Patent Application
20240217768
The present invention relates to a sheet connection device, a sheet connection method, and a sheet replacement system. More particularly, the present invention relates to a sheet connection device and a sheet connection method that allow a bonding sheet such as a protecting sheet, which is to be bonded onto a semiconductor wafer, to be connected to another bonding sheet. Further, the present invention also relates to a sheet replacement system for replacing one bonding sheet with another bonding sheet.
Hitherto, a semiconductor wafer has been reduced in thickness by, for example, forming a circuit pattern on a front surface and thereafter grinding a back surface. Further, for grinding the back surface of the semiconductor wafer, for example, a protecting sheet (also referred to as “back grinding (B/G) tape”) is bonded onto the front surface of the semiconductor wafer so as to protect the circuit pattern. Further, for dicing the semiconductor wafer into chips, a dicing tape is bonded onto a dicing frame and the semiconductor wafer. Further, for formation of semiconductor chips, a dry film resist is bonded onto the back surface of the semiconductor wafer in some cases. For the bonding of, for example, the protecting sheet, the dicing tape, and the dry film resist described above, various kinds of sheet bonding devices have been used.
Incidentally, in the sheet bonding device described above, the protecting sheet, the dicing tape, or the dry film resist is supplied in the form of, for example, sheet roll. Thus, after all the sheet is used up, an operator is required to remove a roll of the previous sheet roll and place a new sheet roll. In replacement work for a new sheet roll, it is necessary to pass a new bonding sheet into the sheet bonding device. Thus, there is a problem in that the replacement work requires time. Further, during the replacement work, the production of semiconductor wafers is required to be stopped. Thus, there is a problem in that costs are increased. Further, operation time differs depending on whether the replacement work is performed by a skilled worker or an unskilled worker who is inexperienced in the work. Thus, there is another problem in that replacement work time may differ depending on workers.
For the replacement of, for example, the protecting sheet, the dicing tape, and the dry film resist described above, it is considered that a burden of a sheet passage process into the device in the replacement work can be alleviated by connecting a sheet of a new sheet roll to a trailing edge of the previously used sheet. Thus, an adhesive-tape connection device that connects adhesive tapes to each other has been known as a device for connecting sheets (for example, Patent Literature 1).
However, the adhesive-tape connection device described in Patent Literature 1 uses an adhesive sticking member to connect release paper (corresponding to a release sheet). Thus, there is a problem in that costs are increased due to the use of a supply mechanism for the sticking member and the sticking member being a consumable.
Further, for example, a device that bonds a sheet such as a protecting sheet onto a semiconductor wafer uses a sheet having a width larger than an outer diameter of the semiconductor wafer. Thus, in order to pull out a sheet from a sheet roll, it is considered that a relatively large tensile force is required. Specifically, if sheets are not reliably connected to each other, there may arise a problem in that the connected sheets are disconnected in midway and separated from each other. Recently, in particular, the semiconductor wafer has been increased in diameter (for example, to 300 mm or larger), and hence the above-mentioned problem has become more pronounced.
For the adhesive-tape connection device described in Patent Literature 1, however, a tape width of the sticking member is also required to be increased with an increase in tape width. Thus, there is a problem in that costs for the sticking member may increase. In particular, in order to use the sticking member for a bonding sheet that requires the tensile force described above, the tape width of the sticking member is required to be increased. Thus, there is a problem in that an increase in costs may become pronounced. Further, without reliable connection of the adhesive tapes to each other, the connected sheets may become wavy and thus useless and wasted. In addition, the tensile force may disconnect and separate the connected adhesive tapes from each other.
In view of the problems described above, the present invention has an object to provide a sheet connection device and a sheet connection method that enable reliable connection of a plurality of bonding sheets to each other. Further, the present invention has another object to provide a sheet replacement system that enables replacement of one bonding sheet with another bonding sheet by connecting the one bonding sheet to the another bonding sheet.
