20. However, the present disclosure is not limited to the case of the present embodiment as far as the IC tag is positioned at the set position. Therefore, for example, a pocket in which to put the IC tag may be sewn to the applique pattern area on the work cloth. Further, similarly, the pocket in which to put the IC tag may be pasted to the applique pattern area on the cloth piece. In the case, the processing of S70 or S80 may be replaced by creating sewing data used to form stitches that indicate the position to which the pocket is positioned or the processing of S90 may be replaced by creating data used to sew the pocket to the work cloth.
Further, in the first embodiment, if having determined that it is impossible to position the IC tag in the applique pattern area (NO at S55), the result of the determination may be displayed on the LCD 15 at S95. On the other hand, if having determined that it is possible to position the IC tag in the applique pattern area (YES at S55), the set location of the IC tag area and the applique pattern area may be displayed on the LCD 15. However, this processing may be omitted if such information need not be indicated. Further, in the first embodiment, the LCD 15 has been used. However, the present disclosure is not limited to the use of LCD displays; any other display device such as a plasma display or an audio device that uses a voice notification such as a speaker may be employed instead.
As described above, in the first embodiment, it has been determined whether the IC tag area can be positioned in the applique pattern area represented by relative coordinates when positioned in a sewable area. If having determined that the IC tag area can be positioned in the applique pattern area, it is determined that the applique pattern area and the IC tag area can be positioned in the sewable area. However, in a second embodiment to be described next, a position on a work cloth to which an IC tag area is to be positioned may be determined in advance so that it may then be determined whether the IC tag positioned on that position can be covered by an applique pattern. The following will describe processing to determine beforehand the position on the work cloth to which the IC tag is to be positioned and set an applique pattern area so that the IC tag positioned on that position may be covered by the applique pattern with reference to Example 1 described above, along with
A physical form and an electrical form of a sewing machine in the second embodiment are the same as those of the first embodiment except for storage areas of a RAM 63, so that description of the same configuration is omitted. Instead, the storage areas of the RAM 63 having a different configuration from those of the first embodiment will be described below. In addition to the storage areas of the RAM 63 of the first embodiment, the RAM 63 of the second embodiment may include an applique pattern area location storage area (not shown), which may store a location of an applique pattern area inside a sewable area.
Main processing of a second embodiment shown in
First, at S3 of
Next, applique pattern data location processing which is performed at S30 of
In the applique pattern data location processing shown in
On the other hand, if there is a safety area 213, such as an applique pattern area 210 of Example 1, it may be determined that there is a first safety area (YES at S33). Subsequently, the IC tag area storage area 632, a safety area storage area 634, and the safety area counter storage area 635 may be referred to in order to determine whether the IC tag area can be included in the J-TH safety area (S34). In this processing, relocation of the J-TH safety area to a relatively different position may be repeated in a condition where the IC tag area is fixed, and at each relocation, it may be determined whether the IC tag area is included in the applique pattern area. It should be noted that relocation is generally performed on such a predetermined condition that, for example, all of the locations may be combined and checked. As a result, if having determined at least once that the IC tag area is already included in the J-TH safety area, it may be determined that the IC tag area can be included in a safety area set in applique pattern data. If having determined that the IC tag area cannot be included in the safety area set in the applique pattern area (NO at S34), to read the next safety area subsequently, the safety area counter J may be incremented by 1 (S35). Then, the safety area counter J may be stored in the safety area counter storage area 635, to repeat the processing from S32.
On the other hand, if having determined that the IC tag area 131 positioned as in Example 1 shown in
Subsequently, the applique pattern area location storage area (not shown) may be referred to in order to determine whether the applique pattern area is included in the sewable area (S40). This processing may be performed in order to position the applique pattern area in the sewable area. If the applique pattern area 210 of Example 1 is positioned as shown in
On the other hand, in the example shown in
As described in detail above, according to a sewing machine 1 equipped with a sewing data processing apparatus of the second embodiment, whether the applique pattern area can be positioned in the sewable area is determined in a condition where the position of the IC tag on work cloth may be fixed and then the applique pattern area may be positioned (S30). It should be noted that in the second embodiment, the location of the IC tag may be fixed, so that in contrast to the first embodiment, the main processing shown in
According to the second embodiment detailed above, it is possible to acquire position information indicating the position on the work cloth to which the IC tag 100 may be positioned and fix the position of the IC tag on the work cloth and then determine the location of an applique pattern 200 so that the IC tag 100 attached to the work cloth may be covered by the applique pattern 200. Therefore, in a case where the position on work cloth to which an IC tag is positioned is already set, it is possible to set the position of the applique pattern that matches the position of the IC tag in accordance with the positions of the applique pattern area 210 and the IC tag area which may be set by the sewing data processing apparatus of the present disclosure.
