Embodiments of the invention relate to small form factor pluggable (SFP) communication modules and cages that receive these modules.
With the expansion of communication networks to connect ever more people to each other and to sources of entertainment and information, and to support autonomous communication between devices that support modern technology and culture, the networks have provided an enormous increase in communication connectivity and bandwidth. The physical infrastructures that support the networks have become increasingly more complex and have developed to enable an increasing variety of communication functionalities.
To provide for a greater variety of functionalities, optical fiber interfaces have, by practical necessity, been configured in small modules that are easily mounted onto communications equipment. By using such modules, communications equipment can be easily adapted to a large variety of optical fiber physical layers, such as single-mode or multi-mode fiber; short-range (less than 1 km), long range (10 km), or extended-range (80 km) coverage; different wavelengths of light such as 850, 1310, 1490, or 1550 nm (nanometer); and single wavelength, Coarse Wavelength Division Multiplexing (CWDM), or Dense Wavelength Division Multiplexing (DWDM). Without such modules communications equipment vendors would need to manufacture a wide variety of equipment, identical in communications functionality but differing in fiber optical interface characteristics.
Modern versions of these communications modules are pluggable, i.e. they may easily be inserted into and removed from matching receptacles, referred to as “cages” mounted on panels of communications equipment, such as switches and routers. The cages serve to mechanically and electronically connect the communication modules inserted into the cages to the communications equipment.
Standards for small communication modules, such as Small Form-factor Pluggable (SFP) modules, Enhanced Small Form-factor Pluggable (SFP+) modules, 10G Form-factor Pluggable (XFP) modules, 100G Form-factor Pluggable (CFP) modules, and Gigabit Interface Converter (GBIC) modules, have been specified by industry groups in agreements known as “multisource agreements (MSA)”. Multisource agreements specify electrical, optical, and physical features of the modules. Hereinafter the acronym “SFP” may be used generically to reference small communication modules, such as any of the exemplary small communication modules noted above.
Conventional small communications modules such as SFPs are limited in functionality to performing electric to optical and optical to electric conversions. Recently, additional functionalities have been implemented inside such modules, effectively turning these modules into sophisticated network elements in their own right. For example, U.S. Pat. No. 7,317,733 to Olsson and Salemi describes performing Ethernet to TDM protocol conversion inside an SFP. US patent application 2006/0209886 to Silberman and Stein further describes pseudowire encapsulation inside an SFP. U.S. Pat. No. 7,933,518 to Li et al describes performing optical loopback and dying gasp inside an SFP. U.S. Pat. No. 7,693,178 to Wojtowicz describes inserting Passive Optical Network ONU functionality into an SFP. SFPs and similar pluggable modules with such additional functionalities save rack space, power, and cabling, but suffer from the same deficiency as communications equipment before the introduction of SFPs, namely that vendors need to manufacture a wide variety of SFPs identical in communications functionality while differing only in fiber optical interface characteristics.
An embodiment of the invention relates to providing a receptacle, referred to as a “super cage”, that can be plugged into a conventional SFP cage and into which an SFP module can be plugged and electrically connected to mechanically and electrically connect the SFP module to the conventional cage. The super cage comprises circuitry and/or devices, hereinafter also referred to as “functionality circuitry”, that provides the SFP module with an additional functionality and/or services, hereinafter generically referred to as a “functionality”. A “conventional cage” hereinafter refers to a receptacle that conforms to an MSA standard.
In accordance with an embodiment of the invention, the functionality circuitry provides a processing functionality, such as by way of example, protocol translation and/or a dying gasp alarm, for the SFP module. Optionally, the functionality circuitry comprises a mini-fan that generates air flow through the super cage and the SFP module to enhance dissipation of heat from the module.
In the discussion, unless otherwise stated, adjectives such as “substantially” and “about” modifying a condition or relationship characteristic of a feature or features of an embodiment of the invention, are understood to mean that the condition or characteristic is defined to within tolerances that are acceptable for operation of the embodiment for an application for which it is intended.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
Non-limiting examples of embodiments of the invention are described below with reference to figures attached hereto that are listed following this paragraph. Identical structures, elements or parts that appear in more than one figure are generally labeled with a same numeral in all the figures in which they appear. Dimensions of components and features shown in the figures are chosen for convenience and clarity of presentation and are not necessarily shown to scale.
In the following detailed description, conventional SFPs and SFP cages are discussed with reference to
SFP module 50 comprises an edge connector 52, which has conductive contacts 53 that are electrically connected to circuitry (not shown) in the SFP. Whereas conductive contacts 53 are shown only on the upper side of the connector, they may be on the upper and/or the lower of the connector. SFP cage 20 comprises a cage socket 22 having conducting contacts 24 that match conducting contacts 53 and are electrically connected to conductive traces (not shown) in host PCB 41. The conductive races in host PCB 41 connect the conducting contacts of the socket to circuitry (not shown) in communications device 40. Cage socket 22 is configured to receive connector 52 and connect conductive contacts 53 of the connector to matching conductive contacts 24 in cage socket 22, and thereby to electrically connect the transceiver to circuitry in communication device 40.