(1) In order to solve the above-mentioned problems, there is provided a sheet connection device for connecting a first bonding sheet arranged on an upstream side in a supply direction and a second bonding sheet arranged on a downstream side in the supply direction with respect to the first bonding sheet to each other in the supply direction, the first bonding sheet and the second bonding sheet each being a bonding sheet including an adhesive sheet and a release sheet formed at least on an adhesive surface of the adhesive sheet in an overlapping manner, the sheet connection device including: a pair of adhesive rollers, which are provided on the upstream side in the supply direction so as to be movable closer to and away from each other with respect to the bonding sheet arranged therebetween, and are capable of holding the bonding sheet therebetween when being moved closer to each other; a joining unit and a cutting unit that are disposed along a supply passage for the bonding sheet; and a pair of feed rollers, which are provided on the downstream side in the supply direction with respect to the joining unit and the cutting unit so as to be movable closer to and away from each other with respect to the bonding sheet arranged therebetween, and are capable of holding the bonding sheet therebetween when being moved closer to each other. The cutting unit is capable of forming a connected end portion by cutting the second bonding sheet in a width direction intersecting with the supply direction. The pair of adhesive rollers each have a surface with adhesiveness and are capable of separating a connecting end portion of the first bonding sheet into the adhesive sheet and the release sheet to form a separated portion by feeding the first bonding sheet from the upstream side toward the downstream side while holding the connecting end portion therebetween. The feed rollers are capable of inserting the connected end portion into the separated portion by feeding the second bonding sheet toward the connecting end portion while holding the second bonding sheet therebetween. The joining unit is configured to connect the connecting end portion and the connected end portion to each other by adhesion or welding under a state in which the connected end portion is inserted into the connecting end portion.
The sheet connection device described above forms the separated portion by separating the connecting end portion of the first bonding sheet into the adhesive sheet and the release sheet with use of the adhesive rollers and inserts the connected end portion of the second bonding sheet into the separated portion. In this manner, an adhesive surface (back surface) of the adhesive sheet of the first bonding sheet is bonded onto a non-adhesive surface (front surface) of the adhesive sheet of the second bonding sheet. Thus, with the sheet connection device described above, adhesive strength allows the first bonding sheet and the second bonding sheet to be temporarily connected to each other. Further, the sheet connection device described above can weld and connect the connecting end portion of the first bonding sheet and the connected end portion of the second bonding sheet to each other through heating under a state in which the second bonding sheet is held onto the first bonding sheet through temporary connection. The sheet connection device described above can reliably connect the connecting end portion and the connected end portion to each other with high precision in the above-mentioned manner. Further, the sheet connection device described above can connect the connected end portion of the second bonding sheet through adhesion using an adhesive. The sheet connection device described above can reliably connect the connecting end portion and the connected end portion to each other with high precision in the above-mentioned manner.
Further, for example, an additional bonding member for connection is not required to be prepared, and a connection margin can be set smaller. Thus, costs can be reduced. Accordingly, the sheet connection device particularly suitable for replacement of the bonding sheet can be provided. Further, the connecting end portion and the connected end portion can reliably be connected to each other through thermal welding. Thus, disconnection between the first bonding sheet and the second bonding sheet that have been connected to each other can be suppressed during the supply of the sheet. Further, waste of the sheet that may become useless due to waving of the sheet that occurs after the connection can be suppressed.
(2) In the sheet connection device of the present invention described above, it is preferred that the joining unit be configured to weld and connect the release sheet in the connecting end portion and the release sheet in the connected end portion to each other through heating.
With the configuration described above, the release sheet in the connecting end portion and the release sheet in the connected end portion can reliably be connected to each other. Thus, the disconnection between the first bonding sheet and the second bonding sheet that have been connected to each other can be suppressed during the supply of the sheet. Further, an additional bonding member for connection is not required to be prepared, and thus an increase in costs can be suppressed.
(3) In the sheet connection device of the present invention described above, it is preferred that the joining unit be configured to cause adhesion and connect the release sheet in the connecting end portion and the release sheet in the connected end portion to each other through application of an adhesive.
With the configuration described above, the release sheet in the connecting end portion and the release sheet in the connected end portion can reliably be connected to each other. Thus, the disconnection between the first bonding sheet and the second bonding sheet that have been connected to each other can be suppressed during the supply of the sheet.
(4) In the sheet connection device of the present invention described above, it is preferred that the pair of adhesive rollers be capable of bringing the connecting end portion, into which the connected end portion has been inserted, into pressure-contact with the connected end portion by feeding the first bonding sheet and the second bonding sheet from the downstream side toward the upstream side in the supply direction.