It should be noted that the present disclosure is not limited to the second embodiment described in detail above and can be changed in a variety of manners without departing from the spirit and scope of the present disclosure, as characterized in the appended claims. For example, although the second embodiment may acquire the position information of the IC tag through the image scanner sensor 27 at S3 of
Further, the second embodiment has acquired the position information of the IC tag at S3 of
In the above-described first and second embodiments, whether an IC tag area can be positioned in the applique pattern area may be determined and the applique pattern area and the IC tag area may be set automatically. However, as in a third embodiment to be described next, a position in an applique pattern area to which an IC tag area is positioned may be selected by the user. The following will describe the processing where the user may select the position in the applique pattern area to which the IC tag is positioned by using a sewing machine 1 equipped with a sewing data processing apparatus of the third embodiment, with reference to
A physical configuration and an electrical configuration of the sewing machine 1 equipped with a sewing data processing apparatus in the third embodiment are the same as those of the first embodiment except for storage areas of a RAM 63, so that description of the same constitution with the first embodiment is omitted and, instead, the storage areas of the RAM 63 which are configured differently from those of the first embodiment are described below. In addition to the storage areas of the RAM 63 of the first embodiment, the RAM 63 of the third embodiment may include safety area candidate counter storage area (not shown) and an includable area storage area (not shown). The safety area candidate counter storage area may be used to store a safety candidate counter which may count safety area candidates. The includable area storage area may be used to store an includable area, which will be described later.
First, an applique pattern area 600 for an applique pattern of Example 2 will be described with reference to
Next, main processing of the third embodiment will be described with reference to
In the main processing of the third embodiment, it may be determined beforehand which ones of the safety areas set in the applique pattern area can include an IC tag area, Then, the safety areas that can include the IC tag areas may be determined as an includable area. The includable areas may be displayed on an LCD 15, and a user may select one of the includable areas, which are a candidate for positioning the IC tag area therein. At S45 of the main processing of
In the safety area candidate search processing shown in
On the other hand, if having determined that there is at least one safety area as in the case of Example 2 (NO at S462), it may be determined whether the IC tag area can be included in a J-TH safety area. The processing may be determined by the same processing as that of S24 of
On the other hand, in Example 2, it may be determined at S463 that the IC tag area can be included in the first safety area (YES at S463) and an includable area out of the safety areas that is capable of including the IC tag area therein as a safety area candidate may be stored in an includable area storage area (not shown) in the RAM 63 (S464). In this processing, for example, relocation of the IC tag area to a relatively different position with respect to the applique pattern area may be repeated and, upon each relocation, whether the IC tag area is included in the safety area set in the applique pattern area may be determined. It should be noted that relocation is generally performed on such a predetermined condition that, for example, all of the locations should be combined. As a result, if having determined that the IC tag area can be included in the safety area, an area where the IC tag area and the applique pattern area overlap may be stored in the includable area storage area (not shown) of the RAM 63 as an includable area. Thus, the includable area may be determined. As shown in
Subsequently, at S466, the safety area storage area 634 and the safety area counter storage area 635 may be referred to in order to determine whether all of the safety areas have been read (S466). This processing may be performed to check if each of the safety area can include the IC tag area, thereby searching for safety area candidates. In Example 2, as shown in
By much the same processing, an includable area 640 may be determined in the safety area 620 of Example 2 and may be stored in the includable area storage area (not shown) in the RAM 63 (S464). Then, the safety candidate counter K incremented by 1 (K=2) may be stored in the safety area candidate counter storage area (not shown) in the RAM 63 (S465). Then, it may be determined that all of the safety areas are read (YES at S466). Through the above processing, includable areas may be determined and the number of safety area candidates may be obtained which is the number of the safety areas determined to be capable of including the IC tag area. Then, the safety area candidate search processing may end and the process may return to the main processing shown in
Following S46 of
On the other hand, in Example 2, the number of the safety area candidate is 2 and it may be determined that the number is larger than 0 (YES at S48), so that IC tag position selection processing may be performed subsequently. This IC tag position selection processing will be described below with reference to a flowchart shown in
Subsequently, if an includable area in which to position the IC tag area is selected and entered on a touch panel 26 (S152), it may be highlighted in such a manner as to be differentiated from the other includable areas (S153). In Example 1, “1” which selects the former from among the includable areas 630 and 640 is supposed to have been entered, so that the LCD 15 may indicated the includable area 630, for example, in a color different from that of the other includable area 640 (S153).
