Shaft portion of an apparatus for holding and heating semiconductor wafers or the like

Information

  • Patent Grant
  • D630657
  • Patent Number
    D630,657
  • Date Filed
    Wednesday, August 27, 2008
    16 years ago
  • Date Issued
    Tuesday, January 11, 2011
    14 years ago
  • US Classifications
    Field of Search
    • US
    • D15 138
    • D15 140
    • D15 1441
    • D15 199
    • D26 51- 63
    • 438 584000
    • 438 689000
    • 438 692000
    • 451 288000
    • 451 289000
    • 451 388000
  • International Classifications
    • 1509
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a perspective view of a shaft portion of an apparatus for holding and heating semiconductor wafers or the like;



FIG. 2 is a front view thereof, a rear view being the same image of a front view;



FIG. 3 is a right side view thereof, a left side view being the same image of a right side view;



FIG. 4 is a bottom plan view thereof; and,



FIG. 5 is a sectional view taken vertically at the center of the portion shown by 55 in FIG. 2.


The broken lines showing on the drawing disclosure are for illustrative purposes only and form no part of the claimed design. The lines consisting of long lines and dots indicate conceptual border lines between the claimed portions and the disclaimed portions.


Claims
  • The ornamental design for a shaft portion of an apparatus for holding and heating semiconductor wafers or the like, as shown and described.
Priority Claims (1)
Number Date Country Kind
2008-004937 Feb 2008 JP national
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Foreign Referenced Citations (3)
Number Date Country
D1345656 Oct 2008 JP
M298774 Oct 2006 TW
D118408 Aug 2007 TW