With the configuration described above, the connecting end portion and the connected end portion can reliably be temporarily connected to each other. Specifically, the adhesive surface of the adhesive sheet in the connecting end portion of the first bonding sheet and the non-adhesive surface of the adhesive sheet in the connected end portion of the second bonding sheet can reliably be temporarily connected to each other. In this manner, even with a small connection margin, the connecting end portion and the connected end portion can be subjected to thermal welding under a state in which the connected end portion is reliably held in the connecting end portion.
(5) In the sheet connection device of the present invention described above, it is preferred that the cutting unit include: a cutter disposed on a side closer to the release sheet; and an attraction body provided on a side closer to the adhesive sheet so as to be opposed to the cutter, and that the attraction body be capable of attracting and holding the second bonding sheet in the width direction and have a cutter groove that is formed at a position opposed to the cutter so as to extend in the width direction.
With the configuration described above, the second bonding sheet can be cut in the width direction under a state in which the second bonding sheet is attracted and held by the attraction body. Thus, the connected end portion at an end of the second bonding sheet can be formed with high precision and connected to the connecting end portion with high precision. Thus, an effect of suppressing the disconnection between the connecting end portion and the connected end portion after the connection can be expected.
(6) In the sheet connection device of the present invention described above, it is preferred that the bonding sheet be a protecting sheet that protects a front surface of a semiconductor wafer, a dicing tape to be used for dicing the semiconductor wafer, or a dry film resist.
With the configuration described above, the sheet connection device suitable for the connection of a protecting sheet (also referred to as “protecting tape” or “back grinding (BG) tape) that protects a front surface of a semiconductor wafer, a dicing tape to be used for dicing of a semiconductor wafer, or a dry film resist can be provided.
(7) In the sheet connection device of the present invention described above, it is preferred that an irregular roller roll on a surface of the first bonding sheet so as to facilitate separation of the first bonding sheet into the adhesive sheet and the release sheet.
With the configuration described above, the adhesive sheet and the release sheet can more reliably be separated from each other.
(8) According to the present invention described above, there is provided a sheet connection method for connecting a first bonding sheet arranged on an upstream side in a supply direction and a second bonding sheet arranged on a downstream side in the supply direction with respect to the first bonding sheet to each other in the supply direction, the first bonding sheet and the second bonding sheet each being a bonding sheet including an adhesive sheet and a release sheet formed at least on an adhesive surface of the adhesive sheet in an overlapping manner, the sheet connection method including: a second bonding sheet cutting step of cutting the second bonding sheet in a width direction into two parts corresponding to a sheet roll-side part and a downstream-side part in the supply direction and forming a connected end portion at one end of the downstream-side part in the supply direction; a first bonding sheet supplying step of supplying the first bonding sheet from an upstream side of the second bonding sheet; a separated-portion forming step of forming a separated portion by feeding a connecting end portion of the first bonding sheet from the upstream side toward the downstream side in the supply direction while the connecting end portion is being held between a pair of adhesive rollers to separate the connecting end portion into the adhesive sheet and the release sheet; a sheet inserting step of inserting the connected end portion into the separated portion by feeding the second bonding sheet from the downstream side toward the upstream side in the supply direction; and a sheet connecting step of causing the pair of adhesive rollers to hold the connecting end portion and the connected end portion therebetween while feeding the first bonding sheet and the second bonding sheet from the downstream side toward the upstream side in the supply direction under a state in which the connected end portion is inserted in the separated portion.
With the sheet connection method described above, the second bonding sheet can be cut into two parts through the second bonding sheet cutting step to form the connected end portion at one end of the downstream-side part in the supply direction. Thus, an operator is not required to directly cut the second bonding sheet, and the connected end portion with high precision can be formed regardless of operator's skills. Further, with the sheet connection method described above, the separated portion can be formed at the connecting end portion of the first bonding sheet through the first bonding sheet supply step and the separated-portion forming step. Thus, the first bonding sheet can be supplied for the subsequent sheet connecting step through easy work of supplying the connecting end portion corresponding to a leading edge of the first bonding sheet between the pair of adhesive rollers.