Subsequently, on the touch panel 26, a position to which an IC tag is to be positioned is entered in such a manner that the IC tag area may be positioned to any position in the includable area highlighted at S153 (S154). This processing may be performed to position the IC tag area to a desired position in the safety area selected at S152. Subsequently, if the IC tag area is positioned to the position entered at S153, whether the IC tag area enters an unsafe area is determined (S155). Since the position of the IC tag area is entered by the user at S154, the IC tag area may enter the unsafe area depending on the entered position. The processing at S154 may be performed to cause the user to enter the position of the IC tag again if the IC tag area enters the unsafe area (YES at S155), and enable the user to input the position of the IC tag area in includable area only.
If having determined at S155 that the IC tag area does not enter the unsafe area (NO at S155), a candidate for the position to which the IC tag area is positioned is highlighted (S156). By this processing, for example, the IC tag area entered at S154 may be displayed in a color different from the other areas. Subsequently, if an instruction which determines positioning the IC tag area entered at S154 is entered by pressing a button 801 on the screen 800 (YES at S157), the location of the IC tag area may be determined to be the specified position in the includable area entered at S154 and may be stored in an IC tag area location storage area 637 (S159). Subsequently, an IC tag location flag may be set to “1” and stored in an IC tag location flag storage area 636 (S160). Then, the IC tag position selection processing may end and the process may return to the main processing shown in
On the other hand, if the instruction which determines positioning the IC tag area in the includable area highlighted at S156 is not entered but, instead, an instruction to enter a candidate number again is entered by pressing a button 802 on the screen 800 (NO at S157, YES at S158), the process may return to S151 to repeat the processing. If the user fails to enter, through the touch panel 26, an instruction to determine positioning of the IC tag area in the includable area highlighted at S156 and also fails to enter an instruction to enter the candidate number again (NO at S157, NO at S158), it may be determined that the IC tag area will not be positioned in the safety area. Subsequently, the IC tag location flag may be set to “0”, which indicates that the IC tag area cannot be positioned in the safety area set in the applique pattern area, and stored in the IC tag location flag storage area 636 (S161). Subsequently, the IC tag position selection processing may end and the process may return to the main processing shown in
As described in detail above, in the sewing machine 1 equipped with a sewing data processing apparatus of the third embodiment, the applique pattern areas capable of positioning an IC tag area therein may be determined as includable areas so that one of these includable areas may be selected as an area to position the IC tag area therein. Then, the IC tag area may be set to an indicated position in the selected includable area.
As detailed above, according to the sewing machine 1 equipped with the sewing data processing apparatus of the third embodiment, the touch panel 26 may be provided on which the user may indicate the position to which the IC tag area is to be positioned in the includable area displayed on the LCD 15. Therefore, it is possible to set the position of an IC tag area to a desired position in a notified includable area.
It should be noted that the present disclosure is not limited to the third embodiment described in detail above and can be changed in a variety of manners without departing from the spirit and scope of this disclosure, as characterized in the appended claims.
Although the third embodiment has used the touch panel 26, it may be replaced with any one of various switches, a trackball, or a joystick on a game controller that interfaces with the user. Further, although the third embodiment has used the LCD 15, the present disclosure is not limited to LCD displays; any other display device such as a plasma display or an audio device that uses a voice notification such as a speaker may be employed instead.
