Computing devices can be used to execute various applications and programs. A processor is deployed in a computing device to execute the applications and programs. The computing device can have additional components and modules (e.g., memory modules, wireless radios, graphical processors, and the like) that help with the execution of various tasks and/or applications.
The modules can emit radio frequency (RF) signals during operation. As the power of certain modules improves, the modules can emit more RF noise.
Examples described herein provide a shield enclosure for memory modules. As discussed above, computing devices can be used to execute various applications and programs. A computing device can have additional components and modules, such as memory modules or wireless communication radios. However, as these components and modules improve, the components can consume more power or generate higher frequency signals/noise. The proximity of these components and the improved power and signal strength, which correlates to greater RF noise, can cause operation of one component to interfere with operation of other components within the computing device.
For example, as memory modules (e.g., random access memory) improve over time, the memory modules can emit higher radio frequency noise that can interfere with operation of other modules, such as the WiFi radio.
Previous solutions have attempted to create individual metal enclosures around each module. However, attempting to attach individual enclosures around each memory module can be cumbersome. The individual enclosures can also create unwanted side effects (e.g., the RF noise can be amplified through the metal piece enclosure as an antenna). In addition, metal can be difficult to shape and may not perform well as a shielding enclosure.
The present disclosure provides a shield enclosure that can enclose multiple memory modules with a single enclosure. The shield enclosure of the present disclosure uses a polymer frame that can be easily molded into a desired shape that is covered with an absorber. The polymer frame can also prevent the antenna side effect described above.
Additional absorbers can be included as dividers inside of the enclosure. The dividers provide additional surface area that can act to block the RF signals generated by the memory modules. The shield enclosure of the present disclosure can be connected to the existing memory module connections without modification to the mother board or printed circuit board.
It should be noted that the computing device 100 has been simplified for ease of explanation. Although various example components are illustrated in
In an example, the computing device 100 may include a printed circuit board (PCB) 102, a wireless communication radio 104, and memory modules 1081 to 108n (hereinafter referred to individually as a memory module 108 or collectively as memory modules 108) connected to a memory module connection interface 106.
In an example, the wireless communication radio 104 may be a Wi-Fi radio. For example, the wireless communication radio 104 may be a Wi-Fi6 or Wi-Fi6e radio that can transmit and receive RF signals.
In an example, the memory modules 108 may be random access memory (RAM) modules. The memory modules 108 may be inserted into a respective memory module slot of the memory module connection interface 106. In an example, the memory modules 108 may be a double data rate 5 (DDR5) RAM.
As noted above, during operation, the memory modules 108 may generate RF noise. The RF noise may interfere with the operation of the wireless communication radio 104. For example, the RF noise generated by the memory modules 108 may cause the RF communication signals transmitted or received by the wireless communication radio 104 experience loss or delay.
Previous solutions may have tried to individually shield each memory module 108. However installing a shield around each memory module 108 individually may be cumbersome and inefficient. In addition, the shield may cause modifications to be made to the PCB 102 to install the individual shields around each memory module 108.
The present disclosure provides a single shielding enclosure 110. The shielding enclosure 110 may include an interior volume 114 that may enclose the memory modules 108 as a group. In other words, the shielding enclosure 110 may have dimensions that allow the shielding enclosure 110 to enclose all of the memory modules 108 or whatever maximum number of memory modules 108 that can be accommodated by the memory module connection interface 106.
In addition, the shielding enclosure 110 may be installed using the existing memory module connection interface 106. In other words, no modifications to the PCB 102 need to be made to install the shielding enclosure 110. For example, the shielding enclosure 110 may include a connection interface that can connect to slot latches of the memory module connection interface 106, as discussed in further details below and shown in
In an example, the absorber 204 may be applied to coat an interior surface (e.g., a side that faces the interior volume 114) of the polymer based enclosure 202. The absorber 204 may be any type of material that can absorb RF signals or electromagnetic signals.
The absorber 204 may be a magnet absorber or a foam absorber. A magnetic absorber may be a polymeric material that is filled with magnetic particles. The magnetic absorber may provide high permeability and high permittivity, which are both effective in eliminating high-frequency electromagnetic interference. The magnetic absorber may be applied in layers that are 0.1 millimeters (mm) to 3 mm.
A foam absorber may be based on open-celled foam impregnated with a carbon coating. The foam absorber may provide a product that is lossy at microwave frequencies and acts as a free space resistor to incoming electromagnetic energy. The foam absorber may be applied in layers that are 3.2 mm to 6.4 mm.
In an example, the absorber 204 may be applied with an adhesive. The absorber 204 may cover most of the surface area (e.g., 95% or greater) of the interior surface of the polymer based enclosure 202.
In an example, the polymer based enclosure 202 may include tabs 208 that can be inserted into corresponding openings 210. The tabs 208 may have a shape that can be inserted into the openings 210 to lock the tabs 208 into position when the polymer based enclosure 202 is assembled or folded into its final shape.