Further, with the sheet connection method described above, the connected end portion of the second bonding sheet can be inserted into the separated portion formed at the connecting end portion of the first bonding sheet in the sheet inserting step. In this manner, the adhesive surface of the release sheet of the separated portion is bonded onto the non-adhesive surface of the release sheet in the connected end portion of the second bonding sheet. Specifically, the connecting end portion and the connected end portion are temporarily connected to each other. Further, with the sheet connection method described above, the connecting end portion and the connected end portion that have been temporarily connected to each other are held between the pair of adhesive rollers in the sheet connecting step. As a result, the connected end portion is reliably held in the connecting end portion. Further, for example, an additional bonding member for connection is not required to be prepared, and a connection margin can be set smaller. Thus, costs can be reduced. Accordingly, in the manner described above, the sheet connection method particularly suitable for the replacement of the bonding sheet can be provided.
(9) In the sheet connection method of the present invention described above, it is preferred that the sheet connection method further include, after the sheet connecting step, a thermocompression bonding step of thermocompression-bonding the connecting end portion and the connected end portion to each other with use of a joining unit arranged along a supply passage for the bonding sheet under a state in which the connecting end portion and the connected end portion are released from the adhesive rollers.
With the configuration described above, the connecting end portion and the connected end portion can reliably be connected to each other through thermocompression bonding. Thus, the disconnection between the first bonding sheet and the second bonding sheet that have been connected to each other can be suppressed during the supply of the sheet. Further, an additional bonding member for connection is not required to be prepared. Thus, an increase in costs can be suppressed.
(10) In the sheet connection method of the present invention described above, it is preferred that the sheet connection method further include, before the sheet connecting step, an adhesive application step of applying an adhesive with use of an adhesive application unit arranged along a supply passage for the bonding sheet.
With the configuration described above, the connecting end portion and the connected end portion can reliably be connected to each other with use of an adhesive. Thus, the disconnection between the first bonding sheet and the second bonding sheet that have been connected to each other can be suppressed during the supply of the sheet.
(11) According to the present invention described above, there is provided a sheet replacement system using the sheet connection device, the sheet replacement system being configured to replace a bonding sheet to be supplied to a supply destination by connecting an end portion of the first bonding sheet and an end portion of the second bonding sheet to each other.
With the configuration described above, for example, the second bonding sheet, which has been used up, can easily be replaced with the first bonding sheet, which is not used yet. More specifically, the sheet replacement system enables the connection between the end portion (connected end portion) corresponding to a trailing edge of the second bonding sheet, only a small amount of which remains because of use, and the end portion (connecting end portion) corresponding to a leading edge of the first bonding sheet, which is a new one. As a result, the bonding sheet can be replaced regardless of skills in replacement work. Thus, time required for the replacement of the bonding sheet can be significantly reduced, and costs can be cut.
(12) In the sheet replacement system of the present invention described above, it is preferred that the bonding sheet be a protecting sheet that protects a front surface of a semiconductor wafer, a dicing tape to be used for dicing the semiconductor wafer, or a dry film resist.
With the configuration described above, the sheet replacement system capable of replacing the bonding sheet having a large width such as the protecting sheet that protects the front surface of the semiconductor wafer, the dicing tape to be used for dicing of the semiconductor wafer, or the dry film resist without incurring high costs can be provided. Further, even when a tensile force is required to pull out the protecting sheet, an effect of suppressing the disconnection between the sheets that have been connected to each other after the replacement can be expected.
According to the present invention, the sheet connection device and the sheet connection method that enable reliable connection of a plurality of bonding sheets to each other can be provided. Further, according to the present invention, the sheet replacement system that enables replacement of one bonding sheet with another bonding sheet by connecting the one bonding sheet to the another bonding sheet can be provided.
A sheet connection device 1 according to an embodiment of the present invention is described in detail with reference to
As illustrated in
Further, the bonding sheet S is inserted into the sheet connection device 1. In the following description, one bonding sheet S, which is neither mounted in place nor used yet, is referred to as the first bonding sheet S1, and the bonding sheet S being currently used, which has already been inserted into the sheet connection device 1, is referred to as the second bonding sheet S2. In this embodiment, it is supposed that the first bonding sheet S1, which is a new one, is connected to the second bonding sheet S2. Further, the first bonding sheet S1 is disposed on an upstream side in a supply direction, and the second bonding sheet S2 is disposed on a downstream side with respect to the first bonding sheet S1.