In the above-described first through third embodiments, the applique pattern area has been determined on the basis of applique pattern data stored beforehand in the predetermined storage area, to determine whether the IC tag area can be positioned in the applique pattern area. However, as in a fourth embodiment to be described next, an applique pattern area may be determined on the basis of a specified profile to determine whether an IC tag area can be positioned in the applique pattern area, and if it is determined that the IC tag can be positioned in the applique pattern area, applique pattern data for a specified applique pattern area may be created newly. The following will describe, with reference to
A physical configuration and an electrical configuration of the sewing machine 1 equipped with a sewing data processing apparatus in the fourth embodiment are the same as those of the first embodiment except for storage areas of an RAM 63. Therefore, description of the features shared with the first embodiment are omitted and, instead, the storage areas of the RAM 63 which are different in configuration from those of the first embodiment will be described below. In addition to the storage areas of the RAM 63 of the first embodiment shown in
Main processing of the fourth embodiment shown in
In the main processing of the fourth embodiment, an applique pattern area may be set based on a graphic profile specified by a user, a safety area may be set based on the applique pattern area. Then, it may be determined whether an IC tag can be positioned in that safety area and, if having determined that the IC tag area can be positioned in that safety area, applique pattern data having the specified profile as a profile of an applique pattern area may be newly created. Therefore, at S14 of
If having determined at S14 that no applique pattern areas are specified because no profile lines are specified by the user (NO at S14), the next processing is generally not performed until a profile line is specified. On the other hand, if having determined that profile line is specified by the user and an applique pattern area is specified (YES at S14), the profile line data indicative of the profile line may be stored in a profile line storage area (not shown) in the RAM 63. Based on a subsequently specified profile line, an area enclosed by the profile line may be set as an applique pattern area and may be stored in an applique pattern area storage area (not shown) in the RAM 63 (S16). In the processing, as Example 3, a star-shaped profile 910 such as shown in
Next, processing of S59 will be described below. At S59, the profile line storage area (not shown) and the applique pattern area storage area (not shown) in the RAM 63 may be referred to in order to create applique pattern data having the profile entered at S14 as a profile of an applique pattern. Then, the applique pattern data may be stored in an applique pattern data storage area 633 (S59). To create the applique pattern data, a heretofore known method can be employed for creating applique pattern data. By this processing, of the applique pattern data of Example 3, for example, the above-described applique pattern data shown in
As described in detail above, in the sewing machine equipped with a sewing processing apparatus of the fourth embodiment, an applique pattern area may be set on the basis of a specified profile of an applique pattern, to determine whether an IC tag area can be included in that applique pattern area. Also, simultaneously, if having determined that the IC tag area can be included, the applique pattern data of an applique pattern having the specified profile can be created.
According to the above-described sewing machine 1 equipped with the sewing data processing apparatus of the fourth embodiment, an applique pattern area may be set on the basis of a profile of an applique pattern specified, to determine whether an IC tag area can be included in that applique pattern area. Also, simultaneously, if having determined that the IC tag area can be included, the applique pattern data of an applique pattern having the specified profile may be created. It is thus possible to newly create data of an applique pattern so that an IC tag is covered by the applique pattern.
It should be noted that the present disclosure is not limited to the fourth embodiment described in detail above and can be changed in a variety of manners without departing from the spirit and scope of this disclosure, as characterized in the appended claims.
For example, although the fourth embodiment has used the touch panel 26, it may be replaced with any one of various switches, a trackball, or a joystick on a game controller that interfaces with the user.
According to the above-described sewing data processing apparatus and a computer-readable recording medium in which a sewing data processing program for causing the sewing data processing apparatus to perform processing may be recorded, it is possible to set positions of an applique pattern area and an IC tag area of an IC tag attached to the work cloth, in such a manner that the IC tag area may be included in the applique pattern area. Therefore, according to locations of an applique pattern area and an IC tag area set by a sewing data processing apparatus of the present disclosure, it may be possible to cover an IC tag attached to the work cloth by the cloth piece on which the applique pattern is formed, so that the IC tag capable of holding a lot of information can be attached to the work cloth without damaging a design of the work cloth.
Further, according to the above-described sewing data processing apparatus and a computer-readable recording medium in which a sewing data processing program for causing the sewing data processing apparatus to perform processing is recorded, in a case where an applique pattern area and an IC tag area are specified to the desired positions in a sewable area, it is possible to set the applique pattern area and the IC tag area to the specified positions based on whether the IC tag area is included in that applique pattern area.
Further, according to a sewing machine equipped with the above-described sewing data processing apparatus, the above-described sewing data processing apparatus is provided, so that similar advantages as those described above in connection with the apparatus can be obtained.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2006-264287 | Sep 2006 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 5855176 | Takenoya et al. | Jan 1999 | A |
| 7058471 | Watanabe | Jun 2006 | B2 |
| Number | Date | Country |
|---|---|---|
| U-64-013575 | Jan 1989 | JP |
| A-01-126995 | May 1989 | JP |
| B2-06-067422 | Aug 1994 | JP |
| A-09-269966 | Oct 1997 | JP |
| A-11-004984 | Jan 1999 | JP |
| A-11-015377 | Jan 1999 | JP |
| A-2000-008269 | Jan 2000 | JP |
| A-2004-118404 | Apr 2004 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20080190339 A1 | Aug 2008 | US |