Conventional SFP cage 20 optionally comprises a spring latch 25 formed having a hole 26 that receives and engages a matching “latch button” (not shown) in SFP transceiver 50 to lock the SFP transceiver in the cage when it is fully inserted into the cage. A release lever 54 is pulled downward to push a slider 55 (only a portion of which is shown in
Generally, a communication device, such as a switch or router, comprises a bank of conventional SFP cages and is configured to receive and process signals from a plurality of different SFP modules.
Super cages, in accordance with embodiments of the invention conveniently provide additional functionalities for SFP modules generally without need for re-cabling and reconfiguring physical communication equipment.
Super cage 110 optionally comprises a sleeve 101 housing a “functionality” printed circuit board (PCB) 120 and a coupling socket 140. The sleeve is shown in dashed lines in
In an embodiment, the super cage further comprises a latch button (not shown) similar to a latch button in an SFP module that is engaged by spring latch 25 of SFP cage 20 to lock the super cage in the SFP cage when the super cage is fully inserted into the SFP cage. A release slider 110, only an edge of which is shown in
Coupling socket 140 is configured to receive an SFP connector of a conventional SFP module, hereinafter assumed by way of example to be SFP transceiver 50 (
Functionality PCB 120 comprises a cage connector 121 having conductive contacts 122 that are electrically connected to the functionality circuitry (not shown in
Features and details of super cage 100 are discussed below with reference to
In an embodiment of the invention sleeve 101 is formed having snap tabs 104, a stop catch 105, side lock openings 106, and guide fins 107. Coupling socket 140 is optionally injection molded from a suitable polymer and is formed having a socket cavity 141 and catch nub 142. Upper and lower walls 143 and 144 of socket cavity 141 are formed having conductive contacts 145, which are shown in the perspective of the figure only on bottom wall 144.
In an embodiment of the invention functionality PCB 120 comprises protruding sidebars 126 that provide the functionality PCB with shoulders 127. Optionally, back-end cowling 150 is formed having slots 151, shown in the perspective of
Release slider 110 comprises a depressor tongue 111 for depressing spring latch 25 (
In an embodiment of the invention, functionality region 125 contains electric circuitry and/or a Field Programmable Gate Array (FPGA) and/or an Application Specific Integrated Circuit and/or a Central Processing Unit (CPU), in order to provide an additional functionality. Such functionality may include packet inspection, statistics collection, packet header editing, packet insertion and removal, and traffic conditioning.
Packet inspection, including Deep Packet Inspection, may be employed in order to detect anomalous or potentially malicious packets, or to classify packets and collect statistics regarding applications in use, or to monitor and optionally police/shape traffic flows.
Packet header editing may be used for packet marking (e.g., drop eligibility marking), manipulation of Ethernet VLAN tags (insertion of a tag, deletion of a tag, swapping a tag value), manipulation of MPLS label stacks (pushing a label(s), swapping a label, popping a label), or protocol conversion (Rate Interface Conversion, TDM to packet conversion, pseudowire encapsulation, etc.).
Packet insertion and deletion may be used for Operations, Administration, and Maintenance functionality (e.g., Ethernet OAM according to ITU-T Recommendation Y.1731 and or IEEE 802.3 Clause 57, IP performance measurement via One-Way or Two-Way Active Measurement Protocol (OWAMP/TWAMP), and for terminating control or management protocols. In an embodiment, the functionality region is configured to pass most packets transparently from the conventional SFP to the cage socket, but to be responsive to specific OAM or performance measurement packets. In an embodiment, the functionality region may be configured as a reflector or responder that reflects packets with specific characteristics back to their source, or selective responds to packets with specific characteristics.
Traffic conditioning may be used to match traffic parameters to configured levels, such as Ethernet bandwidth profiles as defined in Metro Ethernet Forum Technical Specification MEF-10.2. In an embodiment of the invention, packet inspection, header editing, and OAM functionalities are combined with traffic conditioning to implement an Ethernet Network Interface Device (NID) or Ethernet Network Termination Unit (NTU).
In some embodiments of the invention, functionality circuitry to be included in a functionality PCB is not conveniently included in a functionality PCB having a size and construction shown in
Functionality PCB 220 comprises upper and lower sub-PCBs 221 and 222 respectively. The portions are electrically and physically connected by a flexible neck 223 comprising conductive traces (not shown) that connect functionality circuitry components (not shown) located on bottom portion 222 with functionality circuitry components (not shown) located on top portion 221. In an embodiment of the invention functionality PCB 220 is formed by slotting a PCB to form the two PCB portions connected by the neck region. The neck region is thinned, for example by etching or abrading, to make it sufficiently flexible so that it can be bent to position the PCB portions one over the other, as shown in
By way of example, functionality PCB 220 may have functionality circuitry similar to functionality circuitry 250 schematically shown in
In the description and claims of the present application, each of the verbs, “comprise” “include” and “have”, and conjugates thereof, are used to indicate that the object or objects of the verb are not necessarily a complete listing of components, elements or parts of the subject or subjects of the verb.
Descriptions of embodiments of the invention in the present application are provided by way of example and are not intended to limit the scope of the invention. The described embodiments comprise different features, not all of which are required in all embodiments of the invention. Some embodiments utilize only some of the features or possible combinations of the features. Variations of embodiments of the invention that are described, and embodiments of the invention comprising different combinations of features noted in the described embodiments, will occur to persons of the art. The scope of the invention is limited only by the claims.
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Number | Date | Country | |
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20130210275 A1 | Aug 2013 | US |