The protecting sheet S corresponding to the bonding sheet S to be used in this embodiment is bonded, for example, so as to protect a circuit-pattern surface of the wafer W when back grinding is performed on the wafer W. The protecting sheet S includes, for example, an adhesive sheet SA and a release sheet SP. The adhesive sheet SA is to be bonded onto the circuit-pattern surface. The release sheet SP is formed on an adhesive layer A of the adhesive sheet SA in an overlapping manner. The adhesive sheet SA includes, for example, a base material such as an ethylene-vinyl acetate copolymer (EVA) or polyethylene terephthalate (PET) and the adhesive layer A laminated on the base material. Before the protecting sheet S is bonded, the release sheet SP is stripped off. An adhesive surface (adhesive layer A) of the adhesive sheet SA is bonded onto the wafer W. The protecting sheet S is bonded onto the circuit-pattern surface of the wafer W in the following manner. Specifically, the protecting sheet S is bonded after being cut into a shape of the wafer W in advance or is cut into a shape of the semiconductor wafer W after being bonded onto the semiconductor wafer W.
As illustrated in
As illustrated in
When the adhesive rollers 10, 10 are moved closer to each other, the adhesive rollers 10, 10 can hold the bonding sheet S that has been passed between the adhesive rollers 10, 10. When the adhesive rollers 10, 10 are rotated in the supply direction while holding the bonding sheet S therebetween, the bonding sheet S can be supplied and fed from the upstream side toward the downstream side. Further, when the adhesive rollers 10, 10 are rotated in a direction opposite to that described above, the bonding sheet S can be fed reversely from the downstream side toward the upstream side. Further, the adhesive rollers 10, 10 each have a surface made of an adhesive material. Each of the adhesive rollers 10, 10 may be formed by applying an adhesive onto its surface or by winding an adhesive sheet around its surface.
When the adhesive rollers 10, 10 feed the first bonding sheet S1 from the upstream side toward the downstream side while holding a connecting end portion SE1 of the first bonding sheet S1 (bonding sheet S) at its one end (see
The drive unit 60 supports a heater 21 and a cutter 31, which are described later. A support frame 6 (see
A rail 62 is laid on an upper end side (upstream side) of the drive unit 60 so as to face a surface on which the bonding sheet S is formed. Further, a rail 63 is laid on a lower end side (downstream side) of the drive unit 60 so as to be spaced apart from and in parallel to the rail 62.
The joining unit 20 is disposed on a downstream side of the adhesive rollers 10, 10 in the supply direction. The joining unit 20 includes the heater 21 and a backup 22. The heater 21 has a sharp distal end like a soldering iron. The backup 22 is provided so as to be opposed to the heater 21 across the bonding sheet S. The heater 21 can adjust a heating temperature by appropriate current control. Further, the heater 21 is supported by the drive unit 60 and is movably supported on the rail 62 through intermediation of a guide 23. In this manner, the heater 21 is permitted to be moved forward toward and backward from the surface on which the bonding sheet S is formed. The heater 21 is moved forward and backward by an appropriate drive source (not shown). The backup 22 is fixed to an appropriate support frame (not shown) and can support the bonding sheet S on its back side.
The heater 21 can be moved in a direction toward the backup 22 and in the width direction along the guide shaft 6A. In this manner, the connecting end portion SE1 of the first bonding sheet S1 and a connected end portion SE2 of the second bonding sheet S2 can be thermocompression-bonded in the width direction (see
The cutting unit 30 is disposed on a downstream side of the joining unit 20 in the supply direction. The cutting unit 30 is supported by the drive unit 60. The cutting unit 30 includes the cutter 31 and an attraction body 35. The cutter 31 is disposed on a side closer to the release sheet SP. The attraction body 35 is disposed on a side closer to the adhesive sheet SA so as to be opposed to the cutter 31.
The cutter 31 is movably supported on the rail 63 laid on the drive unit 60 through intermediation of a guide 32. In this manner, the cutter 31 is permitted to be moved forward toward and backward from the surface on which the bonding sheet S is formed. The cutter 31 is moved forward and backward by an appropriate drive source (not shown). Further, the cutter 31 can be moved toward the attraction body 35 and in the width direction along the guide shaft 6A. In this manner, the bonding sheet S can be cut in the width direction that intersects with the supply direction.