In an example, the polymer based enclosure 202 may include a connection interface, as discussed above. The connection interface may include tabs 212. The tabs 212 may have a line or a pre-cut crease that allows the tabs 212 to be slightly folded or bent. The tabs 212 may interact with the slot latch of the memory module connection interface 106, as discussed in further details below.
The tabs 212 may have a generally rectangular shape. However, it should be noted that the tabs 212 may have any shape including, for example, a square, a semicircle, a polygon, and the like.
In an example, the polymer based enclosure 202 may include two tabs 212 on each end 220 and 222 of the polymer based enclosure. The tabs 212 may be on opposing sides of each end 220 and 222.
In an example, the shielding enclosure 110 may include a plurality of openings 2061 to 206m (hereinafter referred to individually as an opening 206 or collectively as openings 206). The openings 206 may be formed in the polymer based enclosure 202 and the absorber 204, such that the openings are aligned when the absorber 204 is applied to the polymer based enclosure 202.
The openings 206 may provide a vent. The vent may help dissipate heat away from the memory modules 108 to prevent overheating or operational failure of the memory modules 108. However, the openings 206 may cause the shielding enclosure 110 to have a poorer performance of RF noise blocking.
As a result, the openings 206 may be optional. In other words, some examples of the shielding enclosure 110 may include no openings 206 or no vent. When the shielding enclosure 110 has no openings 206, other cooling mechanisms may be deployed to cool the memory modules 108. For example, cooling tubes/coils, heat sinks, mechanical fans, and the like may be deployed to control heat dissipations in the interior volume 114 of the shielding enclosure 110. In another example, the number of openings 206 may be tuned to provide acceptable RF noise blocking performance and acceptable venting to dissipate heat away from the memory modules 108.
To remove the shielding enclosure 110, the tab 212 may be pulled away from the slot latch 302. The tab 212 may be pulled with enough force to pull the end 214 past a point where the end 214 contacts the surface 304. Thus, the shielding enclosure 110 may be installed onto the slot latches 302 of the existing memory module connection interface 106 without modifications to the PCB 102 to accommodate a new connection mechanism.
In an example, the dividers 7021 and 7022 may be installed on an interior side of the interior volume 114 of the shielding enclosure 110. The dividers 7021 and 7022 may have a length that spans from a first end 220 to the second end 222 of the shielding enclosure 110.
In an example, the dividers 7021 and 7022 may have a Mylar body covered by the absorber 204. For example, the dividers 7021 and 7022 may be entirely coated by the absorber 204. The dividers 7021 and 7022 may increase the surface area of the absorber 204 inside of the shielding enclosure 110. Thus, the dividers 7021 and 7022 may help to increase the amount of RF noise blocking provided by the shielding enclosure 110.
In an example, the dividers 7021 to 702n-1 may be installed on an interior side of the interior volume 114 of the shielding enclosure 110. The dividers 7021 to 702n-1 may have a length that spans from a first end 220 to the second end 222 of the shielding enclosure 110.
In an example, the dividers 7021 to 702n-1 may have a Mylar body covered by the absorber 204. For example, the dividers 7021 to 702n-1 may be entirely coated by the absorber 204. The dividers 7021 to 702n-1 may increase the surface area of the absorber 204 inside of the shielding enclosure 110. Thus, the dividers 702 may help to increase the amount of RF noise blocking provided by the shielding enclosure 110.
In an example, the number of dividers 7021 to 702n-1 may be one fewer than a total number of memory modules 1081 to 108n. In other words, the shielding enclosure 110 illustrated in
The performances of various configurations of shielding enclosures were tested. The configurations included: (1) a vented shielding enclosure without dividers, (2) a vented shielding enclosure with dividers, (3) a shielding enclosure with two dividers without vents (e.g., the example shielding enclosure 110 illustrated in
The testing showed that the shielding enclosure without vents (configuration 3) performed better than the shielding enclosures with vents. In addition, the testing showed that the number of dividers also affected RF noise blocking performance (e.g., the shielding enclosure with three dividers (configuration 4) performed worse than the shielding enclosure with two dividers (configuration 2)).
Overall, the various configurations (1)-(4) limited RF noise to less than −90 dBm across many of the channel frequencies between 5925 MHz to 6245 MHz. However, it was found that the configuration of the shielding enclosure without vents and with two dividers (configuration 3) (e.g., the example shown in
Thus, various parameters may be tuned to achieve a desired level of RF noise blocking, while maintain sufficient venting. For example, the shielding enclosure may have partial venting (e.g., openings 206 on one side of the polymer based enclosure 202) with fewer dividers 702 to balance heat dissipation against RF noise blocking. Thus, the shielding enclosure 110 with three dividers 702 with no venting illustrated in
Thus, the present disclosure provides a shielding enclosure that can enclose all of the memory modules of a computing device with a single enclosure. The shielding enclosure can provide sufficient RF noise blocking performance. In addition, the shielding enclosure of the present disclosure can include a connection interface that can connect to an existing memory module connection interface without modifying the PCB.
It will be appreciated that variants of the above-disclosed and other features and functions, or alternatives thereof, may be combined into many other different systems or applications. Various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.