This application is a Section 371 National Stage Application of International Application No. PCT/CN2011/001281, filed on Aug. 3, 2011, which claims priority to Chinese Application No. CN201110099133.5, filed on Apr. 20, 2011 entitled “Shallow Trench Isolation Structure, Manufacturing Method Thereof and a Device Based on the Structure”, the entire contents of which are incorporated herein by reference in their entirety.
The present invention relates to the semiconductor manufacture field, and particularly to a shallow trench isolation structure, a manufacturing method thereof and a device based on the structure.
With the fast development of semiconductor manufacturing technology, integrated circuit manufacturing process has entered technology node of 22 nm or blow, the size of a semiconductor device and isolation structure for such semiconductor device has been reduced accordingly. After the 0.25 μm technology node, the isolation region between elements in an active region of a semiconductor device is typically formed by a shallow trench isolation (STI) process.
In the prior art, the process of forming a STI structure typically comprises the following steps:
Then, as shown in
After that, as shown in
Thereafter, as shown in
After performing CMP, the hard mask is also removed, as shown in
Then, when the feature size of a device is reduced to below 22 nm node, filling of STI will be a big problem, and the process tolerance of STI filling will also become narrower. It is still the same even if the most general high density plasma deposition (HDP) process and the more advanced high aspect ratio plasma deposition (HARP) process are used.
Besides, since the hard mask will be partly consumed in the processing of forming a trench, and the surface of the rest of the hard mask becomes rough, causing the height of the surface thereof becomes uneven. Particularly, the unevenness of the surface of the hard mask becomes even more obvious with the reducing of the feature size. From
Therefore, a new STI isolation structure and a manufacturing method thereof is desired, by which the problem of filling a small-size trench without causing step height could be solved.
Besides, with the reducing of the size of an isolation structure, the isolation effect between devices is getting worse. Although in the case of the same transverse pitch P (the transverse width of an active region plus an isolation region) as shown in
Therefore, a new STI isolation structure and a manufacturing method thereof are further desired, by which good characteristics of the device are kept while a good isolation effect is maintained.
In order to solve the beforesaid problems, according to a first aspect of the present invention, there is provided a method for manufacturing a shallow trench isolation (STI) structure, characterized in comprising the following steps: providing a semiconductor substrate; forming an insulating medium on said semiconductor substrate; etching a part of the insulating medium by using a mask to expose the semiconductor substrate thereunder, the unetched insulating medium forming STI regions; and epitaxially growing a semiconductor layer on said semiconductor substrate between said STI regions as an active region.
According to a second aspect of the present invention, there is provided a shallow trench isolation (STI) structure, characterized in comprising: a semiconductor substrate; a patterned insulating medium formed on the semiconductor substrate as a STI region; and a semiconductor layer formed on the semiconductor substrate between STI regions as an active region, wherein the material of said semiconductor layer is identical with that of said semiconductor substrate.
According to a third aspect of the present invention, there is provided a CMOS device, characterized in comprising the shallow trench isolation structure as stated in the first aspect of the present invention, wherein a PMOS transistor and a NMOS transistor are formed in the two adjacent active regions, respectively.
According to a fourth aspect of the present invention, there is provided a Dynamic Random Access Memory (DRAM) or a Flash comprising the CMOS device as stated in the third aspect of the present invention.
In summary, the present invention accomplishes manufacturing of a STI structure by the process of first etching and then epitaxially growing, whereby the problem of filling a small-size trench is solved and the problem of STI step height is overcomed. Moreover, the shape of a STI can be adjusted through an etching process, whereby a STI structure which can achieve a good isolation effect and to increase the effective area of an active region of a device is obtained, and performance of the device is thus enhanced.
Embodiments of the present invention can be best understood with reference to the following descriptions and drawings showing each of the embodiments.
a-1e are cross-sectional views of a STI structure obtained by using a method for manufacturing a STI structure according to the prior art;
One or more aspects of the embodiment of the present invention are described below with reference to the drawings, wherein generally the same element is denoted by the same reference sign throughout the drawings. In the following description, in order for illustration, many specifics are discussed in order to provide thorough understanding of one or more aspects of the embodiment of the present invention. However, it is obvious for those skilled in the art that one or more aspects of the embodiment of the invention can be implemented by making use of few of said specifics.