The attraction body 35 is provided so as to extend in the width direction of the bonding sheet S (see
Further, the attraction body 35 has a plurality of attraction holes 37 arranged in the width direction (see
The feed rollers 40, 40 are provided on the downstream side in the supply direction with respect to the joining unit 20 and the cutting unit 30. Further, the feed rollers 40, 40 can be moved closer to and away from each other with respect to the bonding sheet S arranged therebetween by an appropriate drive source (not shown). When the feed rollers 40, 40 are moved closer to each other, the bonding sheet S can be held therebetween. Further, when the feed rollers 40, 40 are rotated in the supply direction, the bonding sheet S held therebetween can be fed from the upstream side toward the downstream side. Further, when the feed rollers 40, 40 are rotated in a direction opposite to the supply direction, the bonding sheet S held therebetween can be fed from the downstream side toward the upstream side.
A configuration of the sheet connection device 1 according to the present invention has been described above. Next, the sheet connection method and a sheet replacement system in the sheet connection device 1 are described in detail with reference to
As illustrated in
As described above, in the second bonding sheet cutting step, the second bonding sheet S2 can be cut under a state in which the second bonding sheet S2 is attracted and held by the attraction body 35. Thus, the connected end portion SE2 can be formed at an end of the second bonding sheet S2 with high precision and connected to the connecting end portion SE1 with high precision in a sheet connecting step described later. Thus, an effect of suppressing the disconnection between the connecting end portion SE1 and the connected end portion SE2 after the connection can be expected. Further, an operator is not required to directly cut the second bonding sheet S2, and the connected end portion SE2 with high precision can be formed regardless of operator's skills.
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
Subsequently, as illustrated in
After that, as illustrated in
Subsequently, when the heater 21 is moved toward the backup 22, the connecting end portion SE1 and the connected end portion SE2 are subjected to thermocompression bonding (thermocompression bonding step). As a result, the release sheet SP1 in the connecting end portion SE1 and the release sheet SP2 in the connected end portion SE2 are thermally welded together. Further, the adhesive sheet SA1 in the connecting end portion SE1 is pressure-bonded onto a front surface of the adhesive sheet SA2 in the connected end portion SE2. The bonding between the adhesive sheet SA1 in the connecting end portion SE1 and the adhesive sheet SA2 in the connected end portion SE2 may be achieved through any one or both of thermal welding and adhesion with the adhesive layer A.
With the thermocompression bonding step carried out as described above, the connecting end portion SE1 and the connected end portion SE2 can reliably be connected to each other. Thus, disconnection between the first bonding sheet S1 and the second bonding sheet S2 that are connected to each other can be suppressed during the supply of the sheet. Further, an additional bonding member for connection is not required to be prepared. Thus, an increase in costs can be suppressed. Further, the connecting end portion SE1 and the connected end portion SE2 can be automatically connected to each other with high precision. Thus, waste of the sheet that may become useless due to waving of the sheet that occurs after the connection can be suppressed.
Subsequently, as illustrated in
As described above, the end portion (connecting end portion SE1) of the first bonding sheet S1 and the end portion (connected end portion SE2) of the second bonding sheet S2 are connected to each other by using the sheet connection device 1 according to the present invention. In this manner, a bonding-sheet replacement system that enables replacement of the bonding sheet S to be supplied to a supply destination can be provided.
