Claims
- 1. A process for manufacturing a disposable multi-chamber chip, each chamber having low thermal capacity and good thermal isolation from its neighbors, comprising;
providing a mold whose surface includes a plurality of shallow depressions having a depth; placing at least one sheet of a first plastic material, having a first softening temperature, on said mold surface; on said first plastic material, placing a sheet of a second plastic material that has a second softening temperature that is less than said first softening temperature; heating all materials to said second softening temperature; applying uniform pressure between said plastic sheets and said mold whereby said second plastic material flows, thereby forcing said sheet of first plastic material to conform to said mold surface; then cooling until said second plastic material has fully hardened; and separating said plastic materials one from another and then removing the sheet of first plastic material from the mold, thereby forming said disposable multi-chamber chip.
- 2. The process described in claim 1 wherein said mold is silicon or Ni.
- 3. The process described in claim 1 wherein said first plastic material is selected from the group consisting of PP, PC, and PET.
- 4. The process described in claim 1 wherein said second plastic material is selected from the group consisting of PC and PMMA.
- 5. The process described in claim 1 wherein said uniform applied pressure is at least 5 KN.
- 6. The process described in claim 1 wherein said second softening temperature is between about 50 and 100° C. less than said first softening temperature.
- 7. A process for multi-chamber thermal multiplexing wherein each chamber has low thermal capacity and is thermally isolated from its neighbors, comprising;
providing a mold whose surface includes a plurality of shallow depressions having a depth; placing at least one sheet of a first plastic material, having a first softening temperature, on said mold; on said first plastic material, placing a sheet of a second plastic material that has a second softening temperature that is less than said first softening temperature; heating all materials to said second softening temperature; applying uniform pressure between said plastic sheets and said mold whereby said second plastic material flows, thereby forcing said sheet of first plastic material to conform to said mold surface; then cooling until said second plastic material has fully hardened; separating said plastic materials one from another and then removing the sheet of first plastic material from the mold, thereby forming a plurality of shallow chambers in a disposable plastic chip having a top surface; placing said plastic chip on an array of heating blocks whose size and spacing matches that of said multi-chamber array; filling at least two of said chambers with liquid samples in the form of layers that are less than 500 microns thick; bonding a cover slip to said top surface so that each liquid sample is completely sealed within its own chamber; and then using said heating blocks to heat said liquid samples.
- 8. The process described in claim 7 wherein said mold is silicon or Ni.
- 9. The process described in claim 7 wherein said first plastic material is selected from the group consisting of PP, PC, or PET.
- 10. The process described in claim 7 wherein said second plastic material is selected from the group consisting of PC and PMMA.
- 11. The process described in claim 7 wherein said uniform applied pressure is at least 5 KN.
- 12. The process described in claim 7 wherein said second softening temperature is between about 50 and 100° C. less than said first softening temperature.
- 13. The process described in claim 7 wherein the step of using said heating blocks to heat said liquid samples further comprises simultaneously heating different liquid samples to different temperatures.
- 14. A process for multi-chamber thermal multiplexing wherein each chamber has low thermal capacity and is thermally isolated from its neighbors, comprising;
providing a mold whose surface includes a plurality of shallow depressions having a depth; placing at least one sheet of a first plastic material, having a first softening temperature, on said mold; on said first plastic material, placing a sheet of a second plastic material that has a second softening temperature that is less than said first softening temperature; heating all materials to said second softening temperature; applying uniform pressure between said plastic sheets and said mold whereby said second plastic material flows, thereby forcing said sheet of first plastic material to conform to said mold surface; then cooling until said second plastic material has fully hardened; separating said plastic materials one from another and then removing the sheet of first plastic material from the mold, thereby forming a plurality of shallow chambers in a disposable plastic chip having a top surface; inserting the disposable plastic chip into cavities singly located within an array of heat sinks whose size and spacing matches that of said multi-chamber array; filling at least two of said chambers with liquid samples in the form of layers that are less than 500 microns thick; placing an array of heating blocks, whose size and spacing matches that of said multi-chamber array, in contact with said plastic chip top surface to so that each liquid sample is completely isolated within its own chamber; applying and then maintaining uniform pressure between said heat sink array and said heating block array, thereby ensuring good heat transfer between them and said liquid samples; and then using said heating blocks to heat said liquid samples.
- 15. The process described in claim 14 wherein said mold is silicon or Ni.
- 16. The process described in claim 14 wherein said first plastic material is selected from the group consisting of PP. PC, and PET.