In addition, although particular features or aspects of the embodiment are disclosed by only one of the implementing modes, yet such features or aspects may be incorporated with other features or aspects of other implementing modes which may be desired and advantageous for any given or particular application.
First, a semiconductor substrate 200 as shown in
Then, an insulating medium 202 is formed on the semiconductor substrate 200, as shown in
Then, a photoresist layer 204 is coated on the insulating medium 202, and patterned through lithography technology such as exposure and development to expose a part of the insulating medium, as shown in
Thereafter, the exposed part of insulating medium is removed to expose the semiconductor substrate 200 thereunder by either a dry etching process, such as reactive ion etching (RIE) or plasma etching, or a wet etching process or the combination thereof, then the photoresist layer is removed, whereby a structure as shown in
After cleaning the wafer, a semiconductor layer is epitaxially grown on said semiconductor substrate 200 between STI regions as an active region 208 of the device. The epitaxial growth is performed by, for example, metal-organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE). Except that the crystallization direction of the epitaxial layer is the same as that of the substrate, other characteristics, such as material, conduction type and resistivity of the layer can be selected freely. Preferably, the material of said semiconductor layer may be identical with the material of said semiconductor substrate 200. In the embodiment where the semiconductor substrate is formed of silicon, said semiconductor layer is preferably formed of silicon.
After that, planarization is performed by a CMP process, the redundant epitaxial semiconductor layer is removed to obtain the final structure, as shown in
It should be noted herein that, in the prior art, etching is performed to a semiconductor layer, the unetched semiconductor layer serves as an active region, and the region where the semiconductor part has been etched can form a STI region by means of a process of filling a medium. The technical solution of the present invention is completely different from the prior art: the present invention forms a shallow isolation region naturally by etching an insulating layer on a semiconductor substrate, and forms an active region by epitaxially growing a semiconductor material at the position where the insulating layer is etched, thus, a STI filling process is not needed. Besides, since the present invention does not use a hard mask, there isn't the problem of influence on the device performance due to the step height caused by removing the hard mask. A transverse width D1 (as shown in
It should be pointed out that if it is only for solving the problem of filling a small-size trench and overcoming the defect of STI step height, the present invention does not have any limitation to the shape of a STI region, for example, the STI region may be formed into a substantially vertical rectangular structure viewed from its cross-section (as shown in
In
Similarly, various STI structures as shown in
In the structures as shown in
Under the teaching of the present invention, those skilled in the art can easily conceive of obtaining various shapes of a STI region which can both increase a transverse width of an active region and keep good isolation effect by changing the etching process.
Preferably, a lining oxide layer 210 can be formed on a top surface and sidewalls of said shallow trench isolation region prior to the step of epitaxial growth, as shown in
A further embodiment of the present invention comprises a CMOS device 300 manufactured on said formed structure, wherein the aforesaid STI region is used as an isolation region 302 of the CMOS device, and a PMOS transistor and a NMOS transistor are formed in two adjacent active regions 304, respectively, as shown in
In summary, with the manufacturing method of the present invention, a STI structure may be manufactured without performing STI filling, thus, there isn't the problem in device performance caused by the step height in the prior art. Besides, the shape of a STI can be adjusted through an etching process, whereby a STI structure which can achieve a good isolation effect and increase an effective area of an active region of a device is obtained.
The above is only a preferred embodiment of the present invention, which does not intend to make any limitation to the invention. Therefore, various modifications and variations may be made to the invention without departing from the principle of the technical method of the present invention and the scope defined by the attached claims.
Number | Date | Country | Kind |
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2011 1 0099133 | Apr 2011 | CN | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CN2011/001281 | 8/3/2011 | WO | 00 | 6/27/2012 |
Publishing Document | Publishing Date | Country | Kind |
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WO2012/142734 | 10/26/2012 | WO | A |
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