With the bonding-sheet replacement system described above, for example, the second bonding sheet S2, which has been used up, can easily be replaced with the first bonding sheet S1, which is not used yet. More specifically, the sheet replacement system enables the connection between the end portion (connected end portion SE2) corresponding to a trailing edge of the second bonding sheet S2, only a small amount of which remains because of use, and the end portion (connecting end portion SE1) corresponding to a leading edge of the first bonding sheet S1, which is a new one. As a result, the bonding sheet S can be replaced regardless of skills in replacement work. Thus, time required for the replacement of the bonding sheet S can be significantly reduced, and costs can be cut. Thus, when the above-mentioned bonding-sheet replacement system is used for the protecting-sheet bonding device 2 for the semiconductor wafer W, production costs of the semiconductor wafer W can be expected to be reduced. Further, with the sheet connection device 1, the sheet connection method, and the bonding-sheet replacement system described above, even when the protecting sheet S (bonding sheet S) has a large width as in a case of a protecting sheet used for the semiconductor wafer W and thus requires a tensile force when the sheet is pulled out, an effect of suppressing the disconnection between the sheets that are connected to each other after the replacement can be expected. Thus, the sheet connection device 1, the sheet connection method, and the sheet replacement system according to the present invention can preferably be used for various kinds of bonding devices for, for example, the protecting sheet S, a dicing tape, and a dry film resist, which are to be bonded onto the semiconductor wafer W. At the separated portion 50 illustrated in
A modification example of the sheet connection device 1 in which the separation trigger mechanism 70 is mounted is now described in detail. A description of the same components as those described in the embodiment is omitted. It should be noted that members similar to those in the embodiment described above are denoted by the same reference symbols. Further, it should be noted that illustrations are simplified and some members are omitted in
As illustrated in
In this modification example, the irregular roller 71 has, for example, a plurality of protrusions (for example, needles) formed on its surface (hereinafter the irregular roller 71 is also referred to as “porcupine roller 71”). The irregular roller 71 is supported rotatably on the support portion 72. When the support portion 72 is driven, the irregular roller 71 can be brought into abutment against a surface of the release sheet SP1 of the first bonding sheet S1.
The support portion 72 supports the irregular roller 71 rotatably. Further, an appropriate drive source (not shown) is connected to the support portion 72, allowing the support portion 72 to be moved in the width direction of the sheet S and in the up-and-down direction.
The separation trigger has the configuration described above. Next, details of formation of a separation trigger in the first bonding sheet S1 with use of the separation trigger mechanism 70 are described.
As illustrated in
Subsequently, as illustrated in
There has been described the embodiment of the sheet connection method and the sheet replacement system that use the sheet connection device 1 according to the present invention. The sheet connection device 1, the sheet connection method, and the sheet replacement system according to the present invention are not limited to those described in the embodiment, and various modifications are possible.
In this embodiment, the joining unit 20 achieves the connection by welding with heating. However, the connection achieved by the joining unit 20 is not limited to that described above. A welding agent may be further used, or the connection may be achieved through adhesion using, for example, a glue or an adhesive. When the adhesive is applied, it is preferred that an adhesive application step of applying an adhesive with use of an adhesive application unit (not shown) that is arranged along the supply passage for the bonding sheet S be carried out before the sheet connecting step. A welding agent or a glue may be used in place of the adhesive depending on a material of the release sheet SP. Further, the adhesive may be applied to any of the connecting end portion SE1 and the connected end portion SE2. It is preferred that a position of the adhesive application unit be determined in accordance with where the adhesive is applied.
In this embodiment, the bonding sheet S including the release sheet SP on one side is used. However, the bonding sheet S is not limited to that described above. Bonding sheets having various kinds of layer structures can be used. Various forms of bonding sheets S, for example, the bonding sheet S including the release sheets SP on both of a front side and a back side and the bonding sheet S including the adhesive layers A formed on both sides of the adhesive sheet SA can be used. Further, not only the bonding sheet S having two layers (the adhesive sheet SA and the release sheet SP) as that used in this embodiment but also the bonding sheet S having a structure including two or more layers may be used. Further, in this embodiment, the protecting sheet S to be used for the semiconductor wafer W has been described as an example of the bonding sheet S. However, not only the protecting sheet S but also various other kinds of bonding sheets S, including, for example, a dicing tape and a dry film resist, can be used. Further, not only the bonding sheet S having a large width but also the bonding sheet S having various widths can be used. Further, in this embodiment, the connection between the second bonding sheet S2 and the first bonding sheet S1 has been exemplified. However, the connection can also be used, for example, when the bonding sheet S is ripped and separated during the supply of the sheet and two separated pieces of paper are connected to each other to obtain the single bonding sheet S again.
In this embodiment, the adhesive roller 10 having a surface made of a material having adhesiveness has been exemplified. However, various forms of adhesive rollers 10, including an adhesive roller made of a material itself having adhesiveness and an adhesive roller with an adhesive sheet wound around its surface, can be used. It is preferred that adhesiveness of the adhesive roller 10 be appropriately changed in accordance with the material of the bonding sheet S. Further, various adhesive rollers can be used as the pair of adhesive rollers 10, 10 in accordance with the material of the bonding sheet S. For example, the adhesive rollers 10, 10 having the same adhesiveness or different adhesiveness can be used. Further, an additional mechanism may be provided in addition to or in place of the adhesive rollers 10 so as to form the separated portion 50.