- 17. The process described in claim 14 wherein said second plastic material is selected from the group consisting of PC and PMMA.
- 18. The process described in claim 14 wherein said uniform applied pressure is at least 5 KN.
- 19. The process described in claim 14 wherein said second softening temperature is between about 50 and 100° C. less than said first softening temperature.
- 20. The process described in claim 14 wherein the step of using said heating blocks to heat said liquid samples further comprises simultaneously heating different liquid samples to different temperatures.
- 21. A disposable multi-chamber chip wherein each chamber has low thermal capacity and is thermally isolated from its neighbors, comprising;
a continuous plastic sheet having a top surface and a thickness that is less than about 200 microns; an array of depressions in said plastic sheet that extend downwards from said top surface a distance of no more than about 500 microns; and said depressions being separated one from another by at least 1 mm.
- 22. The disposable multi-chamber chip described in claim 21 further comprising an attached outer frame that serves to increase the rigidity of said chip.
- 23. The disposable multi-chamber chip described in claim 21 further comprising micro-channels that extend outwards, parallel to said top surface, from said depressions, serving thereby to prevent bubble formation.
- 24. The disposable multi-chamber chip described in claim 21 wherein said plastic sheet is selected from the group consisting of PP, PC. And PET.
- 25. The disposable multi-chamber chip described in claim 21 wherein, relative to all neighboring heat sources, each chamber has a thermal conductance that is less than about 50-70 WK−1.
- 26. The disposable multi-chamber chip described in claim 21 wherein a temperature uniformity of less than about 0.5° C. can be maintained within a given liquid placed in one of said depressions.
- 27. The disposable multi-chamber chip described in claim 21 wherein a given liquid, placed in one of said depressions, can have its mean temperature controlled to a precision level of about 0.1° C.
- 28. A multi-chamber thermal multiplexer, comprising;
a disposable plastic chip in the form of a continuous plastic sheet having a top surface and a thickness that is less than about 200 microns; an array of depressions in said plastic sheet that extend downwards from said top surface a distance of no more than about 500 microns; said depressions being separated one from another by at least 1 mms; said plastic chip being in contact with an array of heating blocks whose size and spacing matches that of said multi-chamber array; at least two of said chambers being filled with liquid samples; and a cover slip being bonded to said top surface so that each liquid sample is completely sealed within its own chamber.
- 29. The multi-chamber thermal multiplexer described in claim 28 further comprising
an outer frame attached to said disposable chip that serves to increase the rigidity of said chip.
- 30. The multi-chamber thermal multiplexer described in claim 28 further comprising micro-channels that extend outwards, parallel to said top surface, from said depressions, serving thereby to prevent bubble formation.
- 31. The multi-chamber thermal multiplexer described in claim 28 wherein said disposable plastic chip is selected from the group consisting of PP, PC, and PET
- 32. The multi-chamber thermal multiplexer described in claim 28 wherein, relative to all neighboring heat sources, each chamber has a thermal conductance that is less than about 50-70 WK−1.
- 33. A multi-chamber thermal multiplexer, comprising;
a disposable plastic chip in the form of a continuous plastic sheet having a top surface and a thickness that is less than about 200 microns; an array of depressions in said plastic sheet that extend downwards from said top surface a distance of no more than about 500 microns; said depressions being separated one from another by at least 1 mm; the disposable plastic chip having been inserted into cavities, each such cavity being located within an array of heat sinks whose size and spacing matches that of said multi-chamber array; at least two of said chambers having been filled with liquid samples; and said plastic chip top surface being bonded to an array of heating blocks whose size and spacing matches that of said multi-chamber array so that each liquid sample has been completely sealed within its own chamber.
- 34. The multi-chamber thermal multiplexer described in claim 33 further comprising an outer frame attached to said disposable chip that serves to increase the rigidity of said chip.
- 35. The multi-chamber thermal multiplexer described in claim 33 further comprising micro-channels that extend outwards, parallel to said top surface, from said depressions, serving thereby to prevent bubble formation.
- 36. The multi-chamber thermal multiplexer described in claim 33 wherein said disposable plastic chip is selected from the group consisting of PP, PC, and PET.
- 37. The multi-chamber thermal multiplexer described in claim 33 wherein, relative to all neighboring heat sources, each chamber has a thermal conductance that is less than about 50-70 WK−1.
Parent Case Info
[0001] This application claims priority to US Provisional Patent Application serial No. 60/456,929, filed on Mar. 24, 2003, which is herein incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60456929 |
Mar 2003 |
US |