In this embodiment, the adhesive rollers 10, the joining unit 20, the cutting unit 30, and the feed rollers 40 are arranged in the stated order from the upstream side toward the downstream side in the supply direction. However, the arrangement can be appropriately changed in accordance with a feed direction for the bonding sheet S. Further, in this embodiment, the heater 21 having a sharp distal end like a soldering iron has been exemplified as the joining unit 20. However, various kinds of joining units 20 can be used as long as the connecting end portion SE1 and the connected end portion SE2 are thermally welded together through heating. For example, not only heating means that performs spot-like heating like a soldering iron but also heating means having various shapes and sizes, such as a heater formed so as to extend entirely in the width direction of the bonding sheet S and a heater having irregularity arranged in the width direction, can be used. It is preferred that the heating temperature of the joining unit 20 be appropriately changed in accordance with the material of the bonding sheet S.
Further, in this embodiment, the connecting end portion SE1 and the connected end portion SE2 are thermally welded together entirely in the width direction of the bonding sheet S. However, the thermal welding is not required to be performed entirely in the width direction and may be performed partially. For example, spot-like thermal welding may be performed. In such a case, it is desirable that the connecting end portion SE1 and the connected end portion SE2 be thermally welded together at a plurality of positions set in the width direction of the bonding sheet S.
Further, in this embodiment, the cutting unit 30 includes the cutter 31, and the cutter 31 is moved in the width direction of the bonding sheet S to thereby cut the bonding sheet S. A shape and a size of the cutter 31 may be appropriately changed. For example, the cutter 31 may be formed so as to extend entirely in the width direction the bonding sheet S. In such a case, when the cutter 31 is pressed against the bonding sheet S, the bonding sheet S can be cut.
Further, a size of or a degree of separation in the separated portion 50 to be formed can be appropriately changed in accordance with, for example, a thickness of the bonding sheet S (including thicknesses of the adhesive sheet SA and the release sheet SP) or the material of the bonding sheet S.
In this embodiment, the first bonding sheet S1 and the second bonding sheet S2 are fed from the downstream side toward the upstream side in the supply direction to bring the connecting end portion SE1, into which the connected end portion SE2 has been inserted, into pressure-contact with the connected end portion SE2. However, when the connected end portion SE2 can be held in the connecting end portion SE1, the pressure-contact process may be omitted.
In this embodiment, the cutting unit 30 includes the attraction body 35 that is provided so as to be opposed to the cutter 31. However, a cutter table that does not contribute to attraction may be used in place of the attraction body 35. Further, not only the attraction body 35 using attraction through the attraction holes 37 but also various kinds of means such as means having a surface with light adhesiveness and means having given adhesion strength achieved when, for example, being brought into close contact can be used. Further, in this embodiment, the attraction body 35 has the cutter groove 36. A shape of the cutter groove 36 or whether or not the cutter groove 36 is formed can be appropriately changed in accordance with cutting means to be used.
In this embodiment, in the second bonding sheet cutting step, the second bonding sheet S2 is cut in the width direction to form the connected end portion SE2 at one end on the downstream side in the supply direction. However, when the second bonding sheet S2 is divided into two parts in advance, the second bonding sheet cutting step is preferably omitted. Further, various kinds of means, such as automatic or manual means, can be used in the sheet inserting step as long as the second bonding sheet S2 can be fed into the separated portion 50 from the downstream side toward the upstream side in the supply direction.
The sheet connection device, the sheet connection method, and the sheet replacement system according to the present invention have been described above using an embodiment and a modification example. However, the present invention is not limited to the embodiment or the modification example described above, and it is easily understood for those skilled in the art that other embodiments may be provided from the teaching and spirit of the present invention without departing from the scope of claims.
The sheet connection device, the sheet connection method, and the sheet replacement system according to the present invention can be used for connection of various kinds of bonding sheets including, for example, an adhesive sheet. Further, the sheet connection device, the sheet connection method, and the sheet replacement system according to the present invention can preferably be used for connection of various bonding sheets such as a protecting sheet, a dicing tape, and a dry film resist, which are to be bonded onto a semiconductor wafer.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2021-130341 | Aug 2021 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2022/029904 | 8/4/2022 | WO |
